Abstract: A carrier device in semiconductor processing equipment includes a base and an edge ring. The base includes a base body configured to carry a wafer and has an outer diameter smaller than a diameter of the wafer. The edge ring surrounds the base and has an outer diameter greater than the diameter of the wafer. An outer circumferential surface of the base body faces and is spaced from an inner circumferential surface of the edge ring to form a first annular channel. The first annular channel communicates with a gas supply system. When the base body carries the wafer, an upper surface of the edge ring faces and is spaced from a lower surface of the wafer to form a second annular channel. The first annular channel communicates with the second annular channel.

Abstract: Systems and methods of providing X-ray optics are described. The optics are formed from CVD thin film diamond. The optics lave three sections that include a tip on which X-rays impinge, a base, and an intermediate section connecting the base and the tip. The intermediate section tapers from the base to the tip. The base has a substantially larger thickness than the tip. The base is disposed within a holder that securely retains the optics to provide vibration control, while the tip is thin enough to provide thermal management and reduce crystal strain.

Abstract: Generally discussed herein are Battery Thermal Management (BTM) devices, systems, and methods. A BTM device can include one or more battery cells, and one or more minichannel tubes attached to the one or more battery cells so as to thermally contact to the one or more battery cells, such as to maintain the one or more battery cells within a predetermined temperature range.