Patents by Inventor Yan-Yu Wang
Yan-Yu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134538Abstract: A memory operation method, comprising: when a first super block of a memory device is a open block (or in programming state), obtaining a first read count of one of a plurality of first memory blocks in the first super block, wherein the first read count is a number of times that data of one of the first memory blocks is read out; determining whether the first read count is larger than a first threshold; and when the first read count is larger than the first threshold, moving a part of the data in the first super block to a safe area in the memory device, wherein the part of the data comprises data in the first memory block.Type: ApplicationFiled: June 5, 2023Publication date: April 25, 2024Inventors: Po-Sheng CHOU, Hsiang-Yu HUANG, Yan-Wen WANG
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Patent number: 8835942Abstract: An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.Type: GrantFiled: February 23, 2011Date of Patent: September 16, 2014Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Chen-Yu Chen, Yu-Kang Lu, Yan-Yu Wang
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Patent number: 8502468Abstract: A light emitting bulb, a luminary and an illumination device are provided. The light emitting bulb includes a main body and a bulb base. The main body has a plurality of the light emitting units. The bulb base has a plurality of flexible pieces. The flexible pieces are connected to the light emitting units respectively to form a plurality of electrical transmission paths. The luminary further has a lamp holder for holding the light emitting bulb. A control unit in the illumination device is connected to the light emitting bulb through the lamp holder for selectively providing a supply of a power to the light emitting units to control brightness of light emitting units, respectively. The light emitting bulb may facilitate color changing and brightness control without having a control circuit disposed within the light emitting bulb and is associated with a longer lifetime and a lower manufacturing cost.Type: GrantFiled: April 26, 2011Date of Patent: August 6, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Po-Wei Li, Yan-Yu Wang
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Patent number: 8476669Abstract: An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding cad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.Type: GrantFiled: October 9, 2012Date of Patent: July 2, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-on Technology Corp.Inventors: Chih-Lung Liang, Yan-Yu Wang
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Publication number: 20130032833Abstract: An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding cad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.Type: ApplicationFiled: October 9, 2012Publication date: February 7, 2013Applicants: LITE-ON TECHNOLOGY CORP., LITE-ON ELECTRONICS (GUANGZHOU) LIMITEDInventors: CHIH-LUNG LIANG, YAN-YU WANG
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Patent number: 8309978Abstract: An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding pad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.Type: GrantFiled: March 29, 2011Date of Patent: November 13, 2012Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.Inventors: Chih-Lung Liang, Yan-Yu Wang
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Patent number: 8222801Abstract: A lamp includes a lamp holder module and light-emitting module disposed in the lamp holder module. The lamp holder module includes a body, a pressing mechanism disposed on the body, and an upper cover engaging removably the body. The light-emitting module is placed on the body and is pressed into position through the pressing mechanism. The pressing mechanism is operable to release the light-emitting module, thereby facilitating removal and installation of the light-emitting module. The upper cover serves as a lens of the light-emitting module and covers the light-emitting module.Type: GrantFiled: June 23, 2010Date of Patent: July 17, 2012Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.Inventors: Yan-Yu Wang, Chen-Yu Chen, Chih-Lung Liang, Shun-Chung Cheng
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Publication number: 20120056557Abstract: A light emitting bulb, a luminary and an illumination device are provided. The light emitting bulb includes a main body and a bulb base. The main body has a plurality of the light emitting units. The bulb base has a plurality of flexible pieces. The flexible pieces are connected to the light emitting units respectively to form a plurality of electrical transmission paths. The luminary further has a lamp holder for holding the light emitting bulb. A control unit in the illumination device is connected to the light emitting bulb through the lamp holder for selectively providing a supply of a power to the light emitting units to control brightness of light emitting units, respectively. The light emitting bulb may facilitate color changing and brightness control without having a control circuit disposed within the light emitting bulb and is associated with a longer lifetime and a lower manufacturing cost.Type: ApplicationFiled: April 26, 2011Publication date: March 8, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: Po-Wei Li, Yan-Yu Wang
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Publication number: 20110273076Abstract: An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding pad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.Type: ApplicationFiled: March 29, 2011Publication date: November 10, 2011Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: CHIH-LUNG LIANG, YAN-YU WANG
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Publication number: 20110210346Abstract: An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.Type: ApplicationFiled: February 23, 2011Publication date: September 1, 2011Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP.Inventors: CHEN-YU CHEN, YU-KANG LU, YAN-YU WANG
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Publication number: 20110156567Abstract: A lamp includes a lamp holder module and light-emitting module disposed in the lamp holder module. The lamp holder module includes a body, a pressing mechanism disposed on the body, and an upper cover engaging removably the body. The light-emitting module is placed on the body and is pressed into position through the pressing mechanism. The pressing mechanism is operable to release the light-emitting module, thereby facilitating removal and installation of the light-emitting module. The upper cover serves as a lens of the light-emitting module and covers the light-emitting module.Type: ApplicationFiled: June 23, 2010Publication date: June 30, 2011Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP.Inventors: YAN-YU WANG, CHEN-YU CHEN, CHIH-LUNG LIANG, SHUN-CHUNG CHENG
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Patent number: D616574Type: GrantFiled: November 20, 2009Date of Patent: May 25, 2010Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology CorporationInventors: Chen-Yu Chen, Chih-Lung Liang, Yan-Yu Wang
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Patent number: D616575Type: GrantFiled: November 20, 2009Date of Patent: May 25, 2010Assignees: Silitek Electronics (Guangzhou) Co., Ltd., Lite-On Technology CorporationInventors: Chen-Yu Chen, Chih-Lung Liang, Yan-Yu Wang