Abstract: A semiconductor-machine automatic leveling apparatus includes an inclination adjusting gear, a motor, a driving gear, an inclination acquisition mechanism and a controller. The inclination adjusting gear is configured to drive one side of a tabletop of a wafer transfer machine to move up and down. The driving gear is mounted on a rotation shaft of the motor and engaged with the inclination adjusting gear. The inclination acquisition mechanism is configured to acquire inclination information of the tabletop of the wafer transfer machine and electrically connected to the controller. The controller is electrically connected to the motor and configured to control the motor to operate according to the inclination information.

Abstract: This application provides a conveyor device and semiconductor production equipment, and relates to the technical field of semiconductor production equipment. The conveyor device is installed on a machine platform of semiconductor production equipment, the machine platform is provided with a guide structure, and the guide structure is provided with multiple oil injection ports arranged along an extension direction of the guide structure. The conveyor device includes a conveyor platform and a driving mechanism, where the conveyor platform is slidably installed on the guide structure to carry and convey wafers, the conveyor platform covers at least one of the multiple oil injection ports, and the driving mechanism is connected to the conveyor platform.

Abstract: The present disclosure provides a photomask inspection system and an inspection method. The mask inspection system includes: a mask thickness measuring device having sensor modules arranged side by side for measuring the thickness of the mask; a bar code reading device; a calibration device including a calibration rod and an electromagnet, the calibration rod includes a calibration stick and a calibration base, the electromagnet is set at the bottom of the calibration base, and the calibration device calibrates the barcode reading device.

Abstract: A wafer edge exposure apparatus includes a wafer carrying module, a reticle, a reticle driving module, an alignment module, an exposure module, and a control module; the wafer carrying module is configured to carry the wafer and drive the wafer to rotate; the wafer includes a valid region and an edge region surrounding the valid region; the reticle driving module is configured to drive the reticle to rotate; the alignment unit is configured to detect the alignment state of the reticle with the wafer; and the control module is configured to control the movement state of the wafer carrying module and the reticle driving module and configured to control the exposure module to perform wafer edge exposure on the wafer.

Abstract: The present disclosure provides a flow control equipment and an automatic refilling system. The flow control equipment includes: a housing, including a discharge hole in a bottom of the housing; a liquid inlet tube connecting with a top of the housing; a motor located in the housing; a flow locking blade and a plurality of flow control blades connected to the motor, where leakage holes of different sizes are formed in the flow control blades, and the motor drives the flow control blades and the flow locking blade to rotate to align the different leakage holes with the discharge hole, or to seal the discharge hole; and a liquid outlet tube connecting with the discharge hole.

Abstract: A photolithography device includes: a fixed slot, configured to install and fix the light source; a sensing module, configured to sense the distance information between the light source and the fixed slot; a prompt module, configured to send prompt information according to the distance information; and a determination module, configured to determine the installation status of the light source according to the prompt information.

Abstract: The present disclosure provides a photomask inspection system and an inspection method. The mask inspection system includes: a mask thickness measuring device having sensor modules arranged side by side for measuring the thickness of the mask; a bar code reading device; a calibration device including a calibration rod and an electromagnet, the calibration rod includes a calibration stick and a calibration base, the electromagnet is set at the bottom of the calibration base, and the calibration device calibrates the barcode reading device.

Abstract: This application provides a conveyor device and semiconductor production equipment, and relates to the technical field of semiconductor production equipment. The conveyor device is installed on a machine platform of semiconductor production equipment, the machine platform is provided with a guide structure, and the guide structure is provided with multiple oil injection ports arranged along an extension direction of the guide structure. The conveyor device includes a conveyor platform and a driving mechanism, where the conveyor platform is slidably installed on the guide structure to carry and convey wafers, the conveyor platform covers at least one of the multiple oil injection ports, and the driving mechanism is connected to the conveyor platform.

Abstract: The present application provides a machine cleaning device. The machine cleaning device includes: a guide rail arranged next to a carrying platform of the machine main body, a support slidably mounted on the guide rail, a cleaning component mounted on the support, a driving device connected to the support in a transmission way, and a controller connected to the driving device; and when the cleaning component cleans the top surface of the machine main body, the controller controls the driving device to drive the support to move along the guide rail, so as to drive the cleaning component to clean the top surface of the machine main body in a direction away from the carrying platform. So that unexpected particles are reduced to fall on the carrying platform and contaminate the carrying platform during the cleaning process.

