Patents by Inventor Yasuaki Matsunaga
Yasuaki Matsunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200377833Abstract: A cell picking device includes a sucker having a pipette tip attached to a tip portion of the sucker and is used to suck the cell from a tip of the pipette tip, a driver configured to cause the sucker to perform a suction operation and move the sucker in a horizontal-plane direction and an axial direction of the pipette tip with the sucker inclined with respect to a vertical direction. A controller moves the sucker such that the tip of the pipette tip moves in a horizontal direction while being in contact with a bottom surface of the container installed on the sample mounting stage in a predetermined position on the sample mounting stage to desorb a cell arranged in the predetermined position from the bottom surface of the container, and suck the cell desorbed from the bottom surface of the container from the tip of the pipette tip.Type: ApplicationFiled: March 16, 2018Publication date: December 3, 2020Inventors: Takashi INOUE, Kenji TAKAKURA, Yoshitaka NODA, Yasuaki MATSUNAGA, Mika OKADA, Akari TAKEDA
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Patent number: 9926926Abstract: A high-pressure pump is comprised of a lower housing, an upper housing and a cover, which are formed independently from each other. Thereby, shapes of the above can be simplified. Although the cylinder and the plunger receive a fuel pressure during a pressurization stroke, the upper housing and the cover do not receive fuel pressure directly from a pressurization chamber. Therefore, the upper housing and the cover can be made thin and light as much as possible.Type: GrantFiled: January 6, 2016Date of Patent: March 27, 2018Assignee: DENSO CORPORATIONInventors: Masatoshi Kuroyanagi, Mamoru Urushizaki, Yasuaki Matsunaga, Shinobu Oikawa, Noriya Matsumoto
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Patent number: 9840995Abstract: During a pressurization stroke of a high-pressure pump, a cylinder inner wall and a plunger receive a fuel pressure from the pressurization chamber. Meanwhile, an upper housing does not receive the fuel pressure from the pressurization chamber, so that its thickness can be made thin. A cylinder is comprised of a bottom portion, a cylindrical portion and a large-diameter cylindrical portion. When inserting the large-diameter cylindrical portion into a large engaging hole, the bottom portion and the cylindrical portion are not brought into contact with a lower housing. A high liquid-tightness between the bottom portion, the cylindrical portion and a small engaging hole can be ensured.Type: GrantFiled: January 30, 2015Date of Patent: December 12, 2017Assignee: DENSO CORPORATIONInventors: Masatoshi Kuroyanagi, Mamoru Urushizaki, Yasuaki Matsunaga
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Patent number: 9726128Abstract: During a pressurization stroke of a high-pressure pump, a cylinder inner wall and a plunger receive a fuel pressure from the pressurization chamber. Meanwhile, an upper housing does not receive the fuel pressure from the pressurization chamber, so that its thickness can be made thin. A cylinder is comprised of a bottom portion, a cylindrical portion and a large-diameter cylindrical portion. When inserting the large-diameter cylindrical portion into a large engaging hole, the bottom portion and the cylindrical portion are not brought into contact with a lower housing. A high liquid-tightness between the bottom portion, the cylindrical portion and a small engaging hole can be ensured.Type: GrantFiled: March 29, 2012Date of Patent: August 8, 2017Assignee: DENSO CORPORATIONInventors: Masatoshi Kuroyanagi, Mamoru Urushizaki, Yasuaki Matsunaga
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Publication number: 20160115953Abstract: A high-pressure pump is comprised of a lower housing, an upper housing and a cover, which are formed independently from each other. Thereby, shapes of the above can be simplified. Although the cylinder and the plunger receive a fuel pressure during a pressurization stroke, the upper housing and the cover do not receive fuel pressure directly from a pressurization chamber. Therefore, the upper housing and the cover can be made thin and light as much as possible.Type: ApplicationFiled: January 6, 2016Publication date: April 28, 2016Inventors: Masatoshi Kuroyanagi, Mamoru Urushizaki, Yasuaki Matsunaga, Shinobu Oikawa, Noriya Matsumoto
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Patent number: 9261061Abstract: A high-pressure pump is comprised of a lower housing, an upper housing and a cover, which are formed independently from each other. Thereby, shapes of the above can be simplified. Although the cylinder and the plunger receive a fuel pressure during a pressurization stroke, the upper housing and the cover do not receive fuel pressure directly from a pressurization chamber. Therefore, the upper housing and the cover can be made thin and light as much as possible.Type: GrantFiled: March 29, 2012Date of Patent: February 16, 2016Assignee: DENSO CORPORATIONInventors: Masatoshi Kuroyanagi, Mamoru Urushizaki, Yasuaki Matsunaga, Shinobu Oikawa, Noriya Matsumoto
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Publication number: 20150139825Abstract: During a pressurization stroke of a high-pressure pump, a cylinder inner wall and a plunger receive a fuel pressure from the pressurization chamber. Meanwhile, an upper housing does not receive the fuel pressure from the pressurization chamber, so that its thickness can be made thin. A cylinder is comprised of a bottom portion, a cylindrical portion and a large-diameter cylindrical portion. When inserting the large-diameter cylindrical portion into a large engaging hole, the bottom portion and the cylindrical portion are not brought into contact with a lower housing. A high liquid-tightness between the bottom portion, the cylindrical portion and a small engaging hole can be ensured.Type: ApplicationFiled: January 30, 2015Publication date: May 21, 2015Inventors: Masatoshi Kuroyanagi, Mamoru Urushizaki, Yasuaki Matsunaga
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Publication number: 20120247591Abstract: A high-pressure pump is comprised of a lower housing, an upper housing and a cover, which are formed independently from each other. Thereby, shapes of the above can be simplified. Although the cylinder and the plunger receive a fuel pressure during a pressurization stroke, the upper housing and the cover do not receive fuel pressure directly from a pressurization chamber. Therefore, the upper housing and the cover can be made thin and light as much as possible.Type: ApplicationFiled: March 29, 2012Publication date: October 4, 2012Applicant: DENSO CORPORATIONInventors: Masatoshi KUROYANAGI, Mamoru Urushizaki, Yasuaki Matsunaga, Shinobu Oikawa, Noriya Matsumoto
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Publication number: 20120251363Abstract: During a pressurization stroke of a high-pressure pump, a cylinder inner wall and a plunger receive a fuel pressure from the pressurization chamber. Meanwhile, an upper housing does not receive the fuel pressure from the pressurization chamber, so that its thickness can be made thin. A cylinder is comprised of a bottom portion, a cylindrical portion and a large-diameter cylindrical portion. When inserting the large-diameter cylindrical portion into a large engaging hole, the bottom portion and the cylindrical portion are not brought into contact with a lower housing. A high liquid-tightness between the bottom portion, the cylindrical portion and a small engaging hole can be ensured.Type: ApplicationFiled: March 29, 2012Publication date: October 4, 2012Applicant: DENSO CORPORATIONInventors: Masatoshi KUROYANAGI, Mamoru Urushizaki, Yasuaki Matsunaga
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Patent number: 6330166Abstract: In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively.Type: GrantFiled: September 20, 1999Date of Patent: December 11, 2001Assignee: Denso CorporationInventors: Masayuki Aoyama, Yasuaki Matsunaga, Tomoyuki Hiramatsu, Naoyuki Akita, Koji Kondo