Patents by Inventor Ya Yang
Ya Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11980290Abstract: A blank dummy structure adaptable for slide rails and absence of slide rails, the blank dummy structure includes a main plate, two buckles, two rotating members, and two fasteners. The buckle comprises a snap component, the snap component is connected with the main plate to slide between first and second positions on the main plate. The rotating member and the snap component are arranged on the same side of the main plate, the rotating member on the main plate, comprises a limiting component. the rotating member being rotatably connected with the main plate to rotate the rotating member between a limit position and an avoidance position. The fastener configured to cooperate with the rack when the rotating member is in the avoidance position. The buckle, the rotating member, and the fastener are mounted on the main plate. A rack is also disclosed.Type: GrantFiled: August 23, 2022Date of Patent: May 14, 2024Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Bin-Bin Yang, Han-Yu Li, Cheng-He Li, Meng-Ya Cui
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Patent number: 11975593Abstract: A heat pump system, a heat management method and a vehicle are provided. The heat pump system includes an integrated heat exchanger integrated with a superconducting liquid flow passage and a refrigerant flow passage. The refrigerant flow passage is provided inside an on-board refrigerant circulation loop and is used for cooling and/or heating to adjust the temperature within a passenger compartment of a vehicle. The superconducting liquid flow passage is in communication with a motor heat dissipating conduit, for absorbing the heat generated by an on board motor and transferring the heat to the integrated heat exchanger by means of phase change heat transfer. The heat pump system can increase the energy utilization rate for the vehicle and reduce the allowable ambient temperature of the heat pump system.Type: GrantFiled: February 17, 2020Date of Patent: May 7, 2024Assignees: ZHEJIANG GEELY HOLDING GROUP CO., LTD., CHONGQING LIVAN AUTOMOBILE R&D INSTITUTE CO., LTDInventors: Lanbao Cao, Quankai Yang, Zhonggang Liu, Xiujuan Xu, Yanlin Liu, Guopin Tong, Chao Gao, Yanli Wang, Songyan Li, Ya Cui, Jingyu Chen, Feng Qiu, Jiaqi Zhang
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Publication number: 20240145581Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ya-Wen CHIU, Yi Che CHAN, Lun-Kuang TAN, Zheng-Yang PAN, Cheng-Po CHAU, Pin-Chu LIANG, Hung-Yao CHEN, De-Wei YU, Yi-Cheng LI
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Publication number: 20240088023Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
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Patent number: 11928582Abstract: Embodiments of the invention provide a system, media, and method for deep learning applications in physical design verification. Generally, the approach includes maintaining a pattern library for use in training machine learning model(s). The pattern library being generated adaptively and supplemented with new patterns after review of new patterns. In some embodiments, multiple types of information may be included in the pattern library, including validation data, and parameter and anchoring data used to generate the patterns. In some embodiments, the machine learning processes are combined with traditional design rule analysis. The patterns being generated and adapted using a lossless process that encodes the information of a corresponding area of a circuit layout.Type: GrantFiled: December 31, 2018Date of Patent: March 12, 2024Assignee: Cadence Design Systems, Inc.Inventors: Piyush Pathak, Haoyu Yang, Frank E. Gennari, Ya-Chieh Lai
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Publication number: 20240024492Abstract: The present application relates to an asymmetric RNAi-inducing nucleic acid molecule which inhibits the expression of retinoid-related orphan nuclear receptor-beta (ROR-beta) and use thereof, and more particularly to an asymmetric RNAi-inducing nucleic acid molecule comprising an antisense strand comprising a sequence complementary to mRNA encoding ROR-beta, and a sense strand forming complementary bonds with the antisense strand, and a pharmaceutical composition for ameliorating or treating a retinal disease, comprising the asymmetric RNAi-inducing nucleic acid molecule.Type: ApplicationFiled: December 6, 2021Publication date: January 25, 2024Inventors: Hye Won CHUNG, June Hyun PARK, Seung Ya YANG
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Patent number: 11764162Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.Type: GrantFiled: August 19, 2020Date of Patent: September 19, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 11723144Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.Type: GrantFiled: September 2, 2021Date of Patent: August 8, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 11432140Abstract: A multicast service processing method and an access point are disclosed. The method includes: generating, by an access point (AP), a first group addressed frame and an individually addressed frame based on a multicast packet, where the first group addressed frame is encrypted by a first multicast key, and the individually addressed frame is encrypted by a unicast key of a second terminal.Type: GrantFiled: September 6, 2019Date of Patent: August 30, 2022Assignee: Huawei Technologies Co., Ltd.Inventors: Lin Zhang, Ya Yang, Xiaojun Wang
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Publication number: 20220225493Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.Type: ApplicationFiled: September 2, 2021Publication date: July 14, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
