Abstract: A system is proposed for continuously monitoring the integrity of a transmission fiber coupled to a laser source and immediately shutting down the laser source upon recognition of any type of cut, break or disconnect along the transmission fiber. A pair of monitoring photodiodes is included with the laser source and used to look at the ratio of reflected light to transmitted light, shutting down the laser if the ratio exceeds a given threshold. If a break is present, the power of the reflected light will be higher than normal, where a defined threshold is used to determine of the calculated intensity is indicative of a break. By using measurements performed in terms of decibels, the monitoring system needs only to take the difference in intensities to generate the reflection/transmission ratio output.

Abstract: Methods of forming joinery between components formed from dissimilar materials, and assemblies utilizing the joinery. The components include interface surfaces having complementary peaks and valleys that interlock. A compliant interface is formed between the interface surfaces and the interface can be configured to provide functionality.

Abstract: A method includes at least partially submerging a substrate in a colloidal mixture of nanocrystals and a first solvent. The nanocrystals have first ligands coupled thereto. The method also includes applying an electric field to the colloidal mixture to form a solvated nanocrystal film and removing the solvated nanocrystal film from the first solvent. The method further includes applying a second solvent to the solvated nanocrystal film for ligand exchange. The second solvent comprises second ligands. A nanocrystal film product formed by one-step ligand exchange includes at least one dimension greater than 100 nm and ordered nanocrystals characterized as having a domain size of greater than 100 nm.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: An embodiment includes an optical transmitter. An optical transmitter may include a primary laser for transmitting a primary optical signal and a backup laser for transmitting a backup optical signal. The optical transmitter may further include a photonic integrated circuit (PIC). The PIC may include at least one input port configured to receive the primary optical signal from the primary laser and the backup optical signal from the backup laser. The PIC may also include at least one output port configured to receive each of the primary optical signal and the backup optical signal. The optical transmitter may be configured to activate the backup laser upon determining that the primary laser has failed or is failing.

Abstract: In an example embodiment, a method includes receiving a first combined optical signal at an edge filter. The method further includes redirecting, at the edge filter, a second combined optical signal toward a first zigzag demultiplexer; and passing a third combined optical signal through the edge filter toward a light redirector based on wavelength. The method further includes redirecting the third combined optical signal toward a second zigzag demultiplexer. The method may further includes separating, at the first zigzag demultiplexer, the second combined optical signal into a first optical signal on a first optical path and a second optical signal on a second optical path based on wavelength. The method further includes separating, at the second zigzag demultiplexer, the third combined optical signal into a third optical signal on a third optical path and a fourth optical signal on a fourth optical path based on wavelengths.

Abstract: In an example embodiment, a method includes receiving a first combined optical signal at an edge filter. The method further includes redirecting, at the edge filter, a second combined optical signal toward a first zigzag demultiplexer; and passing a third combined optical signal through the edge filter toward a light redirector based on wavelength. The method further includes redirecting the third combined optical signal toward a second zigzag demultiplexer. The method may further includes separating, at the first zigzag demultiplexer, the second combined optical signal into a first optical signal on a first optical path and a second optical signal on a second optical path based on wavelength. The method further includes separating, at the second zigzag demultiplexer, the third combined optical signal into a third optical signal on a third optical path and a fourth optical signal on a fourth optical path based on wavelengths.

Abstract: An embodiment includes an optical transmitter. An optical transmitter may include a primary laser for transmitting a primary optical signal and a backup laser for transmitting a backup optical signal. The optical transmitter may further include a photonic integrated circuit (PIC). The PIC may include at least one input port configured to receive the primary optical signal from the primary laser and the backup optical signal from the backup laser. The PIC may also include at least one output port configured to receive each of the primary optical signal and the backup optical signal. The optical transmitter may be configured to activate the backup laser upon determining that the primary laser has failed or is failing.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: The present invention provides a heat dissipation system for use with a liquid crystal television and a liquid crystal television. The heat dissipation system for use with a liquid crystal television is structured such that a heat spreader (4) having high thermal conductivity is adhesively mounted to a shaped heat-dissipating member (1) and is operated in combination with heat-dissipating fins (5) and fans (6), wherein the heat spreader (4) functions as a core heat transfer medium in the entire heat dissipation system to help greatly reduce a temperature gradient and to remove heat from an LED light bar (2) in a quick, massive, and efficient manner so as to prevent the LED light bar (2) from burning down or shortening of service life due to excessive high temperature. Further, due to the arrangement of the heat spreader (4), the size of the shaped heat-dissipating member (1) can be reduced thereby helping thinning of the liquid crystal television.

Abstract: An optical assembly includes a first grating device configured to: receive a light beam that includes an optical signal with a particular wavelength from a fiber; and change a propagation direction of the optical signal according to the particular wavelength of the optical signal. The optical assembly also includes a second grating device configured to: receive the optical signal outputted from the first grating device; change the propagation direction of the optical signal according to the particular wavelength of the optical signal; and direct the optical signal onto a grating coupler. The first grating device and the second grating device are configured to satisfy a plurality of configuration constraints.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: Disclosed is a new method for preparing an azetidinone compound represented by formula (I). The carboxylic ketoester represented by formula (II) serves as the raw material and is subjected to Grignard addition, stereoselective dehydration, ester group reduction, hydroxyl group protection, addition with imine after condensation with a chiral auxiliary, cyclization and deprotection to obtain the compound represented by formula (I). The present invention has advantages of easily available raw material, a few synthetic steps, simple operation, high yield, good stereoselectivity and low cost, and can be used for industrial production.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: An optical assembly includes a first grating device configured to: receive a light beam that includes an optical signal with a particular wavelength from a fiber; and change a propagation direction of the optical signal according to the particular wavelength of the optical signal. The optical assembly also includes a second grating device configured to: receive the optical signal outputted from the first grating device; change the propagation direction of the optical signal according to the particular wavelength of the optical signal; and direct the optical signal onto a grating coupler. The first grating device and the second grating device are configured to satisfy a plurality of configuration constraints.

Abstract: A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: An optical assembly includes a first grating device configured to: receive a light beam that includes an optical signal with a particular wavelength from a fiber; and change a propagation direction of the optical signal according to the particular wavelength of the optical signal. The optical assembly also includes a second grating device configured to: receive the optical signal outputted from the first grating device; change the propagation direction of the optical signal according to the particular wavelength of the optical signal; and direct the optical signal onto a grating coupler. The first grating device and the second grating device are configured to satisfy a plurality of configuration constraints.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.