Abstract: Well bias voltages are generated in accordance with a logic power supply voltage and a memory power supply voltage. The transistor included in a control circuit in a memory core is constituted of a logic transistor manufactured through the same manufacturing steps as those for the transistors of a logic formed on the same semiconductor substrate. Well bias voltages (VBB, VPP) are applied to a back gate of this logic transistor. A memory integrated with a logic on a common semiconductor substrate is provided which allows a transistor of a control circuit therein to be manufactured through the same manufacturing process as that of the logic and allows reduction of current consumption.

Abstract: A plurality of pump modules are provided, the number of pump modules to be activated is changed depending on a mode of operation, and the number of pump modules to be activated is also adjusted with the specification of interest taken into consideration. There can be provided an internal voltage generation circuit occupying a small area and readily capable of accommodating a change in specification.

Abstract: A semiconductor integrated circuit device includes a reference voltage generating circuit that can be tuned without a circuit replacement when a process condition is varied. The reference voltage generating circuit is constituted such that two different circuit configurations having different temperature properties are switched by a first switch. In each of the circuit configurations, a switch control circuit in which tuning can be performed by switching a second switch generates a control signal based on a test mode and supplies the signal to the first switch for tuning. Thereafter, a fuse in the switch control circuit is blown off to generate a control signal, and reference voltage Vref is output.

Abstract: A semiconductor device includes a constant voltage generation circuit generating a constant voltage commonly to reference voltages corresponding to a plurality of internal voltages. The plurality of reference voltages are generated from the common constant voltage. Thus, the semiconductor device for generating internal voltages is implemented, which allows reduction in layout area and decrease in test time for voltage adjustment.

Abstract: In an eDRAM, there are provided a VDC that down-converts an external power supply potential to generate an internal power supply potential for a sense amplifier band, and a VDC that down-converts the external power supply potential to generate an internal power supply potential for a column decoder. The response of the VDC is improved by increasing the through current of the VDC only during the period of time corresponding to an amplify operation of the sense amplifier. Therefore, current consumption is smaller than the conventional case where the through current of the VDC is set at a high constant level.

Abstract: In a control voltage generating section for supplying a control voltage to a gate of a charge transfer gate for transferring charges received from a capacitor to an output node to generate an internal voltage, the amplitude of the control voltage is switched in accordance with a switch signal. An internal voltage generating circuit making it possible to improve design efficiency, reliability and yield and reduce power consumption is provided.

Abstract: A capacitor (C12) is connected between a node (L) in a double boost part and the ground, and the amplitude of a repetitive pulse from the node (L) is made less than twice that of the power-supply voltage through utilization of charge and discharge of the capacitor (C12).

Abstract: In an eDRAM, there are provided a VDC that down-converts an external power supply potential to generate an internal power supply potential for a sense amplifier band, and a VDC that down-converts the external power supply potential to generate an internal power supply potential for a column decoder. The response of the VDC is improved by increasing the through current of the VDC only during the period of time corresponding to an amplify operation of the sense amplifier. Therefore, current consumption is smaller than the conventional case where the through current of the VDC is set at a high constant level.

Abstract: An equalizing circuit includes a plurality of N-channel MOS transistors for respectively setting a data line to a predetermined precharge voltage. The H-level voltage Vddb of a control signal for turning on these N-channel MOS transistors is set to a range higher than the sum of the precharge voltage and a transistor threshold voltage. A Vddb generation circuit steps up an external power-supply voltage and sets a voltage Vddb in a range lower than a step-up voltage for activating a word line.

Abstract: In a detector included in a VPP generating circuit in a DRAM, an external power supply potential is applied to the gate of an N-channel MOS transistor for regulating a through current of an inverter for outputting an inversion signal of an output signal of a comparator. Since a drain-source voltage of the N-channel MOS transistor can be set to be lower than a threshold voltage Vthn of the N-channel MOS transistor, an operation margin of the detector under conditions of a low voltage and a low temperature is made wider as compared with a conventional technique.

