Abstract: A first wafer, a method of fabricating thereof and a wafer stack are disclosed. The first wafer includes a first substrate, a first dielectric layer on the first substrate, first metal layers embedded in the first dielectric layer, first switching holes extending partially through the first dielectric layer and exposing the first metal layers, a first interconnection layer filling up the first switching holes and electrically connected to the first metal layers, a first insulating layer residing on surfaces of both the first dielectric layer and the first interconnection layer, first contact holes extending through the first insulating layer and exposing the first interconnection layer, and a second interconnection layer filling up the first contact holes and electrically connected to the first interconnection layer. Filling the first contact holes and the first switching holes with different interconnection layers reduces the difficulty in fabricating interconnection structures for the first metal layers.

Abstract: An electronic device according to an embodiment includes a camera movement assembly configured to move a camera module between the inside and the outside of a housing.

Abstract: A memory refresh method is applied to a computer system including a processor, a memory controller, and a dynamic random access memory (DRAM). The memory controller receives a first plurality of access requests from the processor. The memory controller refreshes a first rank in a plurality of ranks at shortened interval set to T/N when a quantity of target ranks to be accessed by the first plurality of access requests is less than a first threshold and a proportion of read requests in the first plurality of access requests or a proportion of write requests in the first plurality of access requests is greater than a second threshold. T is a standard average refresh interval, and N is greater than 1. The memory refresh technology provided in this application can improve performance of the computer system in a memory refresh process.

Abstract: A method for positioning a vehicle, a vehicle and an electronic device are disclosed, which relate to a field of automatic driving and intelligent transportation. The method includes: obtaining a map related to a region, the region being a region where a positioning signal such as a GNSS signal is limited, such as a tunnel, the region including a plurality of positioning markers, and the map including positioning mark data corresponding to the plurality of positioning markers; capturing image data for the region when the vehicle travels through the region; and determining positioning information of the vehicle by matching the image data with the positioning mark data in the map based on an estimated posture of the vehicle. The map here may be a high-precision map.

Abstract: Provided is a smart roadside unit, including a light intensity sensor configured to generate current light intensity information; a high-bright camera assembly configured to capture a high-bright image; a low-bright camera assembly configured to capture a low-bright image; and a controller configured to turn on the high-bright camera assembly to shoot when the current light intensity is greater than a first light intensity threshold, turn on the low-bright camera assembly to shoot when the current light intensity is less than a second light intensity threshold, and extract vehicle information from the high-bright image or the low-bright image, in which the second light intensity threshold is smaller than the first light intensity threshold.

Abstract: The present teachings include powder coating including a plurality of core/shell particles. Each particle of plurality of core/shell particles has a size of from about 3 microns to about 100 microns. Each particle of the plurality of core/shell particles has a core including a cross-linkable crystalline polyester resin having a melting temperature of less than about 150° C. Each particle of the plurality of core/shell particles has a shell including a cross-linkable amorphous polyester resin having a glass transition temperature greater than 40° C. Each particle of the plurality of core/shell particles includes a thermal initiator.

Abstract: A curtain assembly includes a scrolling device having a first axle, a second axle and at least one third axle. A scrolling spring is a scroll-shaped unit and includes a first end and a second end. The second end of the scrolling spring is located close to the center of the roll-shaped unit. The first end is located at outside of roll-shaped unit. The recovery force of the first end of the scrolling spring is smaller than that of the second end of the scrolling spring. The first end of the scrolling spring is connected to a first wheel. The second end of the scrolling spring is connected to a second wheel. The scrolling spring is wrapped in an “S” pattern between the first and second heels. When the curtain is collected, it does not expand downward. When the curtain is expanded, it is not dragged upward.

Abstract: The present disclosure provides an intelligent roadside unit. The intelligent roadside unit includes: a radar, configured to detect an obstacle within a first preset range of the intelligent roadside unit; a camera, configured to capture an image within a second preset range of the intelligent roadside unit; a radar-signal processor, coupled to the radar and configured to generate an obstacle detection signal according to obstacle information detected by the radar; an image-signal processor, coupled to the camera and configured to generate an image detection signal according to the image captured by the camera; and a general control processor, coupled to the radar-signal processor and the image-signal processor and generating a point cloud image according to the obstacle detection signal and the image detection signal.

Abstract: A method and apparatus for positioning a vehicle, a vehicle and a storage medium are provide. An implementation of the method may include: acquiring object distribution information collected by a road-side perception device, and determining road-side object distribution information based on the object distribution information collected by the road-side perception device; acquiring vehicle-side object distribution information, and matching the road-side object distribution information with the vehicle-side object distribution information, the vehicle-side object distribution information referring to distribution information of a surrounding object detected by a target vehicle to be positioned; and determining location information of the target vehicle according to the matching result.

Abstract: A memory refresh method is applied to a computer system including a processor, a memory controller, and a dynamic random access memory (DRAM). The memory controller receives a first plurality of access requests from the processor. The memory controller refreshes a first rank in a plurality of ranks at shortened interval set to T/N when a quantity of target ranks to be accessed by the first plurality of access requests is less than a first threshold and a proportion of read requests in the first plurality of access requests or a proportion of write requests in the first plurality of access requests is greater than a second threshold. T is a standard average refresh interval, and N is greater than 1. The memory refresh technology provided in this application can improve performance of the computer system in a memory refresh process.

