Abstract: The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.

Abstract: The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.

Abstract: The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.

Abstract: The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.

Abstract: The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Abstract: The present disclosure describes poly(styrene/acrylate)-polyester hybrid particles, wherein poly(styrene/acrylate) polymers are polymerized and entangled within a polyester seed particle in an interpenetrating polymer network.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A toner process comprising (a) providing at least one amphiphilic block copolymer prepared by surfactant-free emulsion polymerization comprising: dissolving a hydrophilic monomer in water; adding a hydrophobic monomer; adding a feed initiator to produce a colloidal dispersion of amphiphilic block copolymer; and optionally, discharging the amphiphilic block copolymer; (b) contacting one or more of a latex polymer, a wax; and a colorant with the colloidal dispersion of amphiphilic block copolymer to form a blend; or contacting the discharged amphiphilic block copolymer with one or more of a latex polymer, a wax dispersion, and a colorant dispersion, and forming a further dispersion; (c) heating the blend or further dispersion at a temperature below the glass transition temperature of the latex polymer to form aggregated toner particles; (d) adding a coalescing agent to the toner particles thereby coalescing the toner particles; and (e) recovering the toner particles.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Abstract: Silica aerogels with improved properties are disclosed together with methods for synthesizing such aerogels. The improved properties include lower thermal conductivity (better insulating capacity), lower acoustic velocity, lower dielectric constant and improved ductility. Greater tunability of the refractive index can also be achieved. The silica aerogels are prepared by a sol-gel processing method that provides better control of the formation or aerogel structures. Generally speaking, the improvements arise from control of the synthesis to create a morphology of primary clusters and diverse-sized secondary clusters of dense silica aerogels separated by less densely packed regions. By providing a broader range of secondary clusters and/or pore sizes and loose connectivity between clusters, reductions can be achieved in thermal conductivity and flexural modulus.

Abstract: A process directed to emulsion polymerization (EP) methods for producing seed particles reproducibly independent of initiator amount and rate of introduction.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: The present disclosure describes poly(styrene/acrylate)-polyester hybrid particles, wherein poly(styrene/acrylate) polymers are polymerized and entangled within a polyester seed particle in an interpenetrating polymer network.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A process for making a crystalline latex suitable for use in a toner by phase inversion emulsification (PIE) where when resin of particular acid number is neutralized to a certain degree, smaller sized resin particles are obtained reproducibly.

Abstract: A process directed to emulsion polymerization (EP) methods for producing seed particles reproducibly independent of initiator amount and rate of introduction.

Abstract: The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.

Abstract: A process for making a crystalline latex suitable for use in a toner by phase inversion emulsification (PIE) where when resin of particular acid number is neutralized to a certain degree, smaller sized resin particles are obtained reproducibly.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.