Patents by Inventor Xiuwen Tu
Xiuwen Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11133778Abstract: A method of high reverse current burn-in of solar cells and a solar cell with a burned-in bypass diode are described herein. In one embodiment, high reverse current burn-in of a solar cell with a tunnel oxide layer induces low breakdown voltage in the solar cell. Soaking a solar cell at high current can also reduce the difference in voltage of defective and non-defective areas of the cell.Type: GrantFiled: February 27, 2018Date of Patent: September 28, 2021Assignee: SunPower CorporationInventors: Michael J. Defensor, Xiuwen Tu, Junbo Wu, David D. Smith
-
Patent number: 10804843Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.Type: GrantFiled: March 11, 2019Date of Patent: October 13, 2020Assignee: SunPower CorporationInventors: Xiuwen Tu, David Aitan Soltz, Michael C. Johnson, Seung Bum Rim, Taiqing Qiu, Yu-Chen Shen, Kieran Mark Tracy
-
Patent number: 10476432Abstract: High throughput systems for photovoltaic UV degradation testing of solar cells, and methods of testing for UV degradation of solar cell during manufacture, are described herein. In an example, a high throughput solar cell testing apparatus includes a plurality of real time ultra-violet (RTUV) testing modules. Each of the RTUV testing modules includes an ultra-violet (UV) light source, an optics assembly for focusing light from the UV light source on a sample area, and a detector for receiving photoluminescence energy from the sample area. The high throughput solar cell testing apparatus also includes an acquisition and control assembly coupled to the plurality of RTUV testing modules.Type: GrantFiled: December 30, 2016Date of Patent: November 12, 2019Assignee: SunPower CorporationInventors: David Aitan Soltz, Yoann Buratti, Xiuwen Tu, Ryan Manuel Lacerda, Taiqing Qiu
-
Publication number: 20190273467Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.Type: ApplicationFiled: March 11, 2019Publication date: September 5, 2019Inventors: Xiuwen Tu, David Aitan Soltz, Michael C. Johnson, Seung Bum Rim, Taiqing Qiu, Yu-Chen Shen, Kieran Mark Tracy
-
Patent number: 10230329Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.Type: GrantFiled: February 6, 2017Date of Patent: March 12, 2019Assignee: SunPower CorporationInventors: Xiuwen Tu, David Aitan Soltz, Michael C. Johnson, Seung Bum Rim, Taiqing Qiu, Yu-Chen Shen, Kieran Mark Tracy
-
Publication number: 20180191298Abstract: A method of high reverse current burn-in of solar cells and a solar cell with a burned-in bypass diode are described herein. In one embodiment, high reverse current burn-in of a solar cell with a tunnel oxide layer induces low breakdown voltage in the solar cell. Soaking a solar cell at high current can also reduce the difference in voltage of defective and non-defective areas of the cell.Type: ApplicationFiled: February 27, 2018Publication date: July 5, 2018Inventors: Michael J. DEFENSOR, Xiuwen TU, Junbo WU, David D. SMITH
-
Patent number: 9912290Abstract: A method of high reverse current burn-in of solar cells and a solar cell with a burned-in bypass diode are described herein. In one embodiment, high reverse current burn-in of a solar cell with a tunnel oxide layer induces low breakdown voltage in the solar cell. Soaking a solar cell at high current can also reduce the difference in voltage of defective and non-defective areas of the cell.Type: GrantFiled: September 26, 2012Date of Patent: March 6, 2018Assignee: SunPower CorporationInventors: Michael J Defensor, Xiuwen Tu, Junbo Wu, David Smith
-
