Patents by Inventor Xinbo MA

Xinbo MA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11432398
    Abstract: One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: August 30, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yiyao Wu, Xinbo Ma, Zhiqiang Liao
  • Publication number: 20210084753
    Abstract: One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 18, 2021
    Inventors: Yiyao WU, Xinbo MA, Zhiqiang LIAO