Abstract: The present disclosure provides a chip packaging method and a chip packaging structure. The chip packaging method includes: providing an encapsulated grain and a packaging substrate, the encapsulated grain including a first hybrid bonding structure; wherein the packaging substrate includes a front side and a back side opposite to each other; a second hybrid bonding structure is formed on the front side of the packaging substrate and a connection pin is formed on the back side of the packing substrate; the second hybrid bonding structure and the connection pin are electrically connected through a third connecting metal column penetrating the packaging substrate; and bonding together the first hybrid bonding structure of the encapsulated grain and the second hybrid bonding structure of the packaging substrate by medium-to-medium and metal-to-metal aligned bonding such that the encapsulated grain is bonded to the packaging substrate.

Abstract: Provided in the present invention are a magnetic nanosphere coated with modified cardiolipin, and manufacturing method thereof. The magnetic nanosphere coated with modified cardiolipin comprises a modified cardiolipin, a biotin derivative, and a streptavidin magnetic bead. The modified cardiolipin is coupled to the biotin derivative via an —NH—CO structure. The streptavidin magnetic bead is a magnetic nanosphere coupled to streptavidin, and the biotin derivative is coupled to the streptavidin.

Abstract: Provided in the present invention are a magnetic nanosphere coated with modified cardiolipin, and manufacturing method thereof. The magnetic nanosphere coated with modified cardiolipin comprises a modified cardiolipin, a biotin derivative, and a streptavidin magnetic bead. The modified cardiolipin is coupled to the biotin derivative via an —NH—CO structure. The streptavidin magnetic bead is a magnetic nanosphere coupled to streptavidin, and the biotin derivative is coupled to the streptavidin.