Patents by Inventor Xiaoling Kang

Xiaoling Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DOUBLE STITCH WIREBONDS
    Publication number: 20240113065
    Abstract: In some examples, a semiconductor package comprises an electrically conductive surface and a bond wire coupled to the electrically conductive surface. The bond wire includes a first stitch bond coupled to the electrically conductive surface, and a second stitch bond contiguous with the first stitch bond and coupled to the electrically conductive surface. The second stitch bond is partially, but not completely, overlapping with the first stitch bond.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Xiaolin KANG, Ziqi WANG, Huoyun DUAN, Peng PENG, Ye ZHUANG, Xiaoling KANG, Hongxia DENG
  • Antimicrobial reinforced floor and method for preparing same
    Patent number: 11939501
    Abstract: Disclosed herein are an antimicrobial reinforced floor and a method for preparing the same. In the method, a substrate and an impregnated paper impregnated with an inorganic antimicrobial agent and an organic antimicrobial agent are subjected to hot press forming to produce the antimicrobial reinforced floor.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: March 26, 2024
    Assignee: CHANGZHOU BEMATE HOME TECHNOLOGY CO., LTD.
    Inventors: Xiaoling Zhang, Zhiyuan Xiao, Yanhui Li, Min Kang, Junxiang Dong
  • LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
    Publication number: 20230275060
    Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of leads including a first lead, wherein the first lead includes a first ball bond. A semiconductor die having a plurality of bond pads including a first bond pad is on the die pad including a second ball bond on the first bond pad and a stitch bond on the second ball bond. A first wirebond connection is between the first ball bond and the stitch bond.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 31, 2023
    Inventors: Xiaoling Kang, Xi Lin Li, Zi Qi Wang, Huo Yun Duan, Xiao Lin Kang