Patents by Inventor Yasuhiro Nakatani
Yasuhiro Nakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7132029Abstract: It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.Type: GrantFiled: September 14, 2005Date of Patent: November 7, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuhiro Nakatani, Hideki Higashitani, Tadashi Nakamura, Fumio Echigo
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Patent number: 7018705Abstract: It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.Type: GrantFiled: May 10, 2004Date of Patent: March 28, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuhiro Nakatani, Hideki Higashitani, Tadashi Nakamura, Fumio Echigo
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Patent number: 6994913Abstract: The present invention presents a thermoplastic elastomer that exhibits superior moisture permeability, excellent flexibility and mechanical properties at a high temperature, particularly settling resistance at a high temperature, and excellent moisture permeability. The thermoplastic elastomer includes, as a constituting unit, a polyether component (A) and a polyester component (B), wherein the polyether component (A) includes poly-oxyalkylene groups (—CnH2nO—) having a carbon/oxygen atomic ratio in a range from 2.0 to 2.5, the polyester component (B) has a number-average molecular weight in a range from 500 to 10,000, the thermoplastic elastomer has a content of polyether component (A) in a range from 50 to 95 weight %, and the thermoplastic elastomer has a glass transition temperature of not more than ?20° C.Type: GrantFiled: September 29, 2000Date of Patent: February 7, 2006Assignee: Sekisui Chemical Co., Ltd.Inventors: Akihiro Niki, Hirotake Matsumoto, Akihiko Fujiwara, Yasuhiro Nakatani, Shoji Nozato
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Publication number: 20060008628Abstract: It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.Type: ApplicationFiled: September 14, 2005Publication date: January 12, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Yasuhiro Nakatani, Hideki Higashitani, Tadashi Nakamura, Fumio Echigo
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Publication number: 20050016764Abstract: There is provided a wiring substrate for intermediate connection comprising: (1) a wiring board having a plurality of wiring layers which are connected through a via hole conductor(s) with each other; and (2) a prepreg sheet having a via hole conductor(s) at a predetermined position(s) which sheet is disposed on at least one side of the wiring board.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Fumio Echigo, Kumiko Hirayama, Yoji Ueda, Yasuhiro Nakatani
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Publication number: 20040232071Abstract: The present provides a method for preparing resin fine particles of a homogeneous particle size used in the fields of chemistry, medicine, electronic material or the like, resin fine particles, and a production apparatus for resin fine particles.Type: ApplicationFiled: May 7, 2004Publication date: November 25, 2004Inventor: Yasuhiro Nakatani
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Publication number: 20040231151Abstract: It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.Type: ApplicationFiled: May 10, 2004Publication date: November 25, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Yasuhiro Nakatani, Hideki Higashitani, Tadashi Nakamura, Fumio Echigo
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Publication number: 20040202956Abstract: This invention provides a photoreactive composition in which reaction of a hydrolyzable metal compound takes place by irradiation of light.Type: ApplicationFiled: March 10, 2004Publication date: October 14, 2004Inventors: Katsunori Takahashi, Hiroji Fukui, Kazuhiro Kawabata, Takeo Kuroda, Motokuni Ichitani, Yasuhiro Nakatani
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Patent number: 6753483Abstract: The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.Type: GrantFiled: June 12, 2001Date of Patent: June 22, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Daizo Andoh, Fumio Echigo, Tadashi Nakamura, Yasuhiro Nakatani, Yoji Ueda, Tousaku Nishiyama, Shozo Ochi
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Patent number: 6745464Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.Type: GrantFiled: March 31, 2003Date of Patent: June 8, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Fumio Echigo, Hideki Higashitani, Daizo Andoh, Noritake Fukuda, Yasuhiro Nakatani, Tadashi Nakamura
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Publication number: 20040089471Abstract: The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.Type: ApplicationFiled: October 27, 2003Publication date: May 13, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Daizo Andoh, Fumio Echigo, Tadashi Nakamura, Yasuhiro Nakatani, Yoji Ueda, Tousaku Nishiyama, Shozo Ochi
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Patent number: 6691409Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.Type: GrantFiled: October 25, 2002Date of Patent: February 17, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Satoru Tomekawa, Yasuhiro Nakatani, Yoji Ueda, Susumu Matsuoka, Daizo Andoh, Fumio Echigo
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Publication number: 20030188428Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.Type: ApplicationFiled: March 31, 2003Publication date: October 9, 2003Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Fumio Echigo, Hideki Higashitani, Daizo Andoh, Noritake Fukuda, Yasuhiro Nakatani, Tadashi Nakamura
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Patent number: 6546624Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.Type: GrantFiled: December 13, 2000Date of Patent: April 15, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Fumio Echigo, Hideki Higashitani, Daizo Andoh, Noritake Fukuda, Yasuhiro Nakatani, Tadashi Nakamura
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Publication number: 20030066683Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.Type: ApplicationFiled: October 25, 2002Publication date: April 10, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Satoru Tomekawa, Yasuhiro Nakatani, Yoji Ueda, Susumu Matsuoka, Daizo Andoh, Fumio Echigo
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Patent number: 6518514Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.Type: GrantFiled: August 13, 2001Date of Patent: February 11, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Satoru Tomekawa, Yasuhiro Nakatani, Yoji Ueda, Susumu Matsuoka, Daizo Andoh, Fumio Echigo
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Publication number: 20020038725Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.Type: ApplicationFiled: August 13, 2001Publication date: April 4, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Satoru Tomekawa, Yasuhiro Nakatani, Yoji Ueda, Susumu Matsuoka, Daizo Andoh, Fumio Echigo
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Publication number: 20020029906Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.Type: ApplicationFiled: December 13, 2000Publication date: March 14, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Fumio Echigo, Hideki Higashitani, Daizo Andoh, Noritake Fukuda, Yasuhiro Nakatani, Tadashi Nakamura
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Publication number: 20010052425Abstract: The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.Type: ApplicationFiled: June 12, 2001Publication date: December 20, 2001Applicant: Matsushita Electric Industrial Co., Ltd.,Inventors: Daizo Andoh, Fumio Echigo, Tadashi Nakamura, Yasuhiro Nakatani, Yoji Ueda, Tousaku Nishiyama, Shozo Ochi
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Patent number: 5676768Abstract: A ring-type magnetic head is of a structure in which a metallic magnetic film is sandwiched between two substrates, and the metallic magnetic film has a saturation magnetic field not less than 50 A/m in all directions parallel to a film plane thereof. Where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx greater than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not less than Tc and a second heat treatment at a temperature Ta of Tc-180.degree. C..ltoreq.Ta.ltoreq.Tc-30.degree. C. in the absence of any applied magnetic field. Where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx less than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not greater than Tx while a rotating magnetic field is being applied thereto and a second heat treatment at a temperature Ta of Tx-200.Type: GrantFiled: October 3, 1994Date of Patent: October 14, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shunsaku Muraoka, Akinaga Natsui, Yasuhiro Nakatani