Abstract: A self-powered wireless keyboard by modifying the structure of a traditional membrane keyboard having a volcanic crater structure. Not damaging the original membrane keyboard structure, a micro magnet core is installed inside a cylindrical protrusion block under the key cap as a mover of the induction power generation device, and an induction coil is wound in a key slot of the keyboard base as the stator of the induction power generation device. In this way, when each key is pressed, it will produce induction current. A layer of flexible solar cell can be laid on the upper surface of the key, which can generate electricity by collecting the light energy in the surrounding environment during the time of daily illumination.

Abstract: A cellular telephone (100, 1300) comprises an earpiece speaker (234, 1312) and a loudspeaker (238, 1316) that share a common resonator (e.g., 1436). Sharing a common resonator allows the common resonator to be made large thereby improving bass response. Undesirable acoustic coupling through the common resonator is addressed by driving the earpiece speaker with a cancellation filtered version of the loudspeaker drive signal when the loudspeaker is driven.

Abstract: A method for creating spatially resolved audio signals for a listener (18) that are representative of one or more callers (12, 14, 16). A digital data signal (13) that represents the individual caller's voice (12) contains an embedded tag (24) that is identifiable with the individual caller. The digital data signal is transmitted from a sending device at the caller's location to a receiving device (30) at the listener's location. At the listener's receiving device, the tag is used to associate each of the digital data signals with a head related transfer functions (32) that are resident in the receiving device by consulting a lookup table. The digital data streams are then convolved (34) with the associated head related transfer function to form binaural digital signals, which are ported to two or more acoustic transducers (36) to create analog audio signals that appear to emanate from different spatial locations around the listener.

Abstract: The present invention provides a method (600) and device (200,500) for providing temperature-stable optical feedback for optical packages. The device includes an optical emitter (202,502), a first partially reflective optical element (204, 504), a second partially reflective optical element (206,506), a first optical sensing unit (208,508), a second optical sensing unit (210,510), and a feedback unit (212). The optical emitter (202,502) is responsive to an electrical input current and generates a beam of light (214). The first optical sensing unit (208,508) and the second optical sensing unit (210,510) receive diffracted portions of the beam of light (214) from the first partially reflective optical element (204, 504) and the second partially reflective optical element (206,506) respectively and generate a first feedback signal E1 and a second feedback signal E2.

Abstract: The present invention provides a method (600) and device (400) for minimizing wind-induced noise in a microphone. The device includes: a housing (412) having a recessed area shaped to accommodate a microphone transducer (410); the microphone transducer (410), situated within the recessed area such that a thin film situated over the microphone transducer is flush with/overlaying a top of the recessed area and affixed at least to the sides of the recessed area, for receiving sound; and the thin film (402) has at least one aperture (404, . . . 406) for allowing sound to impinge on the microphone transducer (410), and has a minimal thickness that maintains structural integrity.

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.