Abstract: Provided is a liquid crystal handwriting board. The liquid crystal handwriting board includes: a liquid crystal panel, a photosensitive assembly, and a control assembly; wherein the liquid crystal panel includes a first substrate and a second substrate that are opposite; the photosensitive assembly includes a plurality of photosensitive elements; and the control assembly is electrically connected to the liquid crystal panel and the photosensitive assembly, and is configured to determine position information of a pixel region for erasure by detecting position information of target light irradiated to the liquid crystal panel by the photosensitive assembly and supply a pixel voltage to the plurality of pixel electrodes in the pixel region for erasure, such that a voltage difference is present between the plurality of pixel electrodes in the pixel region for erasure and the common electrode.

Abstract: An array substrate includes a first substrate; and a first electrode and a second electrode disposed on the first substrate and located in a sub-pixel region. At least one of the first electrode and the second electrode includes a plurality of electrode strips. Every two adjacent electrode strips in the first electrode and the second electrode have a slit therebetween. The slit includes a first end portion, a straight portion, and a second end portion connected in sequence. A bend is formed at a connection position of the first end portion and the straight portion, and the second end portion is formed by protruding from the straight portion. The straight portion includes a first edge and a second edge parallel to each other, and an average width of the first end portion in a direction perpendicular to the first edge is less than a width of the straight portion.

Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.