Patents by Inventor Yafeng Shao

Yafeng Shao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971501
    Abstract: A sensor module includes a sensor module main body having a rectangular board provided with a radio radar sensor function, and a metallic case having a rectangular parallelepiped box shape in which an opening part opened at one face in a thickness direction is formed and a cut-out opening for drawing out a cable connecting the sensor module main body is formed on a side face, the opening part being closed by the board inserted through the opening part with a component disposed on a front face of the board facing toward a bottom part on the inner side, and the cable is inserted into at least a part of the cut-out opening, and the cut-out opening is formed to be symmetrical with respect to a plane passing through the center of the metallic case and perpendicular to a plane of the cut-out opening.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: April 30, 2024
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Kazuhiro Kosugi, Yafeng Shao, Wenjin Niu, Yun Zhu
  • Publication number: 20220026554
    Abstract: A sensor module includes a sensor module main body having a rectangular board provided with a radio radar sensor function, and a metallic case having a rectangular parallelepiped box shape in which an opening part opened at one face in a thickness direction is formed and a cut-out opening for drawing out a cable connecting the sensor module main body is formed on a side face, the opening part being closed by the board inserted through the opening part with a component disposed on a front face of the board facing toward a bottom part on the inner side, and the cable is inserted into at least a part of the cut-out opening, and the cut-out opening is formed to be symmetrical with respect to a plane passing through the center of the metallic case and perpendicular to a plane of the cut-out opening.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 27, 2022
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Kazuhiro Kosugi, Yafeng Shao, Wenjin Niu, Yun Zhu