Patents by Inventor Yansheng WANG

Yansheng WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411413
    Abstract: The present application provides a structure and method for improving near-infrared quantum efficiency of a backside illuminated image sensor. The structure includes a substrate and a plurality of photodiodes. The photodiodes are formed in the substrate. A cell deep trench isolation structure is fabricated on a surface of each photodiode. The cross section of the cell deep trench isolation structure 3 parallel to the surface of said photodiode comprises one or both of a four-quadrant square shape and a Union Jack shape. In the present application, by fabricating the cell deep trench isolation structures on the surface of each photodiode, the cell deep trench isolation structures increase light scattering in the photodiode, thus the optical path is increased, thereby improving the absorption of incident light, especially in near-infrared wavelength. As a result the quantum efficiency and sensor's imaging quality are improved.
    Type: Application
    Filed: March 31, 2023
    Publication date: December 21, 2023
    Inventors: Chunshan Zhao, Wuzhi Zhang, Yamin Cao, Wei Zhou, Yansheng Wang
  • Publication number: 20230410279
    Abstract: The present application provides a method for automatically detecting a wafer backside brightfield image anomaly, at least comprising: processing wafer backside brightfield images by means of histogram equalization, so as to obtain processed images; compiling statistics for a gray histogram of the processed images; calculating the number of abnormal pixels in each of the images; and providing a threshold, and highlighting the image with a score less than the threshold. In the present application, the wafer backside brightfield images are analyzed by means of image preprocessing and a specific calculation method, so as to quickly and automatically detect an abnormal wafer backside image.
    Type: Application
    Filed: September 9, 2022
    Publication date: December 21, 2023
    Applicant: Shanghai Huali Microelectronics Corporation
    Inventors: Junjun Zhuang, Xu Chen, Yansheng Wang, Zhengying Wei
  • Patent number: 10310894
    Abstract: Provided is a method for generating configuration information of a dynamic reconfigurable processor. The dynamic reconfigurable processor includes a processing unit array, and the processing unit array includes a plurality of processing units. The method includes steps of: reading information of a task to be executed and generating an array configuration information top of the processing unit array according to the information; generating a plurality of processing unit configuration information corresponding to the plurality of processing units respectively according to the information; and assembling the array configuration information top and the plurality of processing unit configuration information.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 4, 2019
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Leibo Liu, Yansheng Wang, Guiqiang Peng, Zhaoshi Li, Shouyi Yin, Shaojun Wei
  • Publication number: 20170052818
    Abstract: Provided is a method for generating configuration information of a dynamic reconfigurable processor. The dynamic reconfigurable processor includes a processing unit array, and the processing unit array includes a plurality of processing units. The method includes steps of: reading information of a task to be executed and generating an array configuration information top of the processing unit array according to the information; generating a plurality of processing unit configuration information corresponding to the plurality of processing units respectively according to the information; and assembling the array configuration information top and the plurality of processing unit configuration information.
    Type: Application
    Filed: June 16, 2014
    Publication date: February 23, 2017
    Inventors: Leibo LIU, Yansheng WANG, Guiqiang PENG, Zhaoshi LI, Shouyi YIN, Shaojun WEI