Patents by Inventor Yaofeng SUN
Yaofeng SUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11656291Abstract: Used batteries are screened based on a measured Constant-Current Impulse Ratio. A used battery is charged using a Constant Current (CC) until a voltage target is reached, and the current integrated to obtain the CC charge applied, QCC. Then the battery continues to be charged using a Constant Voltage (CV) of the voltage target until the charging current falls to a minimum current target. The current is integrated over the CV period to obtain the CV charge applied, QCV. The measured CCIR is the ratio of QCC to (QCC+QCV). The measured CCIR is input to a calibration curve function to obtain a modeled State of Health (SOH) value. The used battery is sorted for reuse or disposal based on the modeled SOH value. The calibration curve function is obtained by aging new batteries to obtain CCIR and SOH data that are modeled using a neural network.Type: GrantFiled: February 8, 2021Date of Patent: May 23, 2023Inventors: Minjie Xu, Liya Zheng, Yaofeng Sun
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Patent number: 11644513Abstract: A Battery Management System (BMS) inspects a battery pack using AC impedance. A controller on the BMS drives a Pulse-Width Modulation (PWM) output signal to an on-board excitation regulator such as a synchronous buck converter that modulates a limited energy unit such as a capacitor with a swept frequency of a PWM input signal. The capacitor modulations are applied to a terminal of the battery pack as an AC excitation signal. Synchronous sampling of the battery pack provides responses to the AC excitation signal. An AC excitation signal current and a battery response voltage are processed and Fourier-transformed to generate a Nyquist plot of the excitation-response data. Curve shifts can indicate worn battery cells. The capacitor generating the AC excitation signal draws little energy from the battery pack so AC impedance inspection can occur during all modes: charging, discharging, and idle modes without an external power supply.Type: GrantFiled: January 7, 2022Date of Patent: May 9, 2023Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Wenlong Ding, Meng Chen, Yaofeng Sun, Manxin Chen
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Patent number: 11422199Abstract: A used battery is discharged for a short time from a first Open Circuit Voltage (OCV1) to a second OCV2 and the discharge current ?Q measured. OCV1 is input to a calibration curve model to obtain a first modeled State of Charge (SOC1) value, and OCV2 is input to the calibration curve model to obtain a second modeled SOC2 value. The State of Health (SOH) is calculated as ?Q/[Qnew×(SOC1?SOC2)], where Qnew is the battery capacity when new. The used battery is sorted for reuse or disposal based on the SOH value. The calibration curve model is obtained by Artificial Intelligence (AI) modeling of OCV, SOC datapoints from fully charging and discharging used batteries. Only OCV values within a target region having a low first derivative of SOC as a function of OCV are modeled, and OCV1 and OCV2 are within this target region.Type: GrantFiled: June 17, 2021Date of Patent: August 23, 2022Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Minjie Xu, Yaofeng Sun
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Publication number: 20220252674Abstract: Used batteries are screened based on a measured Constant-Current Impulse Ratio. A used battery is charged using a Constant Current (CC) until a voltage target is reached, and the current integrated to obtain the CC charge applied, QCC. Then the battery continues to be charged using a Constant Voltage (CV) of the voltage target until the charging current falls to a minimum current target. The current is integrated over the CV period to obtain the CV charge applied, QCV. The measured CCIR is the ratio of QCC to (QCC+QCV). The measured CCIR is input to a calibration curve function to obtain a modeled State of Health (SOH) value. The used battery is sorted for reuse or disposal based on the modeled SOH value. The calibration curve function is obtained by aging new batteries to obtain CCIR and SOH data that are modeled using a neural network.Type: ApplicationFiled: February 8, 2021Publication date: August 11, 2022Inventors: Minjie XU, Liya ZHENG, Yaofeng SUN
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Publication number: 20220252670Abstract: Used batteries are screened based on a measured Sectional Constant-Current Impulse Ratio (SCCIR). A used battery is partially charged over a small voltage range using a Constant Current (CC) until a voltage target is reached, and the current integrated to obtain the CC charge applied, Qcc. Then the battery continues to be charged using a Constant Voltage (CV) of the voltage target until the charging current falls to a midrange current target before the battery is fully charged. The current is integrated over the CV period to obtain the CV charge applied, Qcv. The measured SCCIR is the ratio of Qcc to (Qcc+Qcv) and is input to a calibration curve function to obtain a modeled State of Health (SOH) value for sorting. The calibration curve function is obtained by aging new batteries to obtain SCCIR and SOH data that are modeled using a neural network.Type: ApplicationFiled: January 4, 2022Publication date: August 11, 2022Inventors: Minjie XU, Meng CHEN, Yaofeng SUN
