Abstract: A power backplane assembly is adapted to be connected to a power supply. The power supply outputs a first voltage. The power backplane assembly includes a backplane body, a conversion circuit board, and an output circuit board. The backplane body is for plugging in the power supply. The conversion circuit board is electrically connected to the backplane body. The backplane body is adapted to deliver the first voltage to the conversion circuit board. The conversion circuit board converts the first voltage into a second voltage. The output circuit board is electrically connected to the conversion circuit board and includes a first output connector and a second output connector. The first output connector is configured to output the first voltage, and the second output connector is at least configured to output the second voltage. A power supply module which has the power backplane assembly is also provided.

Abstract: A power backplane assembly is adapted to be connected to a power supply. The power supply outputs a first voltage. The power backplane assembly includes a backplane body, a conversion circuit board, and an output circuit board. The backplane body is for plugging in the power supply. The conversion circuit board is electrically connected to the backplane body. The backplane body is adapted to deliver the first voltage to the conversion circuit board. The conversion circuit board converts the first voltage into a second voltage. The output circuit board is electrically connected to the conversion circuit board and includes a first output connector and a second output connector. The first output connector is configured to output the first voltage, and the second output connector is at least configured to output the second voltage. A power supply module which has the power backplane assembly is also provided.

Abstract: The present invention relates to a control system and control method. The control system is applied to a machine tool and includes a horizontal monitor unit, a temperature monitor unit, a temperature adjustment device and a controller. The horizontal monitor unit is configured to measure a horizontal angle of a table and the temperature monitor unit is configured to measure a temperature information of a sensing area in a machining device. The controller receives the horizontal angle and the temperature information, then generates a compensation signal to the temperature adjustment device to change the temperature of an adjusting area in the machining device so that the horizontal angle of the table and the vertical inclination of the machining device are orthogonal to each other.

Abstract: An acoustoelectric transformation chip for a ribbon microphone includes a diaphragm that has a vibrating region and two fixing regions disposed on two opposite sides of the vibrating region, and a voice coil film formed on the diaphragm. The voice coil film includes two rectangular voice coils, each of which has a plurality of first and second connection segments parallel to a direction of a magnetic field. A plurality of first and second transverse segments are perpendicular to the first and second connection segments and are connected between the first and second connection segments. The second transverse segments of each voice coil are disposed on one of the fixing regions. The first transverse segments of the two voice coils are disposed in the vibrating region.

Abstract: An acoustoelectric transformation chip for a ribbon microphone includes a diaphragm that has a vibrating region and two fixing regions disposed on two opposite sides of the vibrating region, and a voice coil film formed on the diaphragm. The voice coil film includes two rectangular voice coils, each of which has a plurality of first and second connection segments parallel to a direction of a magnetic field. A plurality of first and second transverse segments are perpendicular to the first and second connection segments and are connected between the first and second connection segments. The second transverse segments of each voice coil are disposed on one of the fixing regions. The first transverse segments of the two voice coils are disposed in the vibrating region.