Patents by Inventor Ya Chen

Ya Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985576
    Abstract: For sidelink vehicle-to-everything (V2X) transmission, a first user equipment (UE) obtains time-and-frequency resources that are bounded by two subchannel boundaries and two slot boundaries. The first UE transmits encoded control information to a second UE in a Physical Sidelink Control Channel (PSCCH) that occupies a first portion of the time-and-frequency resources starting from a lowest resource block (RB) in a lowest subchannel and from an earliest symbol available for sidelink control and data transmission. The first UE further transmits encoded data to the second UE in a Physical Sidelink Shared Channel (PSSCH) that occupies a second portion of the time-frequency resources. The second portion includes (a) a first set of RBs in the same symbols as the PSCCH and not used by the PSCCH, and (b) a second set of RBs in symbols not used by the PSCCH.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: May 14, 2024
    Assignee: MediaTek Inc.
    Inventors: Chien-Yi Wang, Ju-Ya Chen
  • Patent number: 11984516
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: May 14, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11975593
    Abstract: A heat pump system, a heat management method and a vehicle are provided. The heat pump system includes an integrated heat exchanger integrated with a superconducting liquid flow passage and a refrigerant flow passage. The refrigerant flow passage is provided inside an on-board refrigerant circulation loop and is used for cooling and/or heating to adjust the temperature within a passenger compartment of a vehicle. The superconducting liquid flow passage is in communication with a motor heat dissipating conduit, for absorbing the heat generated by an on board motor and transferring the heat to the integrated heat exchanger by means of phase change heat transfer. The heat pump system can increase the energy utilization rate for the vehicle and reduce the allowable ambient temperature of the heat pump system.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: May 7, 2024
    Assignees: ZHEJIANG GEELY HOLDING GROUP CO., LTD., CHONGQING LIVAN AUTOMOBILE R&D INSTITUTE CO., LTD
    Inventors: Lanbao Cao, Quankai Yang, Zhonggang Liu, Xiujuan Xu, Yanlin Liu, Guopin Tong, Chao Gao, Yanli Wang, Songyan Li, Ya Cui, Jingyu Chen, Feng Qiu, Jiaqi Zhang
  • Publication number: 20240138696
    Abstract: The present disclosure provides apparatuses and computer readable media for measuring sub-epidermal moisture in patients to determine damaged tissue for clinical intervention. The present disclosure also provides methods for determining damaged tissue.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Applicant: BRUIN BIOMETRICS, LLC
    Inventors: Martin BURNS, Sara BARRINGTON, Graham ROSS, Ya-Chen TONAR, Shannon RHODES, Marta CLENDENIN, Kindah JARADEH
  • Publication number: 20240137504
    Abstract: A method for encoding a video is provided, wherein encoding the video comprises classifying samples of a first picture, determining, for at least one part of the first picture, a first filter based on said classification, said first filter being used for a first encoding operation of the first picture or of a second picture, determining a second filter based on said classification, said second filter being used for a second encoding operation of the first picture or of the second picture. An apparatus for encoding a video, decoding method and apparatus are also provided.
    Type: Application
    Filed: February 2, 2022
    Publication date: April 25, 2024
    Inventors: Philippe Bordes, Franck Galpin, Thierry Dumas, Antoine Robert, Karam Naser, Ya Chen
  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Publication number: 20240128127
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-l Fu, Chun-ya Chiu, Chi-Ting Wu, Chin-HUNG Chen, Yu-Hsiang Lin
  • Patent number: 11962807
    Abstract: Encoding or decoding syntax information associated with video information can involve identifying a coding context associated with a syntax element of a current coding unit of the video information, wherein the identifying occurs without using a syntax element of a neighboring block, and encoding or decoding the syntax element of the current coding unit based on the coding context.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: April 16, 2024
    Assignee: InterDigital VC Holdings, Inc.
    Inventors: Ya Chen, Fabrice Leleannec, Tangi Poirier
  • Patent number: 11962753
    Abstract: A decoding method is presented. An illumination compensation parameter is first determined for a current block of a picture. The illumination compensation parameter is determined from one or more illumination compensation parameters or from one or more reconstructed samples of at least one spatially neighbor block only in the case where said at least one spatially neighbor block belongs to the same local illumination compensation group as the current block, called current local illumination compensation group. Finally, the current block is reconstructed using the determined illumination compensation parameter.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 16, 2024
    Assignee: InterDigital VC Holdings, Inc.
    Inventors: Ya Chen, Tangi Poirier, Philippe Bordes, Fabrice Leleannec, Franck Galpin
  • Publication number: 20240120640
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20240121423
    Abstract: A video codec can involve processing video information based on a motion model involving a coding unit including a plurality of sub-blocks, such as an affine motion model, to produce motion compensation information, obtaining a local illumination compensation model, and encoding or decoding the video information based on the motion compensation information and the local illumination compensation model.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 11, 2024
    Applicant: InterDigital VC Holdings, Inc.
