Abstract: A production method of a wafer includes a wafer production step in which ultrasonic water is ejected against an end face of an ingot with cleavage layers created therein, thereby severing the wafer from a rest of the ingot to produce the wafer.

Abstract: An ultrasonic water jet apparatus includes a water accumulation part in which the water supplied from a water supply source is temporarily accumulated, a jet port that jets the water accumulated in the water accumulation part, and a piezoelectric vibration plate including a dome part that is disposed opposed to the jet port in the water accumulation part and propagates the ultrasonic vibration to the water accumulated in the water accumulation part, a flange part that projects outward in the radial direction from a peripheral edge of the dome part, and an annular plate that projects outward in the radial direction from a peripheral edge of the flange part.

Abstract: A deburring unit removes burrs from a workpiece, the burrs being formed along kerfs cut by a cutting blade. The deburring unit includes a chuck table that holds the workpiece on a holding surface, an ultrasonic horn that emits ultrasonic waves from a lower surface, the lower surface facing an upper surface of the workpiece, a water film forming nozzle configured to form a water film such that the upper surface of the workpiece is covered in its entirety with the water film, and a controller. The controller is configured to cause the ultrasonic horn to come into contact at its lower surface with the water film formed by supply of water from the water film forming nozzle, such that ultrasonic vibrations propagate to the water film and remove the burrs formed in the kerfs of the workpiece.

Abstract: A method of manufacturing a grinding wheel includes a surface unevenness forming step of applying ultrasonic vibrations from an ultrasonic vibration applying unit through water to an annular slot defined in a surface of an annular base along circumferential directions thereof, thereby forming surface unevennesses on either one or both of a side surface and a bottom surface of the annular slot, and, after the surface unevenness forming step, a grindstone fixing step of fixing a plurality of grindstones to the annular slot with an adhesive.

Abstract: A gettering layer forming device includes a spinner table having a surface for holding a face side of a wafer, and an annular rest surface disposed radially outwardly of the holding surface. An annular member is located on the rest surface surrounding the wafer such that a water bath is defined by the annular member and the wafer. A moving mechanism selectively places the annular member onto the rest surface and moves the annular member away from the rest surface, an abrasive grain nozzle charges free abrasive grains into the water bath, a water nozzle supplies water to the water bath to immerse the wafer in the water, an ultrasonic horn propagates ultrasonic vibrations to the free abrasive grains in the water, and a horizontally moving mechanism moves the ultrasonic horn and the holding table horizontally relative to each other in directions parallel to the holding surface.

Abstract: An ultrasonically activated water ejector includes a cylindrical water reservoir section configured to temporarily hold water, an ejection nozzle that ejects the water from a lower part of the water reservoir section, a dome-shaped ultrasonic vibration plate disposed in an upper part of the water reservoir section, facing the ejection nozzle, and having a concave spherical surface on a lower side thereof, and a water supply portion having a supply inlet configured to supply the water along the concave spherical surface into the water reservoir section from an outer periphery toward a center of the ultrasonic vibration plate. The water is supplied from the supply inlet to the water reservoir section in an amount greater than the water to be ejected from the ejection nozzle. The water flows along the concave spherical surface from the outer periphery toward the center, and is held in the water reservoir section.

Abstract: A severing machine includes an ingot holding unit configured to hold an SiC ingot with a wafer, which is to be produced, facing up, an ultrasonic generation unit disposed so as to face the SiC ingot held on the ingot holding unit, and configured to generate ultrasonic vibrations, and a liquid supply unit configured to supply liquid between the wafer to be produced and the ultrasonic generation unit. The ultrasonic generation unit includes an ultrasonic transducer, and a case member having a bottom surface formed to have an area equal to or greater than an area to which the ultrasonic vibrations are desired to be applied.

Abstract: Disclosed are a method for controlling a sound box, a sound box and a non-transitory computer readable storage medium. The method is applied to the sound box in a sound box system. The sound box system includes at least two sound boxes, each sound box includes at least two first sensors, the at least two first sensors are provided on opposite sides of the sound box, each first sensor is configured to transmit and receive preset signals, and the method includes following operations: obtaining, by the sound box, a connection status with other sound boxes; when the sound box is wirelessly connected to the other sound boxes, obtaining first sensing data detected by a first sensor; determining target channel information according to the first sensing data; and outputting audio according to the target channel information.