Abstract: An equalizing circuit includes a plurality of N-channel MOS transistors for respectively setting a data line to a predetermined precharge voltage. The H-level voltage Vddb of a control signal for turning on these N-channel MOS transistors is set to a range higher than the sum of the precharge voltage and a transistor threshold voltage. A Vddb generation circuit steps up an external power-supply voltage and sets a voltage Vddb in a range lower than a step-up voltage for activating a word line.

Abstract: The clock generating circuit includes: an oscillator generating a reference clock signal; an EX-OR gate connected in a ring configuration; and first and second D latch circuits. The EX-OR gate inverts a clock signal to provide the inverted clock signal to the first D latch circuit when an activating signal is at H level. In this case, the clock signal is a clock signal having a clock cycle period of twice that of the reference clock signal. The EX-OR gate provides the clock signal direct to the first D latch circuit when the activating signal is set to L level. In this case, level transition of the clock signal is ceased. Hence, generation of a glitch in the clock signal is prevented from occurring.

Abstract: In a control voltage generating section for supplying a control voltage to a gate of a charge transfer gate for transferring charges received from a capacitor to an output node to generate an internal voltage, the amplitude of the control voltage is switched in accordance with a switch signal. An internal voltage generating circuit making it possible to improve design efficiency, reliability and yield and reduce power consumption is provided.

Abstract: Oscillation outputs which are different between detector signals output in a first detector circuit and a second detector circuit are obtained from a first ring oscillator and a second ring oscillator respectively corresponding to the detector circuits, and a selector selects and outputs one of the oscillation outputs. Accordingly, it is sufficient to provide only one pump circuit.

Abstract: A voltage level converter circuit includes a first node, a second node having a voltage according to an input voltage, a P channel MOS transistor connected between the second node and the first node, turned on when the input voltage attains an L level, a third node to which a first voltage is supplied, a first N channel MOS transistor connected between the third node and a fourth node, turned on when the input voltage attains an H level, a second N channel MOS transistor connected between the first node and the fourth node, and having a gate to which an alleviate signal is supplied, a third N channel MOS transistor, and a level determination circuit for providing an alleviate signal according to the level of the first voltage.

Abstract: A voltage level converter circuit includes a first node, a second node having a voltage according to an input voltage, a P channel MOS transistor connected between the second node and the first node, turned on when the input voltage attains an L level, a third node to which a first voltage is supplied, a first N channel MOS transistor connected between the third node and a fourth node, turned on when the input voltage attains an H level, a second N channel MOS transistor connected between the first node and the fourth node, and having a gate to which an alleviate signal is supplied, a third N channel MOS transistor, and a level determination circuit for providing an alleviate signal according to the level of the first voltage.

Abstract: With power-on detection circuits provided for a plurality of power supply voltages, a main power-on detection signal is maintained at the active state to reset an internal node while at least one of the power-on detection signals is active. In a multi-power semiconductor integrated circuit device, current consumption at the time of power-up is reduced.

Abstract: A semiconductor device includes a constant voltage generation circuit generating a constant voltage commonly to reference voltages corresponding to a plurality of internal voltages. The plurality of reference voltages are generated from the common constant voltage. Thus, the semiconductor device for generating internal voltages is implemented, which allows reduction in layout area and decrease in test time for voltage adjustment.

Abstract: A plurality of pump modules are provided, the number of pump modules to be activated is changed depending on a mode of operation, and the number of pump modules to be activated is also adjusted with the specification of interest taken into consideration. There can be provided an internal voltage generation circuit occupying a small area and readily capable of accommodating a change in specification.

Abstract: In a VDC circuit, a differential amplifier compares a first reference potential with an internal supply potential to generate a control signal according to a result of the comparison. A constant current source transistor receives at its gate a second reference potential supplied through a path different from that of the first reference potential to operate for controlling an operation current value of the differential amplifier. A drive transistor changes conductance between a node for outputting the internal supply potential and a supply potential according to the control signal.