Abstract: Embodiments of the invention are directed to data replication in an active-active databases having a source site and a target site. Aspects include creating a subscription activation message in a capture address space, the subscription activation message having a timestamp after a latest committed timestamp of the active-active databases and transmitting the subscription activation message to a subscription activation module of the target site of the active-active databases. Based on a determination that one or more tables associated with the subscription activation message are inactive, aspects also include repairing the one or more tables. Based on a determination that all tables associated with the subscription activation message are active, aspects include initiate replication of the capture address space from the source site to the target site with a timestamp of the latest committed timestamp.

Abstract: The present disclosure relates to a ToF depth sensor based on laser speckle projection. The ToF depth sensor includes a laser projector, which is used for projecting periodic infrared laser signals with phase information to the detected space; a diffraction optical element (DOE), which is used for uniformly distributing a beam of incident infrared laser signals into L beams of emergent infrared laser signals, enabling each beam of the emergent infrared laser signals to carry respective phase information, as well as the beam diameter, divergence angle and wavefront of the emergent infrared laser signals to be identical with those of the incident infrared laser signals, while only changing the transmission direction and controlling coded patterns projected out by laser speckles; and an image sensor, which is used for calculating depth information of a measured object by matching the laser speckles with pixel points of the image sensor.

Abstract: The present disclosure relates to a ToF depth sensor based on laser speckle projection. The ToF depth sensor includes a laser projector, which is used for projecting periodic infrared laser signals with phase information to the detected space; a diffraction optical element (DOE), which is used for uniformly distributing a beam of incident infrared laser signals into L beams of emergent infrared laser signals, enabling each beam of the emergent infrared laser signals to carry respective phase information, as well as the beam diameter, divergence angle and wavefront of the emergent infrared laser signals to be identical with those of the incident infrared laser signals, while only changing the transmission direction and controlling coded patterns projected out by laser speckles; and an image sensor, which is used for calculating depth information of a measured object by matching the laser speckles with pixel points of the image sensor.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.

Abstract: A system and method for managing a test of a motherboard can create a first test data consisting of test items. In the first test data, one or more selected test items to perform can be identified. A second test data is obtained by performing a logical NOR operation on the test bits corresponding to the selected test items. After performing the test items, a third test data is created by setting the test bits corresponding to the selected test items that pass the test to the test bits of the selected test items in the first test data, and by setting the test bits corresponding to the selected test items that fail the test to the test bits of the test items that have not been selected in the first test data. By comparing the third with the test data, a test result of the motherboard is obtained.

Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.

Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.

Abstract: In a method for adjusting a display of a computer monitor, the computer monitor includes a storage system storing display parameters of the computer monitor and an on-screen display (OSD) menu. A size proportion of a display screen of the computer monitor and a virtual region on the display screen is defined, and a functional relationship between virtual parameters and the display parameters is predetermined. The OSD menu acquires the display parameters that are user-adjustable, and updates the display parameters in the storage system. The virtual parameters corresponding to the display parameters are computed according to the functional relationship. The computer monitor displays data output from a host computer on the virtual region according to the computed virtual parameters.

Abstract: A system and method for managing a test of a motherboard can create a first test data consisting of test items. In the first test data, one or more selected test items to perform can be identified. A second test data is obtained by performing a logical NOR operation on the test bits corresponding to the selected test items. After performing the test items, a third test data is created by setting the test bits corresponding to the selected test items that pass the test to the test bits of the selected test items in the first test data, and by setting the test bits corresponding to the selected test items that fail the test to the test bits of the test items that have not been selected in the first test data. By comparing the third with the test data, a test result of the motherboard is obtained.

Abstract: A method for controlling a test process of an electronic device using a data processing device creates test control data to test the electronic device, selects a test item of the electronic device sequentially according to test bits in the test control data, and modifies a test bit corresponding to the selected test item to obtain modified test control data if the electronic device passes the selected test item. The method further compares the modified test control data with the created test control data if all the test items have been performed to determine if the electronic device passes the test process, and outputs a signal indicating success if the electronic device passes the test process.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.

Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.

Abstract: Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn—Bi eutectic powder having a composition of 63 wt % Sn:57 wt % Bi such that the bulk composition of the mixture is 3 wt % Bi has an initial melting point of 140° C. and a re-melt temperature of 220° C. after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb—Sn eutectic powder having a composition of 62 wt % Sn:58 wt % Pb such that the bulk composition of the mixture is 15 wt % Sn has an initial melting point of 183° C. and a re-melt temperature of 250° C.

Abstract: Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn—Bi eutectic powder having a composition of 63 wt % Sn, 57 wt % Bi such that the bulk composition of the mixture is 3 wt % BS has an initial melting point of 140° C. and a re-melt temperature of 220° C. after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb—Sn eutectic powder having a composition of 62 wt % Sn:58 wt % Pb such that the bulk composition of the mixture is 15 wt % Sn has an initial melting point of 183° C. and a re-melt temperature of 250° C.