Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Abstract: A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.

Abstract: A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.

Abstract: A semi-aqueous wet clean system and method for removing carbon-containing silicon material (e.g., plasma residue) or nitrogen-containing silicon material (e.g., plasma residue) includes a hydroxyl-terminated organic compound, a diol, and a fluoride ion donor material. The system is configured to protect silicon oxide and amorphous silicon during a post-dry-etch wet clean. The wet clean system is configured to selectively remove carbon-containing or nitrogen-containing plasma residue. pH of the wet clean system can be modified to tune selectivity for removal of carbon-containing or nitrogen-containing plasma residues. As a result, positive TEOS recession of less than about 3 nanometers may be achieved. Additionally, the wet clean system can be adapted for reclamation and subsequent reuse.

Abstract: A semiconductor wafer and a semiconductor wafer fabrication method are provided. The wafer includes a supporting substrate, a semiconductor substrate and a contact layer. The supporting substrate has a first surface and a second surface opposite to the first surface. The semiconductor substrate is disposed on the first surface of the supporting substrate, in which the semiconductor substrate is configured to form plural devices. The contact layer is disposed on the second surface of the supporting substrate to contact the supporting substrate, in which the contact layer is configured to contact an electrostatic chuck and has a resistivity of the contact layer smaller than a resistivity of the supporting substrate. In semiconductor wafer fabrication method, at first, a raw wafer is provided. Then, the contact layer is formed by using an implantation operation or a deposition operation.

Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.

Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Abstract: A semi-aqueous wet clean system and method for removing carbon-containing silicon material (e.g., plasma residue) or nitrogen-containing silicon material (e.g., plasma residue) includes a hydroxyl-terminated organic compound, a diol, and a fluoride ion donor material. The system is configured to protect silicon oxide and amorphous silicon during a post-dry-etch wet clean. The wet clean system is configured to selectively remove carbon-containing or nitrogen-containing plasma residue. pH of the wet clean system can be modified to tune selectivity for removal of carbon-containing or nitrogen-containing plasma residues. As a result, positive TEOS recession of less than about 3 nanometers may be achieved. Additionally, the wet clean system can be adapted for reclamation and subsequent reuse.

Abstract: The present disclosure provides a method for generating a parameter pattern including: performing a plurality of measurements upon a plurality of regions on a surface of a workpiece to obtain a plurality of measured results; and deriving a parameter pattern according to the plurality of measured results by a computer; wherein the parameter pattern includes a plurality of regional parameter values corresponding to each of the plurality of regions on the surface of the workpiece. The present disclosure provides a Feed Forward semiconductor manufacturing method including: forming a layer with a desired pattern on a surface of a workpiece; deriving a control signal including a parameter pattern according to spatial dimension measurements against the layer with the desired pattern distributed over a plurality of regions of the surface of the workpiece; and performing an ion implantation on the surface of the workpiece according to the control signal.

Abstract: The present disclosure provides a method for generating a parameter pattern including: performing a plurality of measurements upon a plurality of regions on a surface of a workpiece to obtain a plurality of measured results; and deriving a parameter pattern according to the plurality of measured results by a computer; wherein the parameter pattern includes a plurality of regional parameter values corresponding to each of the plurality of regions on the surface of the workpiece. The present disclosure provides a Feed Forward semiconductor manufacturing method including: forming a layer with a desired pattern on a surface of a workpiece; deriving a control signal including a parameter pattern according to spatial dimension measurements against the layer with the desired pattern distributed over a plurality of regions of the surface of the workpiece; and performing an ion implantation on the surface of the workpiece according to the control signal.

Abstract: A back frame module includes a base plate, two locking plate members, a cable organizing plate, and a stowage plate. The base plate is adapted to be provided on a rear face of a display. The locking plate members, the cable organizing plate, and the stowage plate are selectively connected to the base plate. The locking plate members are adapted for mounting of a computer device therebetween. The cable organizing plate is adapted to stow a cable of the display or of the computer device. The stowage plate is adapted to stow an adapter of the display or other accessories. The locking plate members, the cable organizing plate, and the stowage plate can be selectively substituted by a support plate. The back frame module thus has various states of use to satisfy different user requirements.

