Patents by Inventor Xingwang CHENG

Xingwang CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming nickel plated graphene hollow sphere
    Patent number: 11713510
    Abstract: A method for forming a nickel plated graphene hollow sphere is based on self assembly of graphene under the actions of a rotation force and the van der Waals force, and an electroless nickel plating process performed on the exposed surface of the graphene by means of a hydrothermal method. The method is simple to implement at low cost, and the nickel plated graphene hollow sphere product can be produced with good reproducibility and a high yield. The nickel plated graphene hollow sphere formed by the present method can exhibit good electromagnetic wave absorbing performances of both nickel and graphene, and may have a lower overall density.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: August 1, 2023
    Assignee: Beijing Institute of Technology
    Inventors: Hongmei Zhang, Yuxin Ge, Hongnian Cai, Xingwang Cheng, Ying Liu, Qunbo Fan
  • Method for forming nickel plated graphene hollow sphere
    Publication number: 20210222302
    Abstract: A method for forming a nickel plated graphene hollow sphere is based on self assembly of graphene under the actions of a rotation force and the van der Waals force, and an electroless nickel plating process performed on the exposed surface of the graphene by means of a hydrothermal method. The method is simple to implement at low cost, and the nickel plated graphene hollow sphere product can be produced with good reproducibility and a high yield. The nickel plated graphene hollow sphere formed by the present method can exhibit good electromagnetic wave absorbing performances of both nickel and graphene, and may have a lower overall density.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 22, 2021
    Applicant: Beijing Institute of Technology
    Inventors: Hongmei ZHANG, Yuxin GE, Hongnian CAI, Xingwang CHENG, Ying LIU, Qunbo FAN