Patents by Inventor Yang Yoon Choi

Yang Yoon Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method of manufacturing same
    Patent number: 9788421
    Abstract: A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: October 10, 2017
    Assignee: Tyco Electronics AMP Korea Ltd.
    Inventors: Yang Yoon Choi, Ok Ky Beak
  • Printed circuit board and manufacturing method therefor
    Patent number: 9769921
    Abstract: A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: September 19, 2017
    Assignee: Tyco Electronics AMP Korea Ltd.
    Inventors: Yang Yoon Choi, Ok Ky Beak
  • METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD (PCB)
    Publication number: 20160113124
    Abstract: A method for forming a printed circuit board (PCB) includes: depositing, a first time, a photo imageable solder resist (PSR) ink over a top surface and a bottom surface of the PCB including a conductive pattern; drying, a first time, the PCB on which the PSR ink has been deposited for the first time; depositing, a second time, the PSR ink over the top surface and the bottom surface of the PCB; and drying, a second time, the PCB on which the PSR ink has been deposited for the second time.
    Type: Application
    Filed: April 24, 2015
    Publication date: April 21, 2016
    Inventors: Hyung Keun Ko, Mun Jong Kim, Yang Yoon Choi, Kyung Jeon Pakr, Hyun Taek Hwang