Abstract: This disclosure discloses implementations for high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator, a second radiator, a first substrate, a second substrate, a first metal piece, and a first feeding path. The first radiator and the first feeding path are disposed on the first substrate, the second radiator is disposed on the second substrate, the first feeding path is configured to feed the first radiator, and the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.

Abstract: This disclosure discloses high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.

Abstract: Embodiment high-frequency radiator includes two plus and minus 45-degree single-polarized radiators. The single-polarized radiator includes a radiation arm, a balun, a feeder circuit, a filter, and a ground plane. The radiation arm and the balun are electrically connected. The feeder circuit and the balun are separately disposed on two surfaces of a first dielectric plate that is placed vertically. The ground plane is disposed on a downward surface of a second dielectric plate that is placed horizontally. The first dielectric plate is vertically disposed on the second dielectric plate, and the filter includes a capacitor branch and an inductor branch. The inductor branch is disposed on a same surface of the first dielectric plate as the balun, the inductor branch is separately electrically connected to the balun and the ground plane, and the capacitor branch is coupled to the ground plane.

Abstract: Embodiment high-frequency radiator includes two plus and minus 45-degree single-polarized radiators. The single-polarized radiator includes a radiation arm, a balun, a feeder circuit, a filter, and a ground plane. The radiation arm and the balun are electrically connected. The feeder circuit and the balun are separately disposed on two surfaces of a first dielectric plate that is placed vertically. The ground plane is disposed on a downward surface of a second dielectric plate that is placed horizontally. The first dielectric plate is vertically disposed on the second dielectric plate, and the filter includes a capacitor branch and an inductor branch. The inductor branch is disposed on a same surface of the first dielectric plate as the balun, the inductor branch is separately electrically connected to the balun and the ground plane, and the capacitor branch is coupled to the ground plane.

Abstract: A dielectric lens, where the dielectric lens is a cylindrical lens or an ellipsoidal lens whose cross-sectional profile is a quasi-ellipse, and the dielectric lens is formed by piling a plurality of units. Dielectric constant distribution of the units in the dielectric lens enables a non-plane wave in a minor axis direction of the quasi-ellipse to be converted into a plane wave through the dielectric lens. The units of the dielectric lens are prepared through extrusion, injection, molding, computer numerical control (CNC) machining, or a three dimensional (3D) printing process technology, and the units may be assembled through gluing, welding, structural clamping, or a coupling printed through 3D printing. When the dielectric lens is applied to a multi-beam antenna, a system capacity of a communications system can be increased. In addition, a thickness of the lens is reduced using the multi-beam antenna.

Abstract: This disclosure discloses high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.

Abstract: A dielectric lens, where the dielectric lens is a cylindrical lens or an ellipsoidal lens whose cross-sectional profile is a quasi-ellipse, and the dielectric lens is formed by piling a plurality of units. Dielectric constant distribution of the units in the dielectric lens enables a non-plane wave in a minor axis direction of the quasi-ellipse to be converted into a plane wave through the dielectric lens. The units of the dielectric lens are prepared through extrusion, injection, molding, computer numerical control (CNC) machining, or a three dimensional (3D) printing process technology, and the units may be assembled through gluing, welding, structural clamping, or a coupling printed through 3D printing. When the dielectric lens is applied to a multi-beam antenna, a system capacity of a communications system can be increased. In addition, a thickness of the lens is reduced using the multi-beam antenna.