Patents by Inventor Yao-Tien Tseng

Yao-Tien Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10619259
    Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: April 14, 2020
    Assignee: Ming Chi University of Technology
    Inventors: Kun-Cheng Peng, Min-Zen Lee, Yao-Tien Tseng, Chun-Ying Lee, Po-Yan Su
  • Publication number: 20190024252
    Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.
    Type: Application
    Filed: May 3, 2018
    Publication date: January 24, 2019
    Inventors: Kun-Cheng Peng, Min-Zen Lee, Yao-Tien Tseng, Chun-Ying Lee, Po-Yan Su