Abstract: A back frame module includes a base plate, two locking plate members, a cable organizing plate, and a stowage plate. The base plate is adapted to be provided on a rear face of a display. The locking plate members, the cable organizing plate, and the stowage plate are selectively connected to the base plate. The locking plate members are adapted for mounting of a computer device therebetween. The cable organizing plate is adapted to stow a cable of the display or of the computer device. The stowage plate is adapted to stow an adapter of the display or other accessories. The locking plate members, the cable organizing plate, and the stowage plate can be selectively substituted by a support plate. The back frame module thus has various states of use to satisfy different user requirements.

Abstract: A display device includes a base seat unit and at least one first display unit. The first display unit includes a first casing module, a first display panel connected to the first casing module, a pair of first support rods, and a pair of second support rods. The first support rods are connectible to the base seat unit in an upright direction and in a horizontally spaced apart manner, and are used to support therebetween the first casing module in a horizontal state. The second support rods are longer than the first support rods, are connectible to the base seat unit in an upright direction and in a horizontally spaced apart manner, and are used to support therebetween the first casing module in a vertical state.

Abstract: A back frame module includes a base plate, two locking plate members, a cable organizing plate, and a stowage plate. The base plate is adapted to be provided on a rear face of a display. The locking plate members, the cable organizing plate, and the stowage plate are selectively connected to the base plate. The locking plate members are adapted for mounting of a computer device therebetween. The cable organizing plate is adapted to stow a cable of the display or of the computer device. The stowage plate is adapted to stow an adapter of the display or other accessories. The locking plate members, the cable organizing plate, and the stowage plate can be selectively substituted by a support plate. The back frame module thus has various states of use to satisfy different user requirements.

Abstract: A Point-Of-Sale (POS) system bracket includes a bracket housing and two mounts. The bracket housing includes two opposite sidewalls having inner surfaces, outer surfaces each having a substantially convex shape, and a plurality of positioning holes formed at different heights in the sidewalls. The mounts have outer sides for fixing respectively of two displays, and inner sides to be attached to the outer surfaces of the respective sidewalls. A plurality of locking elements extend respectively through a selected group of the positioning holes from the inner surfaces of the sidewalls to fasten the mounts to the respective sidewalls. The locking elements can be changed in position from one group to the other group of the positioning holes, so that the mounts can be positioned at different heights on the respective sidewalls, and the displays can be disposed at different inclination angles.

Abstract: A method for soft configuring communication a memory device to act as a Key Card that can switch on or off some particular functions of either an application program or the memory device itself. The method comprising the steps of: connecting the memory device to an external device; running a specific application program on the external device, the application program writing and storing a specific data into the memory device, the specific data including at least a command and a key; the memory device generating a response value according to the command and key of the specific data; and the external device reading the response value from the memory device and checking a status of the response value; if the response value is checked to be valid, then the application program will be able to access the memory device by using functions defined by the command; if the response value is checked to be invalid, then functions of the application program will be restricted.

Abstract: A microfluidic system for creating encapsulated droplets whose shells can be further removed comprises: two electrode plates and a spacing structure disposed between the two electrode plates. One of the electrode plates has three reservoir electrodes and a plurality of channel electrodes. The three electrodes are respectively used for accommodating a shell liquid, a core liquid, and a removing liquid which is able to remove the shell liquid. The channel electrodes are used for communicating droplets among the three reservoir electrodes. Via these arrangements, the microfluidic system can create a quantitative shell droplet and a quantitative core droplet, and then merge the shell and core droplets to form an encapsulated droplet. Moreover, the shell of the encapsulated droplet can be removed by mixing it with the removing liquid. This invention is further provided with a method for creating an encapsulated droplet with a removable shell.