Abstract: Provided is a breeding apparatus that can facilitate disposition and collection of a spawning bed. A breeding apparatus includes a breeding area forming member that forms breeding areas for organisms and is open at least at the bottoms of the breeding areas, and a spawning bed sheet that forms the bottom surfaces of the breeding areas, has a belt shape, and is provided so as to be movable in a longitudinal direction of the belt shape relative to the breeding area forming member.

Abstract: According to one embodiment, a semiconductor device includes first and second electrodes, first to third semiconductor regions, a conductive body, and a gate electrode. The first semiconductor region is located on the first electrode and electrically connected with the first electrode. The second semiconductor region is located on the first semiconductor region. The third semiconductor region is located on a portion of the second semiconductor region. The conductive body is located in the first semiconductor region with an insulating part interposed. A lower surface of the conductive body includes first and second surfaces. The gate electrode is located in the insulating part. The gate electrode faces the second semiconductor region via a gate insulating layer. The second electrode is located on the second and third semiconductor regions. The second electrode is electrically connected with the second and third semiconductor regions.

Abstract: A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, first, second, and third semiconductor regions, an insulating portion, a conductive portion, a gate electrode, and a second electrode. The first semiconductor region is provided on the first electrode and electrically connected to the first electrode. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The insulating portion are arranged with a portion of the first semiconductor region, and the second and third semiconductor regions. The conductive portion is provided inside the insulating portion and arranged with the first semiconductor region. The gate electrode is provided inside the insulating portion and arranged with the second semiconductor region. The second electrode is provided on the third semiconductor region and electrically connected to the third semiconductor region.

Abstract: An electrode orientation checking apparatus includes a machine stand attached to a seam welding apparatus from which one roller electrode of a set has been removed, a positioning guide and a set of distance sensors that are provided on the machine stand, and a calculating section. A positioning surface of the positioning guide is fixed at a position corresponding to a portion of an outer circumferential surface of the one roller electrode before being removed, the portion lying on a line segment connecting rotational centers of the roller electrodes. The distance sensors are respectively fixed forward and backward of the positioning surface in a progression direction of the roller electrodes. The calculating section calculates data for acquiring a direction of the line segment relative to the stacked body.

Abstract: A semiconductor device includes a semiconductor part, first to third electrodes, and a control electrode. The first electrode is provided on a back surface of the semiconductor part. The second electrode is provided at a front surface side of the semiconductor part. The third electrode and the control electrode are provided inside a trench of the semiconductor part. The control electrode includes first and second control portions. The semiconductor device further includes first to third insulating films. The first insulating film is between the control electrode and the semiconductor part. The second insulating film covers the first and second control portions. The third insulating film is between the second electrode and the second insulating film. The third insulating film includes a portion extending between the first and second control portions. The third electrode is between the first electrode and the extension portion of the third insulating film.

Abstract: A joining apparatus includes a pressor that cause the first joint target portion and the second joint target portion to butt against each other, a workpiece moving organizer that moves the first workpiece and the second workpiece along an extending direction of the first joint target portion and the second target portion, a separator that temporarily separates the first joint target portion and the second joint target portion from each other by deforming a part of a butting site between the first joint target portion and the second joint target portion; and a laser irradiator that irradiates a site at which the first joint target portion and the second joint target portion separated from each other approach each other again, with laser light on a downstream side of the separator in a moving direction of the first workpiece and the second workpiece.

Abstract: A pressure sensor module detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure, and includes: a housing; a sensor element that can contact each of the reference pressure and the fluid pressure; a support member that supports the sensor element and is held in the housing; a first pressure passage that guides the fluid pressure to a first contact surface of the sensor element; and a second pressure passage that is sealed from the first pressure passage and guides the reference pressure to a second contact surface of the sensor element.

Abstract: A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, first, second, and third semiconductor regions, an insulating portion, a conductive portion, a gate electrode, and a second electrode. The first semiconductor region is provided on the first electrode and electrically connected to the first electrode. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The insulating portion are arranged with a portion of the first semiconductor region, and the second and third semiconductor regions. The conductive portion is provided inside the insulating portion and arranged with the first semiconductor region. The gate electrode is provided inside the insulating portion and arranged with the second semiconductor region. The second electrode is provided on the third semiconductor region and electrically connected to the third semiconductor region.

Abstract: Disclosed is a cylindrical electrophotographic photosensitive member having a region A along an outer surface and a region B along the outer surface. In this electrophotographic photosensitive member, the region A is located on an end side in an axial direction of the electrophotographic photosensitive member relative to the region B, the region A has a specific groove provided on the outer surface of the electrophotographic photosensitive member, an area ratio a1 of the groove is 65% to 100%, the region B has specific concave portions provided on the outer surface of the electrophotographic photosensitive member, and an area ratio a2 of the concave portion is 5% to 65%.

Abstract: A sensor includes a generator configured to generate a predetermined detection target, a detector configured to detect the detection target generated by the generator, and a substrate provided with the generator and the detector. The substrate includes a first portion provided with the generator, a second portion provided with the detector, a bent portion that is bent between the first portion and the second portion such that the generator and the detector face each other, and a ground pattern provided in a portion including the first portion, the second portion, and the bent portion. In the ground pattern, a ground pattern of the bent portion is narrower than a ground pattern of the first portion and a ground pattern of the second portion.

Abstract: A retainer gripping device, configured to grip a retainer accommodating a set of cotters inside the retainer, includes a retainer gripping unit, a retainer supporting portion, and a cotter supporting portion. The retainer gripping unit is configured to grip the retainer. The retainer supporting portion is configured such that the retainer gripped by the retainer gripping unit is placed in a state in which the set of cotters are accommodated inside the retainer. The cotter supporting portion is configured to support lower end edge portions of the cotters accommodated inside the retainer in a state in which the lower end edge portions are lifted upward higher than a lower end edge portion of the retainer.

Abstract: Disclosed is a cylindrical electrophotographic photosensitive member having a region A along an outer surface and a region B along the outer surface. In this electrophotographic photosensitive member, the region A is located on an end side in an axial direction of the electrophotographic photosensitive member relative to the region B, the region A has a specific groove provided on the outer surface of the electrophotographic photosensitive member, an area ratio a1 of the groove is 65% to 100%, the region B has specific concave portions provided on the outer surface of the electrophotographic photosensitive member, and an area ratio a2 of the concave portion is 5% to 65%.

Abstract: The present invention provides a pressure sensor module capable of improving work efficiency during assembly. The pressure sensor module detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure, and includes: a housing; a sensor element that can contact each of the reference pressure and the fluid pressure; a support member that supports the sensor element and is held in the housing; a first pressure passage that guides the fluid pressure to a first contact surface of the sensor element; and a second pressure passage that is sealed from the first pressure passage and guides the reference pressure to a second contact surface of the sensor element.

Abstract: A sensor includes a generator configured to generate a predetermined detection target, a detector configured to detect the detection target generated by the generator, and a substrate provided with the generator and the detector. The substrate includes a first portion provided with the generator, a second portion provided with the detector, a bent portion that is bent between the first portion and the second portion such that the generator and the detector face each other, and a ground pattern provided in a portion including the first portion, the second portion, and the bent portion. In the ground pattern, a ground pattern of the bent portion is narrower than a ground pattern of the first portion and a ground pattern of the second portion.

Abstract: Provided are a toothbrush module, a toothbrush attachment, a brushing assistance system, a brushing evaluation system, a brushing assistance device, and a brushing assistance program that ease obtainment of a brushing action of a user even during brushing. A toothbrush attachment (2) includes: a sensor unit (21) that detects a predetermined physical quantity; a wireless transmission unit (22) that transmits a radio signal indicating the physical quantity detected by the sensor unit (21); a housing unit (201) that houses the sensor unit (21) and the wireless transmission unit (22); and a coupling mechanism (202) that removably attaches the housing unit (201) to a toothbrush (4).

Abstract: Provided is a cylindrical electrophotographic photosensitive member, including a concave/convex portion forming region in which at least one of concave portions and convex portions are formed on a surface of the electrophotographic photosensitive member from a central portion to both end portions in an axial direction of the electrophotographic photosensitive member, wherein a maximum value Lmax and a minimum value Lmin of a distance L from the central portion to one end portion of the concave/convex portion forming region in the axial direction of the surface of the electrophotographic photosensitive member satisfy a specific relation.

Abstract: The seam welding apparatus includes a pair of rotating electrodes, an electrode supporting frame, a distance measuring means, and a controller. The electrode supporting frame supports the pair of rotating electrodes. The distance measuring means is provided on the electrode supporting frame and measures a distance to an edge of the steel plate. The controller controls the robot to adjust a running direction of the rotating electrodes so that a deviation comes into zero when a distance actually measured by the distance measuring means deviates from a predetermined distance. Thereby, it is accomplished that the seam welding apparatus is downsized as well as uninfluenced by the surface state and/or shape of workpiece (steel plate).

Abstract: An electrode orientation checking apparatus includes a machine stand attached to a seam welding apparatus from which one roller electrode of a set has been removed, a positioning guide and a set of distance sensors that are provided on the machine stand, and a calculating section. A positioning surface of the positioning guide is fixed at a position corresponding to a portion of an outer circumferential surface of the one roller electrode before being removed, the portion lying on a line segment connecting rotational centers of the roller electrodes. The distance sensors are respectively fixed forward and backward of the positioning surface in a progression direction of the roller electrodes. The calculating section calculates data for acquiring a direction of the line segment relative to the stacked body.