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Patent number: 11124890Abstract: Provided herein is a method for measuring a concentration of a metal ion in an electrodeposition solution. The method of the present disclosure can substantially reduce the interference of organic additives and different electrode conditions on voltammetric metal ion concentration measurements.Type: GrantFiled: April 30, 2019Date of Patent: September 21, 2021Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Yaofeng Sun, Shaoqin Xie, Liya Zheng
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Publication number: 20200347510Abstract: Provided herein is a method for measuring a concentration of a metal ion in an electrodeposition solution. The method of the present disclosure can substantially reduce the interference of organic additives and different electrode conditions on voltammetric metal ion concentration measurements.Type: ApplicationFiled: April 30, 2019Publication date: November 5, 2020Inventors: Yaofeng SUN, Shaoqin XIE, Liya ZHENG
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Patent number: 10234419Abstract: The presently claimed invention provides an electrochemical analytical apparatus for electrochemical bath analysis. The apparatus comprise a static electrode and a rotatable unit. As steady liquid flow can be generated on the electrolytic surface of the static electrode by the rotatable unit through rotation, the static disk electrode does not involve any movement during the bath analysis such that the design of the electrical contact in the electrode can be substantially simplified.Type: GrantFiled: May 23, 2016Date of Patent: March 19, 2019Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Yaofeng Sun, Sha Xu
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Patent number: 10100420Abstract: The presently claimed invention provides a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive of the present invention enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.Type: GrantFiled: December 29, 2015Date of Patent: October 16, 2018Assignee: Hong Kong Applied Science and Technology Research Institute Company LimtiedInventors: Yaofeng Sun, Minjie Xu, Shun Yee Lao, Shu Kin Yau
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Publication number: 20180258243Abstract: The invention provides a composition for adhering one or more polymers to a substrate. The composition comprises at least one first compound adapted to be coated on a surface of the substrate. The first compound comprises one or more first units each having at least one functional group adapted to chemically react with at least one monomer to form the one or more polymers. Said composition also comprises at least one second compound adapted to be coated on the surface of the substrate. The second compound comprising one or more second units interspersed among the one or more first units of the first compound. Each of the one or more second units is not chemically reactive to the at least one monomer. The invention also provides a method of preparing a polymer coated surface on a substrate using the composition described.Type: ApplicationFiled: March 10, 2017Publication date: September 13, 2018Inventors: Wenwei Zheng, Hailong Wu, Yaofeng Sun
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Patent number: 9991161Abstract: A method for filling a through hole (TH) located on a substrate is provided. The TH is a continuous channel having an upper rim, a lower rim and an interior surface. In one embodiment, the method comprises steps (a)-(d). In the step (a), a conductive material (CM) is deposited over the substrate to thereby deposit a layer of the CM around the rims and on the interior surface. In the step (b), the deposited CM is etched. In particular, the etching step selectively removes more CM deposited at the rims relative to CM deposited at a mid-section of the interior surface of the channel. In the step (c), the steps (a) and (b) are optionally repeated until the channel is sealed at the mid-section by a bridge formed of CM. In the step (d), the CM is further deposited over the substrate to thereby completely fill the TH.Type: GrantFiled: March 7, 2017Date of Patent: June 5, 2018Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Yaofeng Sun, Sha Xu, Shu Kin Yau
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Publication number: 20170336350Abstract: The presently claimed invention provides an electrochemical analytical apparatus for electrochemical bath analysis. The apparatus comprise a static electrode and a rotatable unit. As steady liquid flow can be generated on the electrolytic surface of the static electrode by the rotatable unit through rotation, the static disk electrode does not involve any movement during the bath analysis such that the design of the electrical contact in the electrode can be substantially simplified.Type: ApplicationFiled: May 23, 2016Publication date: November 23, 2017Inventors: Yaofeng SUN, Sha XU
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Publication number: 20170183791Abstract: The presently claimed invention provides a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive of the present invention enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.Type: ApplicationFiled: December 29, 2015Publication date: June 29, 2017Inventors: Yaofeng SUN, Minjie XU, Shun Yee LAO, Shu Kin YAU
