Patents by Inventor Ya-Yen CHOU

Ya-Yen CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin, copper clad laminate made of resin, and printed circuit board
    Patent number: 11773262
    Abstract: A resin comprises at least one compound selected from one of the following formulas
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 3, 2023
    Assignee: A.C.R. TECH CO., LTD.
    Inventors: Shih-Hao Liao, Min-Yuan Yang, Ya-Yen Chou, Jheng-Hong Ciou, Cheng-Chung Chen
  • RESIN, COMPOSITION THEREOF AND COPPER CLAD LAMINATE MADE THEREOF
    Publication number: 20230193027
    Abstract: A resin, including a compound having the following Formula 1-1: wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.
    Type: Application
    Filed: December 5, 2022
    Publication date: June 22, 2023
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • BENZOXAZINE RESIN, COMPOSITION THEREOF AND COPPER CLAD LAMINATE MADE THEREOF
    Publication number: 20230193016
    Abstract: A benzoxazine resin, including a compound of the following Formula 1-1: where R1, R2, and R3 are as defined herein.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 22, 2023
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • RESIN, COPPER CLAD LAMINATE MADE OF RESIN, AND PRINTED CIRCUIT BOARD
    Publication number: 20200263031
    Abstract: A resin comprises at least one compound selected from one of the following formulas.
    Type: Application
    Filed: December 16, 2019
    Publication date: August 20, 2020
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN