Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.

Abstract: A clamping member and a battery accommodating device are provided. The battery accommodating device includes a body and a clamping member pivotally connected to the body. The clamping member has two arm parts, two protruding parts respectively extending from one side of the two arm parts, and an elastic structure connected to the two arm parts at two ends. When the battery is placed in an accommodating slot of the body, the elastic structure is pressed by the battery, and one end of the battery is clamped between the two protruding parts and the elastic structure. When the two protruding parts are pushed by an external force, the clamping member rotates relative to the body, and the elastic structure pushes up the battery, so as to release the clamped end of the battery.

Abstract: An electronic device with a connector structure is provided. The electronic device includes a first circuit board, a first connector, a first shielding cover, a second circuit board, a second connector, and a second shielding cover. The first connector is disposed on the first circuit board. The first shielding cover is disposed on the first circuit board and surrounds the first connector. The second connector is disposed on the second circuit board, wherein the second connector is connected to the first connector. The second shielding cover is disposed on the second circuit board and surrounds the second connector, wherein the first shielding cover is electrically connected to the second shielding cover.

Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.

Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.

Abstract: A clamping member and a battery accommodating device are provided. The battery accommodating device includes a body and a clamping member pivotally connected to the body. The clamping member has two arm parts, two protruding parts respectively extending from one side of the two arm parts, and an elastic structure connected to the two arm parts at two ends. When the battery is placed in an accommodating slot of the body, the elastic structure is pressed by the battery, and one end of the battery is clamped between the two protruding parts and the elastic structure. When the two protruding parts are pushed by an external force, the clamping member rotates relative to the body, and the elastic structure pushes up the battery, so as to release the clamped end of the battery.

Abstract: A light indicator module is provided. The light indicator module includes a circuit board, a plurality of light sources, a light guide unit, and a shielding material. The light sources are disposed on the circuit board, and each light source provides a light beam. The light guide unit includes a plurality of guiding blocks. Each guiding block includes a light emitting surface, a light entering side surface, and at least one abuttal side surface. One of the light sources corresponds to the light entering side surface. The light beam enters the guiding block through the light entering side surface and is emitted through the light emitting surface. The abuttal side surface faces toward an adjacent guiding block. The shielding material covers the abuttal side surface.

Abstract: An indicator module is provided, including a device housing, a circuit board, a plurality of light sources, a dividing structure, and a homogenizing plate. The device housing includes a transparent window. The circuit board is disposed in the device housing. The light sources are disposed on the circuit board, wherein each light source is adapted to provide a light beam. The dividing structure is disposed in the device housing, wherein the dividing structure defines a plurality of divided spaces, and the divided spaces respectively correspond to the light sources. The homogenizing plate is disposed in the device housing. The homogenizing plate corresponds to the divided spaces, wherein an air gap is formed between the transparent window and the homogenizing plate. The light beam enters the divided space from the light source, passes through the homogenizing plate and the air gap, and is emitted through the transparent window.

Abstract: An indicator module is provided, including a device housing, a circuit board, a plurality of light sources, a dividing structure, and a homogenizing plate. The device housing includes a transparent window. The circuit board is disposed in the device housing. The light sources are disposed on the circuit board, wherein each light source is adapted to provide a light beam. The dividing structure is disposed in the device housing, wherein the dividing structure defines a plurality of divided spaces, and the divided spaces respectively correspond to the light sources. The homogenizing plate is disposed in the device housing. The homogenizing plate corresponds to the divided spaces, wherein an air gap is formed between the transparent window and the homogenizing plate. The light beam enters the divided space from the light source, passes through the homogenizing plate and the air gap, and is emitted through the transparent window.

Abstract: A cabinet is provided, which is adapted to receive a device. The cabinet includes a plurality of first pillars, a plurality of second pillars, a plurality of track units, and two sliders. Each track unit is bridged between one of the first pillars and one of the second pillars. The sliders are disposed on two sides of the device, wherein the sliders are slidably connected to the track units. Each track unit includes a first connection base and a track portion. The first connection base is disposed on one end of the track portion. The first connection base includes a first connection side, a first base side, and a second base side. The first connection side is located between the first base side and the second base side. The first connection side is connected to the first pillar.

Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Abstract: An electronic device with a connector structure is provided. The electronic device includes a first circuit board, a first connector, a first shielding cover, a second circuit board, a second connector, and a second shielding cover. The first connector is disposed on the first circuit board. The first shielding cover is disposed on the first circuit board and surrounds the first connector. The second connector is disposed on the second circuit board, wherein the second connector is connected to the first connector. The second shielding cover is disposed on the second circuit board and surrounds the second connector, wherein the first shielding cover is electrically connected to the second shielding cover.

Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.

Abstract: A cabinet is provided, which is adapted to receive a device. The cabinet includes a plurality of first pillars, a plurality of second pillars, a plurality of track units, and two sliders. Each track unit is bridged between one of the first pillars and one of the second pillars. The sliders are disposed on two sides of the device, wherein the sliders are slidably connected to the track units. Each track unit includes a first connection base and a track portion. The first connection base is disposed on one end of the track portion. The first connection base includes a first connection side, a first base side, and a second base side. The first connection side is located between the first base side and the second base side. The first connection side is connected to the first pillar.

Abstract: Provided herein is a method for manufacturing a semiconductor device. A substrate including a MEMS region and a connection region thereon is provided; a dielectric layer disposed on the substrate in the connection region is provided; a poly-silicon layer disposed on the dielectric layer is provided, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer is provided; and a passivation layer covering the dielectric layer is provided, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer, and a conductive layer conformally covering the connection pad and the poly-silicon layer in the transition region is provided.

Abstract: Provided herein is a method for manufacturing a semiconductor device. A substrate including a MEMS region and a connection region thereon is provided; a dielectric layer disposed on the substrate in the connection region is provided; a poly-silicon layer disposed on the dielectric layer is provided, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer is provided; and a passivation layer covering the dielectric layer is provided, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer, and a conductive layer conformally covering the connection pad and the poly-silicon layer in the transition region is provided.

Abstract: Provided herein is a semiconductor device is provided. The semiconductor device includes a substrate including a MEMS region and a connection region thereon; a dielectric layer disposed on the substrate in the connection region; a poly-silicon layer disposed on the dielectric layer, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer; and a passivation layer covering the dielectric layer, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer.

Abstract: A microelectromechanical system microphone includes a semiconductor-on-insulator structure, a plurality of resistors, a plurality of first openings, and a vent hole. The semiconductor-on-insulator structure includes a substrate, an insulating layer and a semiconductor layer. The resistors are formed in the semiconductor layer, the first openings are formed in the semiconductor layer, and the vent hole is formed in the insulating layer and the substrate. The resistors are connected to each other to form a resistor pattern, and the first openings are all formed within the resistor pattern.

Abstract: Provided herein is a semiconductor device is provided. The semiconductor device includes a substrate including a MEMS region and a connection region thereon; a dielectric layer disposed on the substrate in the connection region; a poly-silicon layer disposed on the dielectric layer, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer; and a passivation layer covering the dielectric layer, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer.