Abstract: A lead frame includes a die pad and electrical leads. An integrated circuit chip is mounted to the die pad. An encapsulating package has a perimeter defined by first, second, third and fourth sidewalls. The electrical leads extend from the opposed first and second sidewalls of the package. At least one sidewall of the opposed third and fourth sidewalls of the package includes a V-shaped concavity functioning to increase a creepage distance between the electrical leads at the opposed first and second sidewalls.

Abstract: A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.

Abstract: Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe.

Abstract: Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.

Abstract: An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

Abstract: A semiconductor device is disclosed having a leadframe comprising a first chip island and a second chip island. Each chip island of the leadframe has a first face and a second face. A first chip is attached to the first face of the first chip island and a second chip attached to the first face of the second chip island. A layer of encapsulation material forming an encapsulation material layer covers the second faces of the first and second chip islands where the thickness of the encapsulation material layer along the second face of the first chip island is different from the thickness of the encapsulation material layer along the second face of the second chip island.

Abstract: There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.

Abstract: A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.

Abstract: Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe.

Abstract: An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

Abstract: Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.

Abstract: The rotational orientation of a die pad about its longitudinal axis is determined. The desired rotational orientation of a semiconductor chip to be attached to the die pad is determined. A molding die is provided which comprises a body with a cavity disposed in a bottom surface. The rotational orientation of the body of the molding die about its longitudinal axis is determined. The cavity is positioned in the body of the molding die with a rotational orientation such that the cavity is rotated with respect to the molding die by an angle corresponding to the desired rotational orientation of the semiconductor chip with respect to the die pad.

Abstract: There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.