Patents by Inventor Xixue LIU

Xixue LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SnBiSb series low-temperature lead-free solder and its preparation method
    Patent number: 11479835
    Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61+c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: October 25, 2022
    Assignee: BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD.
    Inventors: Shaoming Zhang, Huijun He, Xixue Liu, Yanbin Sun, Zhigang Wang, Qiang Hu, Ning An, Fuwen Zhang, Jie Zhu, Jiangsong Zhang, Lirong Wang, Huankun Zhang, Lei Xu, Zhihua Zhu, Pin Zhang
  • SnBiSb Series Low-temperature Lead-free Solder and its Preparation Method
    Publication number: 20200123634
    Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61=c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.
    Type: Application
    Filed: November 17, 2016
    Publication date: April 23, 2020
    Applicant: BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD.
    Inventors: Shaoming ZHANG, Huijun HE, Xixue LIU, Yanbin SUN, Zhigang WANG, Qiang HU, Ning AN, Fuwen ZHANG, Jie ZHU, Jiangsong ZHANG, Lirong WANG, Huankun ZHANG, Lei XU, Zhihua ZHU, Pin ZHANG