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Publication number: 20220118093Abstract: Disclosed are a double stranded oligonucleotide construct, configured such that a hydrophilic material and a hydrophobic material are conjugated through a simple covalent bond or a linker-mediated covalent bond to both ends of a double stranded oligonucleotide in order to efficiently deliver an androgen-receptor-specific oligonucleotide into a cell, a nanoparticle capable of being produced by self-assembling double stranded oligonucleotide constructs in an aqueous solution through hydrophobic interactions, and a composition for preventing hair loss or promoting hair growth containing the double stranded oligonucleotide construct.Type: ApplicationFiled: November 18, 2019Publication date: April 21, 2022Inventors: Han-Oh PARK, Sung II YUN, Sang-Jin BYUN, Myeong-Mi LEE, Seung Ya YANG
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Patent number: 11152954Abstract: A decoding method is provided, and the method includes performing a decoding operation on a plurality of data bit value sets of a codeword. The decoding operation includes following steps: (1) obtaining a syndrome of the data bit value sets; (2) determining whether the codeword is correct or incorrect according to the latest obtained syndrome, wherein if the codeword is correct, the decoding operation is ended, wherein if the codeword is wrong, continuing to step (3) to start an iterative operation; (3) obtaining a plurality of error value sets respectively corresponding to the data bit value sets, wherein in response to obtaining a first error value set, steps (4) and (5) are performed simultaneously; (4) performing an extreme value search operation; (5) performing a bit-flipping operation; and (6) performing a syndrome calculation operation after the step (5) is completed, and performing step (2).Type: GrantFiled: June 25, 2018Date of Patent: October 19, 2021Assignee: Shenzhen EpoStar Electronics Limited CO.Inventors: Yu-Hua Hsiao, Ting-Ya Yang, Yuan-Syun Wu
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Patent number: 11069633Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.Type: GrantFiled: July 6, 2018Date of Patent: July 20, 2021Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Publication number: 20210210435Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.Type: ApplicationFiled: August 19, 2020Publication date: July 8, 2021Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 10587037Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.Type: GrantFiled: December 16, 2013Date of Patent: March 10, 2020Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang, Yude Chu
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Patent number: 10530596Abstract: A method for setting a packet transmission mode and a device are provided, and relate to the communications field. To optimize sending of a multicast packet, both robustness and resource consumption are considered. A specific solution is as follows: when a packet amount in a packet cache queue exceeds a first threshold, changing a state of a first multicast group to multicast transmission, where a state that is of the first multicast group and that is before the change is multicast-to-unicast transmission. Technical solutions of this disclosure are used for setting a packet transmission mode.Type: GrantFiled: September 14, 2017Date of Patent: January 7, 2020Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Ya Yang, Lin Zhang, Yongxing Chen
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Publication number: 20190394639Abstract: A multicast service processing method and an access point are disclosed. The method includes: generating, by an access point (AP), a first group addressed frame and an individually addressed frame based on a multicast packet, where the first group addressed frame is encrypted by a first multicast key, and the individually addressed frame is encrypted by a unicast key of a second terminal.Type: ApplicationFiled: September 6, 2019Publication date: December 26, 2019Inventors: Lin Zhang, Ya Yang, Xiaojun Wang
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Publication number: 20190312593Abstract: A decoding method is provided, and the method includes performing a decoding operation on a plurality of data bit value sets of a codeword. The decoding operation includes following steps: (1) obtaining a syndrome of the data bit value sets; (2) determining whether the codeword is correct or incorrect according to the latest obtained syndrome, wherein if the codeword is correct, the decoding operation is ended, wherein if the codeword is wrong, continuing to step (3) to start an iterative operation; (3) obtaining a plurality of error value sets respectively corresponding to the data bit value sets, wherein in response to obtaining a first error value set, steps (4) and (5) are performed simultaneously; (4) performing an extreme value search operation; (5) performing a bit-flipping operation; and (6) performing a syndrome calculation operation after the step (5) is completed, and performing step (2).Type: ApplicationFiled: June 25, 2018Publication date: October 10, 2019Applicant: Shenzhen EpoStar Electronics Limited CO.Inventors: Yu-Hua Hsiao, Ting-Ya Yang, Yuan-Syun Wu
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Publication number: 20190214352Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.Type: ApplicationFiled: July 6, 2018Publication date: July 11, 2019Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 10230152Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.Type: GrantFiled: December 5, 2013Date of Patent: March 12, 2019Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang