Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract: A socket for a pin grid-array package includes a base housing having terminals arranged in the same grid pattern as the lead pins of the pin grid-array package and a cover mounted on the base housing for slidable movement relative to the base housing. The cover has through holes therein for receiving the lead pins of the pin grid-array package therethrough. The cover is movable relative to the base housing between a first, pin-insertion position and a second, contact-engagement position. The cover and the base housing may include both metal and plastic components.

Abstract: An electrical connector with enhanced grounding characteristics which reduce the possibility of signal transmission error includes a connector housing formed from an electrically insulative material, a plurality of conductive terminals mounted on the connector housing, the terminals having tail portions which extend out of and away from the connector housing for attachment to a printed circuit board. A conductive grounding plate, in the form of a metal shield, is mounted to the exterior of the connector housing The grounding plate incudes at least one grounding terminal integrally formed therewith at extending outwardly therefrom at the level of the connector conductive terminals in a space between two adjoining conductive terminals.

Abstract: An electrical connector assembly for first and second pivotally mounted circuit members includes a dielectric housing portion for each member, each portion having a plurality of terminal receiving cavities formed therein, with first and second sets of terminals mounted therein. The housing portions are joined together for pivoting about an axis of rotation. Each terminal of each housing portion has a mating contact surface centrally located with respect to the axis of rotation. A compressive bias force is applied between mating terminal pairs which extends along the axis of rotation.