Abstract: Online ride-hailing and invoice issuing methods, systems and apparatuses are provided. An example method comprises: receiving a first ride-hailing request from a user terminal, wherein the first ride-hailing request includes one or more transport capacity types, one or more online ride-hailing service providers providing the corresponding one or more transport capacity types, a start location and a destination location; sending one or more second ride-hailing requests to one or more online ride-hailing service platforms corresponding to the one or more online ride-hailing service providers according to the one or more transport capacity types and the one or more online ride-hailing service providers; receiving one or more second ride-hailing response messages returned by one or more of the one or more online ride-hailing service platforms; and returning a first ride-hailing message to the user terminal based on the second one or more ride-hailing response messages.

Abstract: Disclosed are a Physical to Virtual (P2V) migration method and apparatus, and a storage medium. The method includes that: disk data of a Physical Machine (PM) is transmitted to a server, wherein the disk data is used by the server to create and start a Virtual Machine (VM) based on the disk data of the PM; a first dirty data generated by running of a program on the PM in a transmission process of the disk data of the PM is acquired; the disk data for creating the VM is updated based on the acquired first dirty data; and based on the updated disk data for the VM, the VM is controlled to resume running the program based on a progress of the program.

Abstract: The present disclosure relates to the field of communication technology, and provides a resource scheduling method including: acquiring utilization rates of resources of a plurality of proxy servers, the plurality of proxy servers being deployed on a virtual machine; and using at least one first proxy server to share a utilization of resources of at least one second proxy server, where the utilization rate of resources of each of the at least one first proxy server is smaller than a first threshold, the utilization rate of resources of each of the at least one second proxy server is greater than a second threshold, and the first threshold is smaller than the second threshold.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: The present application provides a resource scheduling method and apparatus, an electronic device, and a computer readable storage medium. The method includes: selecting an optimal path from a pre-constructed resource label forest according to a weight of a path in a resource label tree in the resource label forest; and scheduling a task to a third node through which the optimal path passes. The resource label forest includes the at least one resource label tree, and each path of which includes a first node, a second node and the third node in an order from a root node to leaf nodes.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: Three-dimensional integrated circuit (3DIC) structures and methods of forming the same are provided. A 3DIC structure includes a semiconductor package, a first package substrate, a molded underfill layer and a thermal interface material. The semiconductor package is disposed over and electrically connected to the first package substrate through a plurality of first bumps. The semiconductor package includes at least one semiconductor die and an encapsulation layer aside the semiconductor die. The molded underfill layer surrounds the plurality of first bumps and a sidewall of the semiconductor package, and has a substantially planar top surface. The CTE of the molded underfill layer is different from the CTE of the encapsulation layer of the semiconductor package. The thermal interface material is disposed over the semiconductor package.

Abstract: Three-dimensional integrated circuit (3DIC) structures and methods of forming the same are provided. A 3DIC structure includes a semiconductor package, a first package substrate, a molded underfill layer and a thermal interface material. The semiconductor package is disposed over and electrically connected to the first package substrate through a plurality of first bumps. The semiconductor package includes at least one semiconductor die and an encapsulation layer aside the semiconductor die. The molded underfill layer surrounds the plurality of first bumps and a sidewall of the semiconductor package, and has a substantially planar top surface. The CTE of the molded underfill layer is different from the CTE of the encapsulation layer of the semiconductor package. The thermal interface material is disposed over the semiconductor package.

Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

Abstract: Online ride-hailing and invoice issuing methods, systems and apparatuses are provided. An example method comprises: receiving a first ride-hailing request from a user terminal, wherein the first ride-hailing request includes one or more transport capacity types, one or more online ride-hailing service providers providing the corresponding one or more transport capacity types, a start location and a destination location; sending one or more second ride-hailing requests to one or more online ride-hailing service platforms corresponding to the one or more online ride-hailing service providers according to the one or more transport capacity types and the one or more online ride-hailing service providers; receiving one or more second ride-hailing response messages returned by one or more of the one or more online ride-hailing service platforms; and returning a first ride-hailing message to the user terminal based on the second one or more ride-hailing response messages.

Abstract: Three-dimensional integrated circuit (3DIC) structures and methods of forming the same are provided. A 3DIC structure includes a semiconductor package, a first package substrate, a molded underfill layer and a thermal interface material. The semiconductor package is disposed over and electrically connected to the first package substrate through a plurality of first bumps. The semiconductor package includes at least one semiconductor die and an encapsulation layer aside the semiconductor die. The molded underfill layer surrounds the plurality of first bumps and a sidewall of the semiconductor package, and has a substantially planar top surface. The CTE of the molded underfill layer is different from the CTE of the encapsulation layer of the semiconductor package. The thermal interface material is disposed over the semiconductor package.

Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

Abstract: Disclosed are a Physical to Virtual (P2V) migration method and apparatus, and a storage medium. The method includes that: disk data of a Physical Machine (PM) is transmitted to a server, wherein the disk data is used by the server to create and start a Virtual Machine (VM) based on the disk data of the PM; a first dirty data generated by running of a program on the PM in a transmission process of the disk data of the PM is acquired; the disk data for creating the VM is updated based on the acquired first dirty data; and based on the updated disk data for the VM, the VM is controlled to resume running the program based on a progress of the program.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: The disclosure discloses a method and device for access control. The method includes: when a group of tasks are executed, controlling an access of a subject to an object according to operation permission corresponding to each of the tasks in the group of tasks. The device comprises a control component arranged to, when a group of tasks are executed, control an access of a subject to an object according to operation permission corresponding to each of the tasks in the group of tasks.

Abstract: An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a redistribution structure. The die has an active surface and includes a plurality of conductive posts on the active surface. The conductive structures surround the die. The encapsulant partially encapsulates the die. The enhancement layer is over the encapsulant. A top surface of the enhancement layer is substantially coplanar with top surfaces of the conductive posts and the conductive structures. A material of the enhancement layer is different from a material of the encapsulant. A roughness of an interface between the encapsulant and the enhancement layer is larger than a roughness of the top surface of the enhancement layer. The redistribution structure is over the enhancement layer and is electrically connected to the conductive structures and the die.

Abstract: An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a redistribution structure. The die has an active surface and includes a plurality of conductive posts on the active surface. The conductive structures surround the die. The encapsulant partially encapsulates the die. The enhancement layer is over the encapsulant. A top surface of the enhancement layer is substantially coplanar with top surfaces of the conductive posts and the conductive structures. A material of the enhancement layer is different from a material of the encapsulant. A roughness of an interface between the encapsulant and the enhancement layer is larger than a roughness of the top surface of the enhancement layer. The redistribution structure is over the enhancement layer and is electrically connected to the conductive structures and the die.

Abstract: The disclosure discloses a method and device for access control. The method includes: when a group of tasks are executed, controlling an access of a subject to an object according to operation permission corresponding to each of the tasks in the group of tasks. The device comprises a control component arranged to, when a group of tasks are executed, control an access of a subject to an object according to operation permission corresponding to each of the tasks in the group of tasks.