Abstract: An optical device includes: a light guide plate having a group of optical-path deflectors configured to change the optical path of light from a first light source to form an image in the space within a first angle range, and change the optical path of light from a second light source to form an image in the space within a second angle range, wherein the first angle range and the second angle range are separated from each other or adjoining each other.

Abstract: It is possible to estimate a slack level accurately in consideration of a shape of a deformed cable. A point cloud analysis device sets a plurality of regions of interest obtained by window-searching a wire model including a quadratic curve model representing a cable obtained from a point cloud consisting of three-dimensional points on an object, the region of interest being divided into a first region and a second region.

Abstract: A driving support device includes a braking controller configured to execute braking control, a first calculator configured to calculate a first braking control amount of the braking controller, a second calculator configured to calculate, on the basis of a setting standard, a second braking control amount of the braking control executed at an execution frequency lower than an execution frequency of the braking control based on the first braking control amount, and an updater configured to update the setting standard on the basis of a relative relationship between an estimated braking behavior based on the first braking control amount and an actual braking behavior based on the first braking control amount.

Abstract: A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.

Abstract: A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.

Abstract: A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.

Abstract: A substrate treatment apparatus includes a loader 1 for soaking a plurality of wafers W in deionized water, a back surface cleaning portion 2, a front surface cleaning portion 3, a rinsing and drying unit 4 and a plurality of transporting units 6. The back surface cleaning unit 2 cleans the back surface of the wafer W with a brush from the lower side by supplying deionized water to the wafer W that is removed from the loader 1. The front surface cleaning unit 3 cleans the upper surface of the wafer W with a brush by supplying deionized water to the wafer W cleaned by the back surface cleaning unit 2. The rinsing and drying unit 4 rinses the cleaned wafer W and then dries it.

Abstract: A positioning assembly comprises a base having a pair of taller projections and a pair of shorter projections on its surface. The positioning assembly is placed between a pair of belts which form a conveying assembly, so that the taller projections receive a sheet material which is conveyed along the belts. The positioning assembly is positioned at a middle position in which the taller projections project above the belts, whereby the taller projections receive the material. Receiving the material, the positioning assembly is elevated to a high position where all the projections including the shorter one project above the belts, whereby the material is held on the base. The material is processed with being rotated at the high position. Then the positioning assembly is lowered to a low position where all the projections are below the belts, whereby the material is delivered again onto the belts to be conveyed to the next process.