Patents by Inventor Xin Hua Tian

Xin Hua Tian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845294
    Abstract: Disclosed is a keyboard for an information handling system. The keyboard includes a top cover comprising a polyester and a plurality of jute fibers, a keycap assembly comprising one or more keycaps, and a bottom cover comprising a first polylactic acid (PLA) and a post-consumer resin (PCR). The keycap assembly can be positioned between the top cover and the bottom cover, and the top cover can include one or more openings keycap assembly keycaps to protrude through.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: December 19, 2023
    Assignee: Dell Products L.P.
    Inventors: Hin Loong Wong, Xin Hua Tian, Peng Lip Goh, Deeder M. Aurongzeb
  • Publication number: 20230082334
    Abstract: Disclosed is a keyboard for an information handling system. The keyboard includes a top cover comprising a polyester and a plurality of jute fibers, a keycap assembly comprising one or more keycaps, and a bottom cover comprising a first polylactic acid (PLA) and a post-consumer resin (PCR). The keycap assembly can be positioned between the top cover and the bottom cover, and the top cover can include one or more openings keycap assembly keycaps to protrude through.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Applicant: Dell Products L.P.
    Inventors: Hin Loong Wong, Xin Hua Tian, Peng Lip Goh, Deeder M. Aurongzeb
  • Publication number: 20230026902
    Abstract: A composite carbon fiber laminate, including a first carbon fiber woven fabric layer, including one or more first voids defined between fabric strands of the first carbon fiber woven fabric layer; a second carbon fiber woven fabric layer, including one or more second voids defined between fabric strands of the second carbon fiber woven fabric layer; a core fabric layer; a first reflective layer positioned between the first carbon fiber woven fabric layer and the core fabric layer; and a second reflective fabric layer positioned between the second carbon fiber woven fabric layer and the core fabric layer, wherein the first reflective layer reflects light that is incident upon the first carbon fiber woven fabric layer at the one or more first voids.
    Type: Application
    Filed: July 26, 2021
    Publication date: January 26, 2023
    Inventors: Nicholas Abbatiello, Xin Hua Tian, Xiu Feng Qiao
  • Patent number: 11318685
    Abstract: In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: May 3, 2022
    Assignee: Dell Products L.P.
    Inventors: Nicholas D. Abbatiello, Chuan Beng Sim, Xin Hua Tian
  • Publication number: 20200324442
    Abstract: Systems and methods for making a thermoplastic carbon fiber plate having a plastic overmold. The method includes: heating a mold; inserting a thermoplastic carbon fiber component into a mold; mixing a supercritical fluid with a plastic mixture to infuse bubbles into the plastic mixture and to thereby reduce the density of the plastic mixture that includes a resin and glass fiber; injecting the mixture of the supercritical fluid and the plastic mixture into the mold so that a plastic overmold is formed and bonded to the thermoplastic carbon fiber component; and cooling the thermoplastic carbon fiber component and the plastic overmold. The cooled plastic overmold includes a foam core having a lower density due to the gas bubbles and a skin layer having a higher concentration of the resin than the foam core and a reduced surface roughness due to the heated mold.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 15, 2020
    Applicant: DELL PRODUCTS L.P.
    Inventors: David W. WILLIAMS, Xin Hua TIAN, Nicholas D. ABBATIELLO
  • Publication number: 20180319093
    Abstract: In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.
    Type: Application
    Filed: July 16, 2018
    Publication date: November 8, 2018
    Applicant: Dell Products L.P.
    Inventors: Nicholas D. Abbatiello, Chuan Beng Sim, Xin Hua Tian
  • Patent number: 10022909
    Abstract: In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: July 17, 2018
    Assignee: Dell Products L.P.
    Inventors: Nicholas D. Abbatiello, Chuan Beng Sim, Xin Hua Tian
  • Publication number: 20160200037
    Abstract: In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.
    Type: Application
    Filed: January 8, 2015
    Publication date: July 14, 2016
    Inventors: Nicholas D. Abbatiello, Chuan Beng Sim, Xin Hua Tian