Abstract: The present specification discloses video matching. In a computer-implemented method, a plurality of feature vectors of a target video is obtained. A candidate video similar to the target video is retrieved from a video database based on the plurality of feature vectors of the target video. A time domain similarity matrix feature map is constructed between the target video and the candidate video based on the target video and the candidate video. Using the time domain similarity matrix feature map as an input into a deep learning detection model, a video segment matching the target video in the candidate video and a corresponding similarity is output.

Abstract: The present application relates to a novel benzoazepine compound, comprising a pharmaceutically acceptable salt thereof. The present application also provides a pharmaceutical composition comprising the compound and a pharmaceutically acceptable salt thereof. The present application relates to use of the compound and the composition in the prevention or treatment of diseases related to arginine vasopressin V1a receptor, arginine vasopressin V1b receptor, arginine vasopressin V2 receptor, sympathetic nervous system or renin-angiotensin-aldosterone system. The present application also provides a method for preventing and/or treating arginine vasopressin-related diseases.

Abstract: An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process or through a dynamic bonding process. The embedded sensor or other desired device is provided on a substrate through any known or later-developed method. A cover is then bonded to the substrate using a solid-state bonding process or a dynamic bonding process. The solid-state bonding process may include providing heat and pressure to the substrate and the cover to bond the substrate and the cover together. The dynamic bonding process may include heating a bonding agent and distributing the heated bonding agent between the substrate and cover to bond the substrate and the cover together.

Abstract: An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process (e.g., by diffusion bonding) and/or through a dynamic bonding process (e.g., by brazing). The embedded sensor or other desired device is provided on a substrate through any know or later-developed method (e.g., a photolithography or conductive ink printing process). A cover is then bonded to the substrate using a solid-state bonding process and/or a dynamic bonding process. The solid-state bonding process and/or dynamic bonding process may include providing heat and/or pressure to the substrate, the cover and/or a bonding agent (e.g., a filler metal or alloy) to bond the substrate and the cover together.