Abstract: A jet assembly has internals rotatably and releaseably fit to a jet body, such as that for a spa. The internals have a barrel housing, a rotor and a barrel inlet. The internals as screwed into the jet body. A first threaded portion outside the barrel threadably engages second threaded portion inside the jet body wherein the internals have delimited rotation therein to align and misalign the barrel inlet from a body inlet on the jet body to control flow on and off respectively. The threaded portion within the jet body can be a locking ring affixed therein by fasteners or integral with the jet body. Rotation can be delimited by a projection on the barrel and a cooperating annular delimiting surface on the locking ring, such as circumferentially-spaced detents.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated from electronic components having different heights. The heat dissipation device includes a base plate and a first heat absorbing member and a second heat absorbing member extending from a top side of the base plate and having different heights for contacting the electronic components having different heights.

Abstract: A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.

Abstract: A heat dissipation device includes a base and a fin group fixed on the base. The base includes a container, a flattened heat pipe and a solid supporting member. The container includes a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween. The heat pipe and the supporting member are housed in the receiving chamber. Opposite sides of the heat pipe and the supporting member respectively abut against the baffle plate and the cover of the container.

Abstract: A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon.

Abstract: An exemplary heat dissipation device includes a base and fasteners. The base includes a bottom plate, a top plate, a heat pipe, and a frame. The heat pipe is sandwiched between peripheries of the bottom plate and the top plate. The frame is sandwiched between the bottom plate and the top plate. The frame surrounds the heat pipe. The fasteners extend through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.

Abstract: A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.

Abstract: A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.

Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

Abstract: A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward each other. The first fin set defined a channel receiving the base therein. A plat extends from an end of the first face of the base. The second fin set is arranged on the plat of the base. The first face of the base has two grooves defined therein. A retaining member is attached to the first face of the base and has two retaining bars thereof fitted in the two grooves of the first face, respectively.

Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.

Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Abstract: A jet assembly has internals rotatably and releaseably fit to a jet body, such as that for a spa. The internals have a barrel housing, a rotor and a barrel inlet. The internals as screwed into the jet body. A first threaded portion outside the barrel threadably engages second threaded portion inside the jet body wherein the internals have delimited rotation therein to align and misalign the barrel inlet from a body inlet on the jet body to control flow on and off respectively. The threaded portion within the jet body can be a locking ring affixed therein by fasteners or integral with the jet body. Rotation can be delimited by a projection on the barrel and a cooperating annular delimiting surface on the locking ring, such as circumferentially-spaced detents.

Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.

Abstract: A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.