Patents by Inventor Y Kuang Huang

Y Kuang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of making a semiconductor device
    Patent number: 11011446
    Abstract: A semiconductor device and a method of making the same. The device includes a semiconductor substrate having a major surface, a backside and side surfaces extending between the major surface and the backside. The semiconductor device also includes at least one metal layer extending across the backside of the substrate. A peripheral part of the at least one metal layer located at the edge of the substrate between the backside and at least one of the side surfaces extends towards a plane containing the major surface. This can prevent burrs located at the peripheral part of the at least one metal layer interfering with the mounting of the backside of the substrate on the surface of a carrier.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: May 18, 2021
    Assignee: NEXPERIA B.V.
    Inventors: Tonny Kamphuis, Leo van Gemert, Hans van Rijckevorsel, Sascha Moeller, Hartmut Buenning, Steffen Holland, Y Kuang Huang
  • SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
    Publication number: 20170148697
    Abstract: A semiconductor device and a method of making the same. The device includes a semiconductor substrate having a major surface, a backside and side surfaces extending between the major surface and the backside. The semiconductor device also includes at least one metal layer extending across the backside of the substrate. A peripheral part of the at least one metal layer located at the edge of the substrate between the backside and at least one of the side surfaces extends towards a plane containing the major surface. This can prevent burrs located at the peripheral part of the at least one metal layer interfering with the mounting of the backside of the substrate on the surface of a carrier.
    Type: Application
    Filed: November 3, 2016
    Publication date: May 25, 2017
    Inventors: Tonny Kamphuis, Leo van Gemert, Hans van Rijckevorsel, Sascha Moeller, Hartmut Buenning, Steffen Holland, Y Kuang Huang