    Inventors: Ya Chen, Franck Galpin, Tangi Poirier
  • Patent number: 11953500
    Abstract: The present invention provides a detection reagent and therapeutic target for B cell tumor after targeted therapy and related applications. The reagent composition comprises 3 groups of antibodies, with the first group of antibodies including an anti-CD38 antibody, an anti-CD10 antibody, an anti-CD34 antibody, an anti-CD19 antibody, an anti-CD24 an antibody, an anti-CD20 antibody, an anti-CD81 antibody, an anti-CD45 antibody; the second group of antibodies including an anti-CD38 antibody, an anti-CD10 antibody, an anti-CD34 antibody, an anti-CD19 antibody, an anti-CD20 antibody, an anti-CD72 antibody, an anti-CD45 antibody; and the third group of antibodies including an anti-cytoplasmic CD79a antibody. The reagent composition of the present invention can be applied for the detection of B-lymphocyte tumors after targeted therapy by flow cytometry.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: April 9, 2024
    Assignees: Synarc Research Laboratory (Beijing) Ltd., HEBEI YANDA LUDAOPEI HOSPITAL
    Inventors: Hui Wang, Man Chen, Aixian Wang, Meiwei Gong, Xueying Wu, Junyi Zhen, Qing Du, Ya Guo
  • Publication number: 20240113166
    Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
  • Patent number: 11943936
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first transistor, a first resistive random access memory (RRAM) resistor, and a second RRAM resistor. The first resistor includes a first resistive material layer, a first electrode shared by the second resistor, and a second electrode. The second resistor includes the first electrode, a second resistive material layer, and a third electrode. The first electrode is electrically coupled to the first transistor.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Der Chih, May-Be Chen, Yun-Sheng Chen, Jonathan Tsung-Yung Chang, Wen Zhang Lin, Chrong Jung Lin, Ya-Chin King, Chieh Lee, Wang-Yi Lee
  • Patent number: 11935787
    Abstract: A semiconductor device includes a first gate structure disposed on a substrate and extending in a first direction. The first gate structure includes a first gate electrode, a first cap insulating layer disposed over the first gate electrode, first sidewall spacers disposed on opposing side faces of the first gate electrode and the first cap insulating layer and second sidewall spacers disposed over the first sidewall spacers. The semiconductor device further includes a first protective layer formed over the first cap insulating layer, the first sidewall spacers and the second sidewall spacers. The first protective layer has a ?-shape having a head portion and two leg portions in a cross section along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hui-Chi Chen, Hsiang-Ku Shen, Jeng-Ya Yeh
  • Publication number: 20240088293
    Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
  • Publication number: 20240085797
    Abstract: A method of controlling an extreme ultraviolet (EUV) lithography system is disclosed. The method includes irradiating a target droplet with EUV radiation, detecting EUV radiation reflected by the target droplet, determining aberration of the detected EUV radiation, determining a Zernike polynomial corresponding to the aberration, and performing a corrective action to reduce a shift in Zernike coefficients of the Zernike polynomial.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ya CHENG, Han-Lung CHANG, Shi-Han SHANN, Li-Jui CHEN, Yen-Shuo SU
  • Publication number: 20240089449
    Abstract: An encoding method is presented. Transform coefficients of a block are first obtained. They are then scanned according to a scan pattern for entropy coding. The scan pattern is determined responsive to a shape of the block.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: InterDigital VC Holdings, Inc.
    Inventors: Ya Chen, Tangi Poirier, Karam Naser
  • Patent number: 11930663
    Abstract: A display panel includes a first substrate, pixel structures, a first common pad, a second substrate, a second common electrode, a display medium and a conductive particle. The pixel structures are disposed on an active area of the first substrate. The first common pad is disposed on a peripheral area of the first substrate, and is electrically connected to first common electrodes of the pixel structures. The second common electrode is disposed on the second substrate. The conductive particle is disposed on the first common pad, and is electrically connected to the first common pad and the second common electrode. The conductive particle includes a core and a conductive film disposed on a surface of the core, where the conductive film has a main portion and raised portions, and a film thickness of each of the raised portions is greater than a film thickness of the main portion.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: March 12, 2024
    Assignee: Au Optronics Corporation
    Inventors: Bo-Chen Chen, Yun-Ru Cheng, Ya-Ling Hsu, Chia-Hsuan Pai, Cheng-Wei Huang, Wei-Shan Chao
  • Patent number: D1017794
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: March 12, 2024
    Assignee: Changsha Ruoya Information Technology Co., Ltd.
    Inventor: Ya Chen