Abstract: In an embodiment, a method includes attaching a first package component to a first carrier, the first package component comprising: an aluminum pad disposed adjacent to a substrate; a sacrificial pad disposed adjacent to the substrate, the sacrificial pad comprising a major surface opposite the substrate, a protrusion of the sacrificial pad extending from the major surface; and a dielectric bond layer disposed around the aluminum pad and the sacrificial pad; attaching a second carrier to the first package component and the first carrier, the first package component being interposed between the first carrier and the second carrier; removing the first carrier; planarizing the dielectric bond layer to comprise a top surface being coplanar with the protrusion; and etching a portion of the protrusion.

Abstract: A method of packaging a semiconductor includes: positioning first and second semiconductor dies by one another on a carrier substrate, wherein first and second zones zone are defined with respect to the first die and third and fourth zones are defined with respect to the second die; forming first vias in the first zone, the first vias having a first size; forming second vias in the second zone, the second vias having a second size different from the first; forming third vias in the third zone, the third vias having a third size; forming fourth vias in the fourth zone, the fourth vias having a fourth size different from the third; and electrically connecting the first and second dies with an interconnection die such that electrical signals are exchangeable therebetween.

Abstract: An LED lamp comprises a lamp body and a colorized, translucent envelope detachably connected to the lamp body. The lamp body includes an LED module and the envelope covers the LED module. A color of the envelope is different from that of the light emitted by the LED module. The envelope changes the color of the light of the LED module when the light passes through the envelope to the outside.

Abstract: An LED lamp comprises a lamp body and a colorized, translucent envelope detachably connected to the lamp body. The lamp body includes an LED module and the envelope covers the LED module. A color of the envelope is different from that of the light emitted by the LED module. The envelope changes the color of the light of the LED module when the light passes through the envelope to the outside.