Abstract: An ultrasonic transducer includes first and second acoustic transducers and a housing with a bottomed tubular shape. The second acoustic transducer includes an annular section supporting a second membrane section and contacting an entire periphery of the second membrane section, and an acoustic matching plate facing the second membrane section and spaced apart from the second membrane section. The acoustic matching plate is connected to a surrounding wall portion defining a sealed space with the housing. An ultrasonic transmission path sandwiched between the first membrane section and the second membrane section is provided in the sealed space. A maximum inner width of the ultrasonic transmission path is smaller than a maximum inner width of the surrounding wall portion.

Abstract: A piezoelectric element that includes a substrate, a lower electrode layer on the substrate, an intermediate layer on the lower electrode layer, and an upper electrode layer on the intermediate layer. The intermediate layer includes a first piezoelectric layer including an aluminum nitride as a main component thereof and located between the lower electrode layer and the upper electrode layer, a first buffer layer including an aluminum nitride as a main component and located between the first piezoelectric layer and the upper electrode layer, a first intermediate electrode layer located between the first buffer layer and the upper electrode layer, and a second piezoelectric layer located between the first intermediate electrode layer and the upper electrode layer.

Abstract: A gallium nitride structure that includes: a substrate; a gallium nitride layer opposed to the substrate and containing gallium nitride as a main component thereof; and a first electrode between the gallium nitride layer and the substrate. The first electrode includes at least one hafnium layer containing a single metal of hafnium as a main component thereof, and the at least one hafnium layer is in contact with the gallium nitride layer.

Abstract: A piezoelectric film that includes crystalline AlN; at least one first element partially replacing Al in the crystalline AlN; and a second element doping the crystalline AlN and which has an ionic radius smaller than that of the first element and larger than that of Al.

Abstract: A method of manufacturing a dielectric device includes epitaxially growing a metal film on a substrate, forming a dielectric film on the metal film such that the dielectric film has a preferentially oriented structure, forming a first electrode film having a non-oriented or amorphous structure on the dielectric film, removing the substrate and the metal film from the dielectric film or removing the substrate from the metal film, and forming a second electrode film having a non-oriented or amorphous structure on the dielectric film or the metal film.

Abstract: A method for manufacturing a resonator that effectively addresses variations in resistivity for each wafer. The method for manufacturing a resonator includes forming a Si oxide film on a surface of a degenerated Si wafer, where the Si oxide film has a thickness set that is based on the doping amount of impurity in the degenerated Si wafer.

Abstract: A piezoelectric element that includes a substrate, a lower electrode layer on the substrate, an intermediate layer on the lower electrode layer, and an upper electrode layer on the intermediate layer. The intermediate layer includes a first piezoelectric layer including an aluminum nitride as a main component thereof and located between the lower electrode layer and the upper electrode layer, a first buffer layer including an aluminum nitride as a main component and located between the first piezoelectric layer and the upper electrode layer, a first intermediate electrode layer located between the first buffer layer and the upper electrode layer, and a second piezoelectric layer located between the first intermediate electrode layer and the upper electrode layer.

Abstract: A gallium nitride structure that includes: a substrate; a gallium nitride layer opposed to the substrate and containing gallium nitride as a main component thereof; and a first electrode between the gallium nitride layer and the substrate. The first electrode includes at least one hafnium layer containing a single metal of hafnium as a main component thereof, and the at least one hafnium layer is in contact with the gallium nitride layer.

Abstract: A dielectric device has a first electrode film having a non-oriented or amorphous structure, a dielectric film provided on the first electrode film and having a preferentially oriented structure, and a second electrode film provided on the dielectric film and having a non-oriented or amorphous structure.

Abstract: A piezoelectric film that includes crystalline AlN; at least one first element partially replacing Al in the crystalline AlN; and a second element doping the crystalline AlN and which has an ionic radius smaller than that of the first element and larger than that of Al.

Abstract: A method for manufacturing a resonator that effectively addresses variations in resistivity for each wafer. The method for manufacturing a resonator includes forming a Si oxide film on a surface of a degenerated Si wafer, where the Si oxide film has a thickness set that is based on the doping amount of impurity in the degenerated Si wafer.

