Patents by Inventor Ya-Jing Yang
Ya-Jing Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230106533Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.Type: ApplicationFiled: December 9, 2022Publication date: April 6, 2023Inventors: Ya-Jing Yang, Po Nan Chen, Yu-Jui Hsieh
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Patent number: 11581353Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.Type: GrantFiled: May 14, 2020Date of Patent: February 14, 2023Assignee: Himax Technologies LimitedInventors: Ya-Jing Yang, Po Nan Chen, Yu-Jui Hsieh
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Patent number: 11476374Abstract: A sensor device provided in the disclosure includes a sensor substrate, a first transparent layer, a collimator layer, and a lens. The first transparent layer is disposed on the sensor substrate, wherein the first transparent layer defines an alignment structure. The collimator layer is disposed on the first transparent layer. The lens is disposed on the collimator layer.Type: GrantFiled: May 21, 2020Date of Patent: October 18, 2022Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Patent number: 11415844Abstract: A liquid crystal display includes a first substrate, a pixel array, a first pad, a dielectric layer, a filling pattern, a first conductor, a second substrate and a liquid crystal layer. The first substrate has a display area and a pad area located outside the display area. The pixel array is disposed on the display area. The first pad is disposed on the pad area. The dielectric layer has a first opening overlapped with the first pad. The filling pattern is disposed within the first opening of the dielectric layer. The filling pattern has through holes, and the through holes of the filling pattern are overlapped with the first pads. The first conductor is disposed in the first opening of the dielectric layer, and is electrically connected to the first pad via the through holes of the filling pattern.Type: GrantFiled: August 14, 2019Date of Patent: August 16, 2022Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Po-Nan Chen, Ya-Jing Yang, Yu-Jui Hsieh
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Publication number: 20220123160Abstract: A sensor device provided in the disclosure includes a sensor substrate, a first transparent layer, a collimator layer, and a lens. The first transparent layer is disposed on the sensor substrate, wherein the first transparent layer defines an alignment structure. The collimator layer is disposed on the first transparent layer. The lens is disposed on the collimator layer.Type: ApplicationFiled: December 29, 2021Publication date: April 21, 2022Applicant: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Patent number: 11257858Abstract: A method of fabricating a sensor device including at least the following steps is provided. An optical film stack is formed on a sensor substrate, wherein the sensor substrate includes a sensor region and a pad region beside the sensor region, and the optical film stack covers the sensor region while exposes the pad region. A releasing pattern is formed on the pad region. A lens material layer is formed on the sensor substrate to cover the releasing pattern and the optical film stack. The releasing pattern is removed from the sensor substrate to expose the pad region by patterning the lens material layer to form a lens on the optical film stack.Type: GrantFiled: April 28, 2020Date of Patent: February 22, 2022Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Patent number: 11249245Abstract: A patterned light guide structure includes a transparent substrate with a first side and with a second side, an anti-reflective layer directly attached to the first side, a first light-shielding layer directly disposed on the anti-reflective layer, a second light-shielding layer directly disposed on the second side, and a protecting layer directly disposed on the first light-shielding layer to keep the first light-shielding layer from any deteriorating damage.Type: GrantFiled: September 5, 2019Date of Patent: February 15, 2022Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Publication number: 20210367087Abstract: A sensor device provided in the disclosure includes a sensor substrate, a first transparent layer, a collimator layer, and a lens. The first transparent layer is disposed on the sensor substrate, wherein the first transparent layer defines an alignment structure. The collimator layer is disposed on the first transparent layer. The lens is disposed on the collimator layer.Type: ApplicationFiled: May 21, 2020Publication date: November 25, 2021Applicant: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Publication number: 20210358989Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.Type: ApplicationFiled: May 14, 2020Publication date: November 18, 2021Inventors: Ya-Jing Yang, Po Nan Chen, Yu-Jui Hsieh
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Publication number: 20210335881Abstract: A method of fabricating a sensor device including at least the following steps is provided. An optical film stack is formed on a sensor substrate, wherein the sensor substrate includes a sensor region and a pad region beside the sensor region, and the optical film stack covers the sensor region while exposes the pad region. A releasing pattern is formed on the pad region. A lens material layer is formed on the sensor substrate to cover the releasing pattern and the optical film stack. The releasing pattern is removed from the sensor substrate to expose the pad region by patterning the lens material layer to form a lens on the optical film stack.Type: ApplicationFiled: April 28, 2020Publication date: October 28, 2021Applicant: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Publication number: 20210072456Abstract: A patterned light guide structure includes a transparent substrate with a first side and with a second side, an anti-reflective layer directly attached to the first side, a first light-shielding layer directly disposed on the anti-reflective layer, a second light-shielding layer directly disposed on the second side, and a protecting layer directly disposed on the first light-shielding layer to keep the first light-shielding layer from any deteriorating damage.Type: ApplicationFiled: September 5, 2019Publication date: March 11, 2021Inventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Publication number: 20210048701Abstract: A liquid crystal display includes a first substrate, a pixel array, a first pad, a dielectric layer, a filling pattern, a first conductor, a second substrate and a liquid crystal layer. The first substrate has a display area and a pad area located outside the display area. The pixel array is disposed on the display area. The first pad is disposed on the pad area. The dielectric layer has a first opening overlapped with the first pad. The filling pattern is disposed within the first opening of the dielectric layer. The filling pattern has through holes, and the through holes of the filling pattern are overlapped with the first pads. The first conductor is disposed in the first opening of the dielectric layer, and is electrically connected to the first pad via the through holes of the filling pattern.Type: ApplicationFiled: August 14, 2019Publication date: February 18, 2021Applicant: HIMAX TECHNOLOGIES LIMITEDInventors: Po-Nan Chen, Ya-Jing Yang, Yu-Jui Hsieh
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Patent number: 10211254Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.Type: GrantFiled: January 12, 2018Date of Patent: February 19, 2019Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang
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Publication number: 20180138233Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.Type: ApplicationFiled: January 12, 2018Publication date: May 17, 2018Inventors: Yu-Jui HSIEH, Po-Nan CHEN, Ya-Jing YANG
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Publication number: 20180076258Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.Type: ApplicationFiled: September 11, 2016Publication date: March 15, 2018Inventors: Yu-Jui HSIEH, Po-Nan CHEN, Ya-Jing YANG
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Patent number: 9917134Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.Type: GrantFiled: September 11, 2016Date of Patent: March 13, 2018Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Yu-Jui Hsieh, Po-Nan Chen, Ya-Jing Yang