Abstract: A semiconductor wafer, a bonding structure, and a wafer bonding method are provided. In the semiconductor wafer, a bonding pad which is electrically connected to the interconnection structure is formed in the top cover layer, and a bonding alignment mark formed by a point array is disposed in the top cover layer. In this way, the bonding alignment mark is disposed in the top cover layer, and the top cover layer is not covered by another material layer, thereby facilitating recognition of the alignment pattern by the bonding device and increasing the alignment window in bonding process. Moreover, the bonding alignment mark is formed by a point array, thereby facilitating integration of the process for forming the bonding alignment mark with the bonding hole process and avoiding defects such as the dishing phenomenon in the manufacturing process.

Abstract: A particle and a method for producing the same is disclosed. For example, the particle includes a polymer resin that is compatible with a three-dimensional (3D) printing process to print a three-dimensional (3D) object and a marking additive that allows selective portions of the 3D object to change color when exposed to a light, wherein the marking additive is added to approximately 0.01 to 25.00 weight percent (wt %).

Abstract: A filament material and a method for producing the same is disclosed. For example, the filament material includes a polymer resin that is compatible with an extrusion based printing process and a marking additive that allows selective portions of the filament material to change color when exposed to a light, wherein the marking additive is added to approximately 0.01 to 25.00 weight percent (wt %).

Abstract: A semiconductor device and a manufacturing method thereof are disclosed. In which a first opening and a second opening are vertically separated, and are no longer restricted by the condition that a deep upper opening needs to be filled with a thick photoresist when a TSV nested hole in vertical communication forms a middle opening and lower opening, thereby satisfying devices with different thicknesses requirements. The design is no longer restricted by the lateral process of the TSV nested hole, thereby enhancing the flexibility of the design. In the photolithography process, the deep hole does not need to be filled with the photoresist, the photoresist does not need to be thick, thereby reducing the complexity of the photolithography process and improving the exposure effect. The first metal layer and the second metal layer are directly led out via a first trench, thereby simplifying the process and reducing the production cost.

Abstract: A metal lead, a semiconductor device and method of fabricating the same are disclosed, in which a first trench is formed simultaneously with a wiring layer trench, followed by the formation of a second trench in communication with the first trench. After that, a conductive structure is formed simultaneously with a wiring layer by filling a conductive material simultaneously in the first, second and wiring layer trenches. In this way, it is neither necessary to externally connect the conductive structure by forming an additional opening, nor to form the wiring layer by etching a deposited aluminum layer. This saves the use of two photomasks, leading to savings in production cost.

Abstract: A composition including a three-dimensional polymeric printing powder; an organic polymeric additive on at least a portion of an external surface of the three-dimensional polymeric printing powder; wherein the organic polymeric additive is optionally cross-linked; and optionally, an inorganic additive on at least a portion of an external surface of the three-dimensional polymeric printing powder. A process for preparing a three-dimensional polymeric printing powder having an organic polymeric additive disposed thereon. A process for employing the three-dimensional polymeric printing powder including selective laser sintering.

Abstract: A method and apparatus for jointly calibrating external parameters of multiple cameras. The method includes: determining an overlapped area of angles of view of cameras, and obtaining a 2D verification point set in an image of the overlapped area, the 2D verification point set including at least one verification point; performing external parameter calibration for each camera separately to obtain a current external parameter of the camera; calculating coordinates of a 3D point corresponding to each verification point in a world coordinate system using the current external parameter of each camera separately, and calculating a loss function based on the coordinates of the 3D point, the loss function being used to measure an overlay error of calibration of the cameras under the current external parameter; and performing joint calibration based on the loss function to obtain a target external parameter of each camera.

Abstract: The present disclosure proposes a method, an apparatus, a device, and a medium for calibrating an intelligent roadside unit. The method includes: obtaining an intelligent driving vehicle within a preset range of the intelligent roadside unit; obtaining a first point cloud detected by a first radar in the intelligent driving vehicle, and obtaining location information of the intelligent driving vehicle; obtaining a second point cloud detected by a second radar in the intelligent roadside unit; and obtaining location information of the second radar based on the first point cloud, the second point cloud, and the location information of the intelligent driving vehicle.

Abstract: Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of printed objects. Conductive traces and similar features may be introduced during additive manufacturing processes by incorporating a metal precursor in a thermoplastic printing composition, converting a portion of the metal precursor to discontinuous metal islands using laser irradiation, and performing electroless plating. Suitable printing compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer, a metal precursor admixed with the thermoplastic polymer, and optionally a plurality of nanoparticles disposed upon an outer surface of each of the thermoplastic particulates, wherein the metal precursor is activatable to form metal islands upon exposure to laser irradiation. Melt emulsification may be used to form the thermoplastic particulates.

Abstract: A semiconductor device and a manufacturing method thereof are disclosed. In the device, the isolation layer is used to prevent the first metal layer and the second metal layer which are over-etched and back-splashed from diffusing to a first substrate; and the isolation layer serves as a barrier layer to prevent an interconnection layer from diffusing into the first substrate. Further, the isolation layer includes a silicon nitride layer, which is advantageous for preventing the metal layers from back-splashing and diffusing to the sidewall of the first substrate. The isolation layer further includes a first silicon oxide layer and a second silicon oxide layer, wherein the second silicon oxide layer is used to protect the silicon nitride layer from being etched and consumed and the first silicon oxide layer is used to improve the adhesion between the silicon nitride layer and the first substrate.