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Patent number: 9617653Abstract: The presently claimed invention provides an electrochemical analytical apparatus and a method for evaluating performance of electroplating formulations of electrolyte solutions used for via filling. The electrochemical analytical apparatus comprises an electric power generating device, an electrical output signal measurement device, an electrochemical measurement device, and a motion generator. The electrochemical measurement device of the present invention comprises a supporting structure, a cavity, a cavity electrode, and a surface electrode. The electrical output signals of the cavity electrode and the surface electrode are measured during electroplating for calculating a filling performance value. The presently claimed invention provides an accurate, fast and cost effective method for evaluating performance of electroplating formulations, following with choosing the electroplating formulation of the highest FP value for actual microvia filling process.Type: GrantFiled: December 12, 2013Date of Patent: April 11, 2017Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Yaofeng Sun, Minghui Gao, Shu Kin Yau, Min Gao
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Patent number: 9575032Abstract: The presently claimed invention provides an accurate, fast, and cost effective method for determining the additive concentrations of at least two inhibitors simultaneously in an electroplating bath by using different electrical load conditions. The method of the present invention is able to determine additive concentrations of different inhibitors effectively during on-line feedback control for adjusting the amount of additives in the electroplating bath to maintain the additive concentrations within pre-defined limits during device production.Type: GrantFiled: August 7, 2014Date of Patent: February 21, 2017Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Yaofeng Sun, Minghui Gao, Hai Xia
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Patent number: 9273407Abstract: This invention relates to a new compound represented by formula (I). Particularly, the new compound is used as an additive in copper electroplating. A chemical structure for the leveler, an electroplating bath containing the same, a method of preparing the additive and a method of electroplating a substrate with the electroplating bath containing the additive are disclosed. The additive compound/molecule of the present invention provides a branched structure at each ends, wherein each of the branches comprises a positively charged nitrogen moiety. The additive compound/molecule is formed by linking the branches having the positive charged nitrogen moieties to the backbone of the additive compound/molecule. This leads to a high charge density novel additive compound/molecule.Type: GrantFiled: March 17, 2014Date of Patent: March 1, 2016Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Jiye Luo, Yaofeng Sun, Shu Kin Yau
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Publication number: 20160041125Abstract: The presently claimed invention provides an accurate, fast, and cost effective method for determining the additive concentrations of at least two inhibitors simultaneously in an electroplating bath by using different electrical load conditions. The method of the present invention is able to determine additive concentrations of different inhibitors effectively during on-line feedback control for adjusting the amount of additives in the electroplating bath to maintain the additive concentrations within pre-defined limits during device production.Type: ApplicationFiled: August 7, 2014Publication date: February 11, 2016Inventors: Yaofeng SUN, Minghui GAO, Hai XIA
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Publication number: 20150259814Abstract: This invention relates to a new compound represented by formula (I). Particularly, the new compound is used as an additive in copper electroplating. A chemical structure for the leveler, an electroplating bath containing the same, a method of preparing the additive and a method of electroplating a substrate with the electroplating bath containing the additive are disclosed. The additive compound/molecule of the present invention provides a branched structure at each ends, wherein each of the branches comprises a positively charged nitrogen moiety. The additive compound/molecule is formed by linking the branches having the positive charged nitrogen moieties to the backbone of the additive compound/molecule. This leads to a high charge density novel additive compound/molecule.Type: ApplicationFiled: March 17, 2014Publication date: September 17, 2015Applicant: Hong Kong Applied Science and Technology Research Institute Co., Ltd.Inventors: JIYE LUO, YAOFENG SUN, SHU KIN YAU
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Patent number: 9075941Abstract: The presently claimed invention provides a method for optimizing an electrodeposition process of a plurality of vias in a wafer. Instead of simulating a large number of via on the wafer for via filling, a representative via is selected with the maximum value of critical factor, which is a function of process parameters. The filling of the representative via is simulated with different sampling points to find out the filling goodness in order to find out the optimized process windows of process parameters. An optimizer is also disclosed, which either provides sampling points or reduces sampling points under artificial neural network method. Calculation of filling goodness is used for evaluating via filling quality and further comparing among via fillings simulated at different sampling points. Consequently, the method of present invention is able to shorten the simulation time for via filling as well as provide a process window with high accuracy.Type: GrantFiled: May 14, 2013Date of Patent: July 7, 2015Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Yaofeng Sun, Bin Xie, Xunqing Shi, Ou Dong
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Patent number: D1018759Type: GrantFiled: September 18, 2020Date of Patent: March 19, 2024Assignee: Huanic CorporationInventors: Jianhua Sun, Yaofeng Zhao