Abstract: A piezoelectric device is provided with a piezoelectric element including a piezoelectric layer exhibiting a polarizability ? smaller than 1×10?9 (C/(V·m)) in the case where an electric field is applied until polarization is saturated and a circuit having a means to set a minimum value of a drive electric field to become larger than a positive coercive electric field of the above-described piezoelectric layer and a means to set a maximum value of the above-described drive electric field to become smaller than (Pm?(maximum value of polarization)?Pr?(quasi-remanent polarization))/(1×10?9) and, therefore, an object is to drive the piezoelectric element in an electric field range in which maximum piezoelectric characteristics are obtained, improve the characteristics of the piezoelectric device, and enhance the reliability.

Abstract: A thin film piezoelectric element according to the present invention includes a potassium sodium niobate thin film having a structure in which a plurality of crystal grains are present in a film thickness direction; and a pair of electrode films sandwiching the potassium sodium niobate thin film. When the potassium sodium niobate thin film is divided into three regions of the same thickness in the film thickness direction and average crystal grain sizes A1, A2, and A3 of the respective regions are determined, a ratio m/M of the smallest average crystal grain size m among A1, A2, and A3 to the largest average crystal grain size M among A1, A2, and A3 is 10% to 80%. The region having the smallest average crystal grain size m lies next to one of the pair of electrode films.

Abstract: There are provided a thin-film piezoelectric element including a piezoelectric thin film which has an alkali niobate-based perovskite structure represented by the composition formula (K1-w-xNawSrx)m(Nb1-yZry)O3 and which is preferentially oriented to (001), and a pair of electrode films that sandwich the piezoelectric thin film, a thin-film piezoelectric actuator, and a thin-film piezoelectric sensor each including the thin-film piezoelectric element.

Abstract: An object is to reduce the leakage current of a piezoelectric element including a potassium-sodium niobate thin film, enhance the reliability of the piezoelectric element and, in addition, enhance the withstand voltage by including a pair of electrodes and a piezoelectric layer sandwiched between the above-described pair of electrode layers, wherein the above-described piezoelectric layer is provided with at least one layer each of first piezoelectric layer which is a potassium-sodium niobate thin film substantially not containing Mn (manganese) and second piezoelectric layer which is a potassium-sodium niobate thin film containing Mn.

Abstract: A piezoelectric device according to the present invention is provided with a pair of electrode films, a piezoelectric film sandwiched in between the pair of electrode films, and a stress control film which is in direct contact with a surface of at least one of the pair of electrode films, on the side where the electrode film is not in contact with the piezoelectric film, and which has a linear expansion coefficient larger than those of the relevant electrode film and the piezoelectric film.

Abstract: A piezoelectric element includes, as a piezoelectric layer, a thin film of potassium sodium niobate that is a perovskite compound represented by a general expression ABO3, in which Sr (strontium) is substituted on both of an A site and a B site and Mn (manganese) is substituted only on the A site. Accordingly, the piezoelectric element is provided to decrease a leak current of the piezoelectric element using the thin film of potassium sodium niobate, to increase a withstand voltage thereof and to improve piezoelectric characteristics thereof.

Abstract: A piezoelectric device is provided with a piezoelectric element including a piezoelectric layer exhibiting a polarizability ? smaller than 1×10?9 (C/(V·m)) in the case where an electric field is applied until polarization is saturated and a circuit having a means to set a minimum value of a drive electric field to become larger than a positive coercive electric field of the above-described piezoelectric layer and a means to set a maximum value of the above-described drive electric field to become smaller than (Pm? (maximum value of polarization)?Pr? (quasi-remanent polarization))/(1×10?9) and, therefore, an object is to drive the piezoelectric element in an electric field range in which maximum piezoelectric characteristics are obtained, improve the characteristics of the piezoelectric device, and enhance the reliability.

Abstract: A piezoelectric element includes, as a piezoelectric layer, a thin film of potassium sodium niobate that is a perovskite compound represented by a general expression ABO3, in which Ta (tantalum) is substituted on both of an A site and a B site. Accordingly, the piezoelectric element is provided to increase a reliability of the piezoelectric element using the thin film of potassium sodium niobate and to improve piezoelectric characteristics thereof.

Abstract: A thin film piezoelectric device according to the present invention includes a pair of electrode layers and a piezoelectric thin film interposed between the pair of electrode layers, wherein the piezoelectric thin film contains a rare gas element and has a content gradient of the rare gas element in the thickness direction of the piezoelectric thin film.