Abstract: A flip-chip light-emitting device includes a transparent substrate, an epitaxial structure, a transparent dielectric layer, a plurality of first contact electrodes, multiple second contact electrodes, a metallic reflection layer, a first insulating layer, and an electrode pad region. The epitaxial structure is formed on the transparent substrate, and includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first and second contact electrodes are embedded in the transparent dielectric layer, and respectively connected to the first and second type semiconductor layers. The second and first contact electrodes are arranged in an array. The second contact electrodes are disposed in a region perpendicularly below the first pad and are distributed along a circular ring that is concentric with one of the first contact electrodes. A light emitting module includes a circuit board, and the flip-chip light emitting device is mounted on the circuit board.

Abstract: A separator includes a substrate and a coating. The coating is formed on at least a portion of surface of the substrate. The coating includes composite particles and a binder. The composite particles form bulges on surface of the coating. The composite particles include polyacrylate particles and first inorganic particles. The first inorganic particle is present between at least two of the polyacrylate particles.

Abstract: A light-emitting includes an epitaxial structure, a diffusion blocking layer, an ohmic contact layer, a first electrode, and a second electrode. The epitaxial structure includes a first semiconductor layer, an active layer, and a second semiconductor layer disposed sequentially in such order. The diffusion blocking layer is disposed on a surface of the first semiconductor layer opposite to the active layer. The ohmic contact layer is disposed on a surface of the diffusion blocking layer opposite to the first semiconductor layer. The first electrode is disposed on a surface of the ohmic contact layer opposite to the diffusion blocking layer and is electrically connected to the first semiconductor layer. The second electrode is disposed on a surface of the second semiconductor layer adjacent to the active layer and is electrically connected to the second semiconductor layer. A method for manufacturing the light-emitting device is also provided.

Abstract: A light-emitting device includes a semiconductor substrate, an epitaxial structure that has a first surface facing the semiconductor substrate and a second surface opposite to the first surface, and a transparent bonding structure that is disposed between the first surface and the semiconductor substrate. The transparent bonding structure has a first bonding surface facing the first surface of the epitaxial structure and a second bonding surface opposite to the first bonding surface, and has a slit extending from the first bonding surface toward the second bonding surface and terminating at a position that is a distance away from the second bonding surface. A method for manufacturing a light-emitting device is also provided.

Abstract: A light-emitting device includes a semiconductor structure having a first semiconductor layer, an active layer, and a second semiconductor layer. The second semiconductor layer and the active layer formed on a top surface of the first semiconductor layer exposes a portion of the top surface. A first strip electrode is connected to the exposed top surface. A second strip electrode is connected to the second semiconductor layer. When first and second electrodes are projected on a plane, two parallel lines, that contact two opposite ends of the first electrode and perpendicularly intersect a straight line connecting between two opposite ends of the second electrode, define on the straight line a length, which does not extend beyond a distance between the two opposite ends of the second electrode.

Abstract: A turnout includes a fixed beam, and a first and a second movable beams respectively on two opposite sides of the fixed beam. The fixed beam is arranged on a turnout platform. The first movable beam is movably arranged on the turnout platform between a first and a second positions. The second movable beam is movably arranged on the turnout platform between a third and a fourth positions. When the first movable beam is at the first position, the second movable beam is at the third position, the first movable beam is separated from the fixed beam, and the second movable beam and the fixed beam form a first passage; when the first movable beam is at the second position, the second movable beam is at the fourth position, the second movable beam is separated from the fixed beam, and the first movable beam and the fixed beam form a second passage.

Abstract: A turnout includes a fixed beam, and a first and a second movable beams respectively on two opposite sides of the fixed beam. The fixed beam is arranged on a turnout platform. The first movable beam is movably arranged on the turnout platform between a first and a second positions. The second movable beam is movably arranged on the turnout platform between a third and a fourth positions. When the first movable beam is at the first position, the second movable beam is at the third position, the first movable beam is separated from the fixed beam, and the second movable beam and the fixed beam form a first passage; when the first movable beam is at the second position, the second movable beam is at the fourth position, the second movable beam is separated from the fixed beam, and the first movable beam and the fixed beam form a second passage.