Abstract: A p-aminobenzoic acid-producing microorganism is provided. The p-aminobenzoic acid-producing microorganism is obtained by a method for preparing a p-aminobenzoic acid-producing microorganism. The method for preparing a p-aminobenzoic acid-producing microorganism includes (a) performing an acclimation process on a source microorganism with at least one sulfonamide antibiotic to obtain at least one acclimatized microorganism and (b) screening out at least one p-aminobenzoic acid-producing microorganism from the at least one acclimatized microorganism, wherein the at least one p-aminobenzoic acid-producing microorganism has a higher p-aminobenzoic acid titer than the source microorganism.

Abstract: A computing system performs shared cache allocation to allocate cache resources to groups of tasks. The computing system monitors the bandwidth at a memory hierarchy device that is at a next level to the cache in a memory hierarchy of the computing system. The computing system estimates a change in dynamic power from a corresponding change in the bandwidth before and after the cache resources are allocated. The allocation of the cache resources are adjusted according to an allocation policy that receives inputs including the estimated change in the dynamic power and a performance indication of task execution.

Abstract: A computing system performs partial cache deactivation. The computing system estimates the leakage power of a cache based on operating conditions of the cache including voltage and temperature. The computing system further identifies a region of the cache as a candidate for deactivation based on cache hit counts. The computing system then adjusts the size of the region for the deactivation based on the leakage power and a bandwidth of a memory hierarchy device. The memory hierarchy device is at the next level to the cache in a memory hierarchy of the computing system.

Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Abstract: A filter test strip to filter and test a specimen in liquid includes a test element and a specimen filter assembly which is located on the test element and includes a filter cotton holding layer, a filter cotton layer and a cotton bonding layer. The filter cotton holding layer has a filter channel to allow the specimen in liquid to pass through. The filter cotton layer fills the filter channel. A gap is formed between the filter cotton holding layer and filter cotton layer. The cotton bonding layer is located below the filter cotton holding layer and bonded to the test element via an adhesive which masks the gap. Hence the specimen in liquid can be prevented from seeping out through the gap with passing through the filter cotton layer. Therefore, the specimen in liquid can fully be filtered by the filter cotton layer to enhance test accuracy.

Abstract: A filter test strip to filter and test a specimen in liquid includes a test element and a specimen filter assembly which is located on the test element and includes a filter cotton holding layer, a filter cotton layer and a cotton bonding layer. The filter cotton holding layer has a filter channel to allow the specimen in liquid to pass through. The filter cotton layer fills the filter channel. A gap is formed between the filter cotton holding layer and filter cotton layer. The cotton bonding layer is located below the filter cotton holding layer and bonded to the test element via an adhesive which masks the gap. Hence the specimen in liquid can be prevented from seeping out through the gap with passing through the filter cotton layer. Therefore, the specimen in liquid can fully be filtered by the filter cotton layer to enhance test accuracy.