Patents by Inventor Yao-Wei Tien

Yao-Wei Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for defect analysis of a substrate
    Patent number: 9734572
    Abstract: The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: August 15, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Wei Tien, Chi-Hung Liao, Ming-Yi Lee
  • SYSTEM AND METHOD FOR DEFECT ANALYSIS OF A SUBSTRATE
    Publication number: 20150146968
    Abstract: The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 28, 2015
    Inventors: Yao-Wei Tien, Chi-Hung Liao, Ming-Yi Lee