Abstract: Embodiments of the present application provide a battery and an electrical device. The battery comprises: a box body including an electrical cavity; a battery cell accommodated in the electrical cavity and provided with a pressure relief mechanism on a first wall of the battery cell; a first passage and a second passage, the first passage and the second passage being configured to be able to communicate with the inside of the battery cell through the pressure relief mechanism when the pressure relief mechanism is actuated, wherein the first passage is used to discharge the emissions discharged from the pressure relief mechanism into the electrical cavity, and the second passage is used to discharge the emissions discharged from the pressure relief mechanism out of the electrical cavity.

Abstract: A terminal device, a display apparatus, and a display panel and a manufacturing method therefor. The display panel comprises: a drive backplane, which has a display region comprising a light-transmitting display region and a main display region, the light-transmitting display region comprising a light-transmitting region; a pixel definition layer, which comprises openings including a first opening and a second opening; a plurality of light-emitting devices defined in the openings; and a color film layer. The opening spacing between two adjacent first openings satisfies a specific relational expression, thereby improving the light transmittance and also preventing cross-color.

Abstract: A package structure includes a first die and a second die embedded in a first molding material, a first redistribution structure over the first die and the second die, a second molding material over portions of the first die and the second die, wherein the second molding material is disposed between a first portion of the first redistribution structure and a second portion of the first redistribution structure, a first via extending through the second molding material, wherein the first via is electrically connected to the first die, a second via extending through the second molding material, wherein the second via is electrically connected to the second die and a silicon bridge electrically coupled to the first via and the second via.

Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.

Abstract: A controller may generate a packet, and send the packet to an electronic control unit. The packet includes a plurality of bits and control information. The plurality of bits may indicate whether the electronic control unit controls a plurality of objects (for example, actuators or functions) based on the control information. The plurality of bits are in a one-to-one correspondence with the plurality of objects. In this way, the electronic control unit associated with the plurality of objects can control the plurality of objects based on the control information.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.

Abstract: The present disclosure provides an electronic device including a first sensing circuit, a second sensing circuit and a power line. The first sensing circuit includes a first sensing unit and a first transistor, and a first end of the first sensing unit is coupled to a control end of the first transistor. The second sensing circuit includes a second sensing unit and a second transistor, and a first end of the second sensing unit is coupled to a control end of the second transistor. A first end of the first transistor and a first end of the second transistor are coupled to the power line.

Abstract: The present application relates to a network-on-chip data processing method. The method is applied to a network-on-chip processing system, the network-on-chip processing system is used for executing machine learning calculation, and the network-on-chip processing system comprises a storage device and a calculation device. The method comprises: accessing the storage device in the network-on-chip processing system by means of a first calculation device in the network-on-chip processing system and obtaining first operation data; performing an operation on the first operation data by means of the first calculation device to obtain a first operation result; and sending the first operation result to a second calculation device in the network-on-chip processing system. According to the method, operation overhead can be reduced and data read/write efficiency can be improved.

Abstract: Various schemes pertaining to pre-encoding processing of a video stream with motion compensated temporal filtering (MCTF) are described. An apparatus determines a filtering interval for a received raw video stream having pictures in a temporal sequence. The apparatus selects from the pictures a plurality of target pictures based on the filtering interval, as well as a group of reference pictures for each target picture to perform pixel-based MCTF, which generates a corresponding filtered picture for each target picture. The apparatus subsequently transmits the filtered pictures as well as non-target pictures to an encoder for encoding the video stream. Subpictures of natural images and screen content images are separately processed by the apparatus.

Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.

Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.

Abstract: An optical device and the prism module thereof are provided. The prism module includes a first prism, a second prism, and a third prism. The second prism is disposed beside the first prism. The third prism is adhered to the second prism. First light enters the first prism, is reflected plural times in the first prism, enters the second prism, and is emitted from the second prism. Second light enters the second prism, is reflected plural times in the second prism, and is emitted from the second prism. Third light sequentially passes through the third prism and the second prism, enters the first prism, is reflected plural times in the first prism, and is emitted from the first prism.

Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.

Abstract: A media item to be provided to users of a platform is identified. The media item is associated with a media class of one or more media classes. An indication of the media item is provided as input to a machine learning model trained based on historical encoding data to predict, for a given media item, a set of encoder parameter settings that satisfy a performance criterion in view of a respective media class of the given media item. The historical encoding data includes a prior set of encoder parameter settings that satisfied the performance criterion with respect to a prior media item associated with the respective class. Encoder parameter settings that satisfy the performance criterion in view of the media class is determined based on an output of the model. The media item is caused to be encoded using the determined encoder parameter settings.

Abstract: A multi-chip interconnection package structure with a heat dissipation plate and a preparation method thereof are provided. The multi-chip interconnection package structure with a heat dissipation plate includes a fine circuit layer, at least one die, a heat dissipation plate, a plastic package body, and a package circuit layer, the heat dissipation plate is provided on the fine circuit layer, and is mounted on a side of the die away from the fine circuit layer, the plastic package body wraps the die and the heat dissipation plate, and the package circuit layer is provided on the plastic package body.

Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: Embodiments of the present application provide a case of a battery, a battery, a power consumption device, and a method and device for preparing a battery. The case includes: an electrical chamber configured to accommodate a plurality of battery cells and a bus component, where at least one battery cell of the plurality of battery cells includes a pressure relief mechanism; a thermal management component configured to accommodate a fluid to adjust temperatures of the plurality of battery cells; and a collection chamber configured to collect, when the pressure relief mechanism is actuated, emissions from the battery cell provided with the pressure relief mechanism; where the thermal management component is configured to isolate the electrical chamber from the collection chamber. According to the technical solutions of the embodiments of the present application, the safety of the battery can be enhanced.

Abstract: A heat exchanger is provided, including a first case, a second case, a substrate, an engaging structure, an evaporator, a condenser, a first tube, and a second tube. The first case includes a first plate structure and a first protruding structure. The first plate structure has a first inner surface. The first protruding structure protrudes from the first inner surface. The second case includes a second plate structure and a second protruding structure. The second plate structure has a second inner surface. The second protruding structure protrudes from the second inner surface. The substrate is engaged with the first inner surface, the first protruding structure, the second inner surface, and the second protruding structure via the engaging structure. The substrate is in contact with at least three different lateral surfaces of the engaging structure so that the substrate and the first case combine are bonded.