Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.

Abstract: A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.

Abstract: An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon.

Abstract: In a circuit, as the bridge resistance of one side of a Wheatstone bridge circuit, a distortion gauge (fixed reference resistance) of which variation caused by environmental conditions is suppressed and a sample having a resistance component ?R varied by the environmental conditions are connected in series. A constant bridge input voltage Ei is applied from a constant-voltage power supply to the Wheatstone bridge circuit, a bridge output voltage Eo corresponding to resistance variation of the sample is input to a dynamic distortion amplifier, and a carrier wave signal of a predetermined frequency is output. A measured resistance computing unit samples peak levels of the carrier wave signal output from the dynamic distortion amplifier so as to detect the bridge output voltage Eo, and calculates the resistance of the sample based on the detected bridge output voltage.

Abstract: A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.

Abstract: In a circuit, as the bridge resistance of one side of a Wheatstone bridge circuit, a distortion gauge (fixed reference resistance) of which variation caused by environmental conditions is suppressed and a sample having a resistance component ?R varied by the environmental conditions are connected in series. A constant bridge input voltage Ei is applied from a constant-voltage power supply to the Wheatstone bridge circuit, a bridge output voltage Eo corresponding to resistance variation of the sample is input to a dynamic distortion amplifier, and a carrier wave signal of a predetermined frequency is output. A measured resistance computing unit samples peak levels of the carrier wave signal output from the dynamic distortion amplifier so as to detect the bridge output voltage Eo, and calculates the resistance of the sample based on the detected bridge output voltage.

Abstract: A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract: In an electronic circuit capable of eliminating a direct current component while suppressing deterioration of frequency characteristics in a wide frequency band, the electronic circuit includes a first capacitor, which eliminates, when the wide frequency band is divided into a low frequency band and a high frequency band, the direct current component of the low frequency band, and a plurality of second capacitors each disposed to each fine band when the high frequency band is further divided into fine bands to eliminate the direct current components of the fine bands, wherein the first capacitor and the second capacitor are connected in parallel with each other. There is also provided a method of manufacturing the electronic circuit.

Abstract: A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract: A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.

Abstract: An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.

Abstract: Apparatus for applying a coating of a slurry of a powdered solder material and a binder to the inner surface of a hollow metal cylinder. The apparatus includes solder material coating device including a coating nozzle which may be moved between a coating position within the interior of the hollow metal cylinder and a non-coating position; a guide for guiding and transporting a hollow metal cylinder towards the nozzle; means for rotating and supporting the hollow metal cylinder when the nozzle is in the coating position. The solder coated metal cylinder is used, for example, to provide an exhaust gas cleaning metal carrier in which a metal honey inner core is inserted into and soldered by the solder slurry applied to the hollow metal cylinder.

Abstract: A metal carrier and a production method thereof for carrying an exhaust gas cleaning catalyst for automobiles, autobicycles, and industrial equipment. The metal carrier includes a metal honeycomb core body pressed into a metal outer cylinder, and the joined portion of the a flat plate and a corrugated plate forming the metal honeycomb core body includes a solder material coated in spots or stripes at peaks of corrugation of the corrugated plate. The solder material in the joined portion of the flat plate and the corrugated plate has a thickness of less than 100 .mu.m, the positions of the joined portions are different between the surface and backside of the flat plate and corrugated plate, and the joined portions are present through an unjoined area having a length of more than 5% of the length of the metal honeycomb core body from an end face of the metal honeycomb core body at the exhaust gas inlet side.

Abstract: A wide thin metal sheet having a smooth surface may be manufactured directly from molten metal. A lower end of a nozzle installed vertically at the bottom of a molten metal vessel is held in contact with an inclined plate made of a refractory material, molten metal is discharged in a fan-shape from a notch formed in the peripheral wall of the nozzle end, the discharged molten metal being rendered into a constant shape laminar flow having a uniform flow rate distribution on the inclined surface as it flows down the inclined plate. The constant shape laminar flow is supplied to a molten metal pool between a pair of rollers of internally water-cooled type without any disturbance on the surface and in the inside. The metal solidified in the neighborhood of a portion of the gap between the two rollers is discharged from an open-at-the-bottom space defined between the two rollers.