Abstract: A production method of a wafer includes a wafer production step in which ultrasonic water is ejected against an end face of an ingot with cleavage layers created therein, thereby severing the wafer from a rest of the ingot to produce the wafer.

Abstract: Reversible phase-change materials (PCMs) can be added to or incorporated into meta-lenses, wave plates, waveguides, gratings, and other optical components to form active optical devices with controllable and adjustable optical characteristics. Local heating can be used to induce solid-state phase changes and large refractive index changes in the PCMs. The phase and index changes can provide large changes in the device's optical characteristics. Optical devices with PCM can be used for imaging applications, orbital angular momentum control, photonic integrated circuits and optical communication systems, beam steering, and other application.

Abstract: An ultrasonic water jet apparatus includes a water accumulation part in which the water supplied from a water supply source is temporarily accumulated, a jet port that jets the water accumulated in the water accumulation part, and a piezoelectric vibration plate including a dome part that is disposed opposed to the jet port in the water accumulation part and propagates the ultrasonic vibration to the water accumulated in the water accumulation part, a flange part that projects outward in the radial direction from a peripheral edge of the dome part, and an annular plate that projects outward in the radial direction from a peripheral edge of the flange part.

Abstract: A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.

Abstract: A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.

Abstract: A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.

Abstract: A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.

Abstract: The invention relates to a non-stick cooking utensil, wherein protrusions are arranged on interior wall of the utensil to form a non-smooth surface, said protrusion has a height of 20-999 ?m and a projection area of 314-783431 ?m2 with respect to the interior surface of the utensil, the protrusions are so distributed that the total projection area of protrusions on the surface of the interior wall is about 10%-60% of the surface area, a coating film is formed on said non-smooth surface with protrusions. As compared with utensils with smooth surface, the sticking intensity and stickiness between foods and the utensil of present invention may be decreased by 60%-80%.

Abstract: A cutting apparatus including a chuck table for holding a workpiece, a cutting unit having a cutting blade for cutting the workpiece held on the chuck table, a cutting water supplying unit for supplying a cutting water to a work portion to be cut by the cutting blade, a pair of vibrating plates provided on the opposite sides of the cutting blade in such a manner that a spacing for forming a cutting water layer is defined between the upper surface of the workpiece held on the chuck table and the lower surface of each vibrating plate, and an ultrasonic vibrator for giving ultrasonic vibration to the vibrating plates.

Abstract: The invention relates to a non-stick cooking utensil, wherein protrusions are arranged on interior wall of the utensil to form a non-smooth surface, said protrusion has a height of 20-999 ?m and a projection area of 314-783431 ?m2 with respect to the interior surface of the utensil, the protrusions are so distributed that the total projection area of protrusions on the surface of the interior wall is about 10%-60% of the surface area, a coating film is formed on said non-smooth surface with protrusions. As compared with utensils with smooth surface, the sticking intensity and stickiness between foods and the utensil of present invention may be decreased by 60%-80%.

Abstract: The invention relates to the design and manufacturing technique of mechanical component which is prone to be worn in relative movement. More particularly, it relates to a method of improving the wear resistance performance of the surface of mechanical component. In this method, a bionic non-smooth morphology is formed on the frictional surface of the mechanical component. That is, a plurality of convex units shaped as crown, dimple, scale, mesh, stripe and so on are distributed on the surface. These units are 0.01-2 mm higher than the base surface. The distributed density (S) of the units, i.e., the ratio of the geometrical area of the convex units projected on the surface of the base with respect to the whole surface area of the base, is 10-40%. The hardness difference between the units and the base is HB0-200. It breaks through the conventional concept and provides a more rational and effective way to improve the wear resistance performance of mechanical component.

Abstract: A cleaning apparatus includes a nozzle having an ejection port, a cleaning liquid path communicating with the ejection port, and a compressed gas path communicating with the ejection port. The cleaning apparatus further includes a cleaning liquid feeding component for feeding a cleaning liquid to the cleaning liquid path, and a compressed gas feeding component for feeding a compressed gas to the compressed gas path. The compressed gas is ejected from the ejection port through the compressed gas path, while the cleaning liquid is ejected from the ejection port through the cleaning liquid path.