Publication number: 20180041165Abstract: High throughput systems for photovoltaic UV degradation testing of solar cells, and methods of testing for UV degradation of solar cell during manufacture, are described herein. In an example, a high throughput solar cell testing apparatus includes a plurality of real time ultra-violet (RTUV) testing modules. Each of the RTUV testing modules includes an ultra-violet (UV) light source, an optics assembly for focusing light from the UV light source on a sample area, and a detector for receiving photoluminescence energy from the sample area. The high throughput solar cell testing apparatus also includes an acquisition and control assembly coupled to the plurality of RTUV testing modules.Type: ApplicationFiled: December 30, 2016Publication date: February 8, 2018Inventors: David Aitan Soltz, Yoann Buratti, Xiuwen Tu, Ryan Manuel Lacerda, Taiqing Qiu
-
Publication number: 20170149383Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.Type: ApplicationFiled: February 6, 2017Publication date: May 25, 2017Inventors: Xiuwen Tu, David Aitan Soltz, Michael C. Johnson, Seung Bum Rim, Taiqing Qiu, Yu-Chen Shen, Kieran Mark Tracy
-
Publication number: 20170069777Abstract: An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.Type: ApplicationFiled: November 18, 2016Publication date: March 9, 2017Applicant: SunPower CorporationInventors: Thomas PASS, Richard SEWELL, Taeseok KIM, Gabriel HARLEY, David F. J. KAVULAK, Xiuwen TU
-
Patent number: 9564854Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.Type: GrantFiled: May 6, 2015Date of Patent: February 7, 2017Assignee: SunPower CorporationInventors: Xiuwen Tu, David Aitan Soltz, Michael C. Johnson, Seung Bum Rim, Taiqing Qiu, Yu-Chen Shen, Kieran Mark Tracy
-
Patent number: 9502596Abstract: An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.Type: GrantFiled: June 28, 2013Date of Patent: November 22, 2016Assignee: SunPower CorporationInventors: Thomas Pass, Richard Sewell, Taeseok Kim, Gabriel Harley, David F. J. Kavulak, Xiuwen Tu
-
Publication number: 20160329864Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.Type: ApplicationFiled: May 6, 2015Publication date: November 10, 2016Inventors: Xiuwen Tu, David Aitan Soltz, Michael C. Johnson, Seung Bum Rim, Taiqing Qiu, Yu-Chen Shen, Kieran Mark Tracy
-
Patent number: 9450113Abstract: Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, and a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers.Type: GrantFiled: July 22, 2015Date of Patent: September 20, 2016Assignee: SunPower CorporationInventor: Xiuwen Tu
-
Patent number: 9263601Abstract: Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.Type: GrantFiled: December 21, 2012Date of Patent: February 16, 2016Assignee: SunPower CorporationInventors: Junbo Wu, Michael C. Johnson, Michael Cudzinovic, Joseph Behnke, Xi Zhu, David D. Smith, Richard Sewell Hamilton, Xiuwen Tu, Seung Bum Rim
-
Publication number: 20150325710Abstract: Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, and a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers.Type: ApplicationFiled: July 22, 2015Publication date: November 12, 2015Inventor: Xiuwen Tu
-
Publication number: 20150318822Abstract: A solar cell testing apparatus can include a first electrical probe configured to receive a first voltage at a first location of a solar cell. The solar cell testing apparatus can also include a second electrical probe configured to receive a second voltage at a second location of the solar cell, where the second location is of the same polarity as the first location.Type: ApplicationFiled: June 30, 2014Publication date: November 5, 2015Inventors: Xiuwen Tu, David D. Smith, David Aitan Soltz
-
Patent number: 9112097Abstract: Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers.Type: GrantFiled: September 27, 2013Date of Patent: August 18, 2015Assignee: SunPower CorporationInventor: Xiuwen Tu
-
Publication number: 20150093851Abstract: Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers.Type: ApplicationFiled: September 27, 2013Publication date: April 2, 2015Inventor: Xiuwen Tu
-
Publication number: 20150000724Abstract: An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.Type: ApplicationFiled: June 28, 2013Publication date: January 1, 2015Inventors: Thomas PASS, Richard SEWELL, Taeseok KIM, Gabriel HARLEY, David F.J. KAVULAK, Xiuwen TU