Abstract: Provided is a pet cat excrement screening device. The pet cat excrement screening device includes a support base; a drum rotatably mounted on the support base; and a drum driving device mounted on the support base. The drum is configured to rotate between a first position and a second position under drive of the drum driving device, where the rotation angle of the drum is less than 360 degrees. A side wall of the drum body of the drum is provided with a pet inlet. The pet inlet is exposed out of the support base during a rolling process of the drum. A screening mechanism is mounted in the drum. The rear end of the drum is provided with a waste discharge port.

Abstract: Provided is a pet cat excrement screening device. The pet cat excrement screening device includes a support base; a drum rotatably mounted on the support base; and a drum driving device mounted on the support base. The drum is configured to rotate between a first position and a second position under drive of the drum driving device, where the rotation angle of the drum is less than 360 degrees. A side wall of the drum body of the drum is provided with a pet inlet. The pet inlet is exposed out of the support base during a rolling process of the drum. A screening mechanism is mounted in the drum. The rear end of the drum is provided with a waste discharge port.

Abstract: In a network having at least one slave node including a slave clock, a method of adjusting the slave clock relative to a master clock of a master node includes, at the slave node, correcting a time of day of the slave clock using (a) a slave pulse signal having a known slave pulse rate, (b) a time-of-day counter of the slave node, and (c) a master pulse signal, based on values of the slave clock at nearest corresponding edges of the slave pulse signal and the master pulse signal, and correcting a frequency of the slave clock using the slave pulse signal, a clock signal of the slave node, and the master pulse signal, based on values of the slave clock at nearest corresponding edges of the master pulse signal. No other clock signal from outside the slave node is used for the corrections.

Abstract: Disclosed are an excrement screening device and method. The excrement screening device includes a rotary receiving piece, a litter blocking piece and a screening piece. The rotary receiving piece is configured to receive cat litter and the rotary receiving piece is provided with a waste discharge outlet. The litter blocking piece is disposed in the rotary receiving piece and the litter blocking piece is configured to block the cat litter in a case where the rotary receiving piece rotates along a first direction. The screening piece is disposed in the rotary receiving piece, the screening piece is provided with a plurality of screening holes, and an accommodating cavity is formed by the screening piece, the litter blocking piece and the rotary receiving piece. The excrement screening method uses the above-mentioned excrement screening device.

Abstract: Disclosed are an excrement screening device and method. The excrement screening device includes a rotary receiving piece, a litter blocking piece and a screening piece. The rotary receiving piece is configured to receive cat litter and the rotary receiving piece is provided with a waste discharge outlet. The litter blocking piece is disposed in the rotary receiving piece and the litter blocking piece is configured to block the cat litter in a case where the rotary receiving piece rotates along a first direction. The screening piece is disposed in the rotary receiving piece, the screening piece is provided with a plurality of screening holes, and an accommodating cavity is formed by the screening piece, the litter blocking piece and the rotary receiving piece. The excrement screening method uses the above-mentioned excrement screening device.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: An LGA socket assembly comprising individual sockets cells, the methods of fabricating and assembling the socket cells into a socket assembly. In an embodiment of the invention, each socket cell comprises an insulative body and a wire. The insulative body is formed around the wire. A first portion of the wire extends from the top surface of the insulative body to form contact tip. A second portion of the wire extends from the bottom surface of the insulative body to form contact paddle. Socket cells are aligned to form a socket assembly.

Abstract: An LGA socket assembly comprising individual sockets cells, the methods of fabricating and assembling the socket cells into a socket assembly. In an embodiment of the invention, each socket cell comprises an insulative body and a wire. The insulative body is formed around the wire. A first portion of the wire extends from the top surface of the insulative body to form contact tip. A second portion of the wire extends from the bottom surface of the insulative body to form contact paddle. Socket cells are aligned to form a socket assembly.

Abstract: Disclosed is a socket assembly for electrically engaging an Integrated Circuit (IC) package with a printed circuit board. The socket assembly includes a socket body and a Pick-and-Place (PnP) cap. The socket body is mounted on the printed circuit board. Further, the PnP cap is capable of detachably mounting on the socket body. An upper surface of the PnP cap includes a raised portion with multiple chamfered portions projecting out from the raised portion. The multiple chamfered portions enable easier detachment of the PnP cap from the socket body.

Abstract: An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may include a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.

Abstract: Disclosed is a socket assembly for electrically engaging an Integrated Circuit (IC) package with a printed circuit board. The socket assembly includes a socket body and a Pick-and-Place (PnP) cap. The socket body is mounted on the printed circuit board. Further, the PnP cap is capable of detachably mounting on the socket body. An upper surface of the PnP cap includes a raised portion with multiple chamfered portions projecting out from the raised portion. The multiple chamfered portions enable easier detachment of the PnP cap from the socket body.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: Disclosed is an electrical connector assembly. The electrical connector assembly comprises a land grid array socket and the pick-and-placed (PnP) cap. The land grid array socket comprises a socket body and a loading mechanism. The PnP cap is removably attached to the peripheral edge of the socket body for covering a first surface of the socket body. The loading mechanism comprising a loading plate is mounted over the socket body and the PnP cap. The PnP cap detachably engages the loading plate, when the loading plate is mounted over the PnP cap.

Abstract: Disclosed is a socket assembly for electrically engaging an IC package with a PCB. The socket assembly includes a socket body, a loading mechanism, and a pick-and-place (PnP) cap. The socket body engages the IC package with the PCB. The loading mechanism includes a loading plate having a central opening and capable of being mounted on the socket body when the loading plate is in a closed position. The PnP cap includes a first plurality of latches configured on a plurality of peripheral edges of the PnP cap and a raised portion configured on an upper surface of the PnP cap. The first plurality of latches engages the PnP cap with the socket body when the PnP cap is in a first position. The second plurality of latches detachably engages the PnP cap with the central opening of the loading plate when the PnP cap is in a second position.