Abstract: Provided is an active energy ray-curable aqueous ink which contains water and a curable substance and curable by an active energy ray. The curable substance contains a bifunctional polymerizable monomer represented by the following General Formula (1): wherein, R1 is a hydrogen atom or a methyl group, R2 is a divalent saturated hydrocarbon group having 1 to 5 carbon atoms and L is a divalent saturated hydrocarbon group which may contain an ether bond, an amide bond, a carbonyl bond, a sulfone bond or a sulfonamide bond.

Abstract: The active energy ray-curable liquid composition according to the present disclosure is an active energy ray-curable liquid composition that contains water and a curable substance and is curable with an active energy ray, in which the curable substance contains a monofunctional polymerizable monomer having a structure represented by the Formula (1); in Formula (1), R1 represents a hydrogen atom or a saturated hydrocarbon group, R2 represents a saturated hydrocarbon group that has at least one of a hydroxyl group or an amide bond and may contain a heteroatom, R3 represents a hydrogen atom or a methyl group, R1 and R2 may be bonded together to form an aliphatic heterocycle together with a nitrogen atom substituted with R1 and R2 in a case where R1 represents a saturated hydrocarbon group, and a total number of carbon atoms of the saturated hydrocarbon groups represented by R1 and R2 is 5 or more.

Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.

Abstract: In a structure such as a liquid ejecting head configured to cover an opening of a base with a covering member, the present invention alleviates the generation of a warp on the structure or the base even if the covering member is hardened and shrunk. The structure includes the base and the covering member attached onto the base. A manufacturing method for the structure includes: a first step of attaching the covering member having flexibility onto the base in such a manner as to cover an opening of the hole formed at the base and a second step of hardening the covering member attached onto the base. In the first step, the covering member is attached onto the base in a state in which a non-stuck portion of the covering member, covering the opening of the base, is slack.

Abstract: A method for producing a porous body having a first porous layer and a second porous layer on the first porous layer. The volume ratio of the first resin to the second resin in the first porous layer is 1:1 to 200:1. A heating temperature in performing a first heat treatment is higher than or equal to the softening point of the first resin. A heating temperature in performing a second heat treatment is higher than or equal to the softening point of the second resin but lower than the softening point of the first resin.

Abstract: workpiece bending method and a workpiece bending apparatus that allow setting of a trajectory of a bending implement based upon a pre-processed shape of a workpiece and an intended post-processed shape of the workpiece. The workpiece bending method bends a flange of a workpiece via a processing roller, and includes a step for obtaining a pre-processed angle of the flange before processing and a flange length of the portion of the flange to be bent; a trajectory determination step for determining a path (trajectory) of the processing roller based upon the pre-processed angle, an intended angle after processing, and the flange length; and a processing step for moving the processing roller in a prescribed direction in accordance with the path determined in the trajectory determination step and then bending the flange until the intended angle is achieved.

Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Abstract: Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10° or more is 1/100000 or less of the light intensity at a scattering angle of 0°, at a wavelength of 400 nm.

Abstract: A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.

Abstract: A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X?30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.

Abstract: A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Abstract: A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.

Abstract: A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.

Abstract: A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X?30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Abstract: Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10° or more is 1/100000 or less of the light intensity at a scattering angle of 0°, at a wavelength of 400 nm.

Abstract: A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Abstract: In a structure such as a liquid ejecting head configured to cover an opening of a base with a covering member, the present invention alleviates the generation of a warp on the structure or the base even if the covering member is hardened and shrunk. The structure includes the base and the covering member attached onto the base. A manufacturing method for the structure includes: a first step of attaching the covering member having flexibility onto the base in such a manner as to cover an opening of the hole formed at the base and a second step of hardening the covering member attached onto the base. In the first step, the covering member is attached onto the base in a state in which a non-stuck portion of the covering member, covering the opening of the base, is slack.

Abstract: A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.