Abstract: The present disclosure relates to a wafer processing apparatus and a wafer transfer method. The wafer processing apparatus includes: a first machine; a second machine, including a manipulator, the manipulator transfers a wafer to the machine through a connection port; the connection port is provided between the first machine and the second machine; door panels, provided on the first machine and used to close the connection port; a detector, for detecting a current position of the door panel; a driver, connected to the door panel, for driving the door panel to move to open or close the connection port; and a controller, connected to the detector, the driver and the manipulator, for controlling the door panel to move according to the current position of the door panel to open or close the connection port, and control the manipulator to transfer the wafer.

Abstract: A reticle detection apparatus includes a processing unit, an optical detection unit, and an auxiliary detection unit; the optical detection unit is configured to determine whether there is a reticle according to the intensity of the received light; the processing unit is configured to start the auxiliary detection unit when the optical detection unit does not detect the reticle; the auxiliary detection unit is configured to detect whether there is a reticle based on the piezoelectric effect or the acoustoelectric effect; wherein, after the auxiliary detection unit is started, the processing unit is configured to serve the detection result of the auxiliary detection unit as a basis for determining whether there is a reticle.

Abstract: A valve control system and a valve control method can improve working efficiency and security of the operator. The valve control system includes: a regulating valve, mounted to a pipeline to control the opening or closing of the pipeline; an driving device, connected to the regulating valve and configured to control the regulation of the regulating valve; a detector, mounted to the pipeline and configured to detect fluid pressure in the pipeline; a first controller, connected to the driving device and the detector and configured to control the driving device; and a second controller which can perform data interaction with the first controller, wherein the first controller can perform corresponding regulation according to an instruction from the second controller.

Abstract: A photolithography device includes: a fixed slot, configured to install and fix the light source; a sensing module, configured to sense the distance information between the light source and the fixed slot; a prompt module, configured to send prompt information according to the distance information; and a determination module, configured to determine the installation status of the light source according to the prompt information.

Abstract: A wafer edge exposure apparatus includes a wafer carrying module, a reticle, a reticle driving module, an alignment module, an exposure module, and a control module; the wafer carrying module is configured to carry the wafer and drive the wafer to rotate; the wafer includes a valid region and an edge region surrounding the valid region; the reticle driving module is configured to drive the reticle to rotate; the alignment unit is configured to detect the alignment state of the reticle with the wafer; and the control module is configured to control the movement state of the wafer carrying module and the reticle driving module and configured to control the exposure module to perform wafer edge exposure on the wafer.

Abstract: A cleaning system is integrated in an exposure machine including an immersion cover and a workbench arranged to be movable in translation below immersion cover. The cleaning system includes an image acquisition component, a cleaning component, and a controller. The image acquisition component is configured to acquire image information of a through hole of immersion cover. The cleaning component includes a cleaning pipe disposed inside workbench and having a first end extending out of a top surface of workbench, and a vacuum pump connected to a second end of cleaning pipe. The controller is configured to judge whether through hole is blocked according to image information, control workbench to be moved in translation so that first end of cleaning pipe is located directly below blocked through hole, and control vacuum pump to apply a negative pressure to blocked through hole through cleaning pipe to clean immersion cover.

Abstract: A system for monitoring a closed state of a cover of an exposure machine includes a servo motor, a photoelectric encoder, and a controller. A shaft of the servo motor is coaxially fixedly connected to a shaft of the cover. The photoelectric encoder is provided on the servo motor, and is configured to detect an angle of rotation of the shaft of the servo motor. The controller is connected to the servo motor and the photoelectric encoder, and is configured to control rotation of the shaft of the servo motor and determine whether the cover is in the closed state according to the angle.

Abstract: A storage system for reticles includes carrier devices, including reticle placing regions for placing the reticles; a storage device, storing a preset coordinate system and position information of the carrier devices in the preset coordinate system; detection devices, arranged in one-to-one correspondence with the carrier devices, where each detection device performs reticle detection on a respective carrier device, send first detection signal responsive to a reticle being placed in the reticle placing region, and send second detection signal responsive to a reticle being placed outside the reticle placing region, the detection devices are connected with the storage device, and the storage device is further configured to store reticle position information of the reticle in the preset coordinate system when receiving the first or second detection signal; and alarm devices, connected with the detection devices in one-to-one correspondence, where each alarm device implements alarm display when receiving the seco

Abstract: A semiconductor-machine automatic leveling apparatus includes an inclination adjusting gear, a motor, a driving gear, an inclination acquisition mechanism and a controller. The inclination adjusting gear is configured to drive one side of a tabletop of a wafer transfer machine to move up and down. The driving gear is mounted on a rotation shaft of the motor and engaged with the inclination adjusting gear. The inclination acquisition mechanism is configured to acquire inclination information of the tabletop of the wafer transfer machine and electrically connected to the controller. The controller is electrically connected to the motor and configured to control the motor to operate according to the inclination information.